KR200174035Y1 - Package sample holder for fabricating semiconductor - Google Patents
Package sample holder for fabricating semiconductor Download PDFInfo
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- KR200174035Y1 KR200174035Y1 KR2019970032342U KR19970032342U KR200174035Y1 KR 200174035 Y1 KR200174035 Y1 KR 200174035Y1 KR 2019970032342 U KR2019970032342 U KR 2019970032342U KR 19970032342 U KR19970032342 U KR 19970032342U KR 200174035 Y1 KR200174035 Y1 KR 200174035Y1
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- package
- package sample
- plate
- bottom plate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
본 고안은 진공장치내에 패키지 샘플을 장착하는 고정홀더를 형성하여 분석작업시 패키지 샘플의 착탈을 용이하게 하는 반도체 제조용 패키지 샘플 고정홀더에 관한 것으로 종래의 실리콘 웨이퍼에 패키지 샘플을 장착하는 경우 패키지 샘플을 고정하기 위한 접착제 굳힘 및 작업 완료후 테스트를 위하여 도전성 접착제를 제거하는데 소요되는 시간이 길어지며 핀과 핀사이에 잔류하는 도전성 접착제에 의한 누설전류가 발생하는 것은 물론 진공장치내에서 분석중에 실리콘 웨이퍼가 이동되는 경우가 발생하여 정확한 테스트를 실시할 수 없는 문제점이 있었던바 본 고안은 진공장치내에 고정되는 바닥판과, 상기 바닥판과 임의간격만큼 이격되어 나사고정되며 상부면에 다 수개의 장공을 형성하는 상부 지지판과, 상기 바닥판과 상부 지지판 사이에서 안내되며 이송되고 일측단에는 손잡이가 형성되고 타측단에는 스프링에 의하여 탄지되는 샘플 적재판과, 상기 샘플 적재판의 상부에 형성되어 패키지 샘플을 지지하는 동시에 상기 장공의 내측면 사이에서 이동되며 맞물려 샘플 적재판에 패키지 샘플을 고정하는 걸림턱으로 구성되어 패키지 샘플을 용이하게 설치할 수 있도록 하므로써 설치시간을 단축하고 패키지 샘플을 일정각도로 기울여 장착하여 다양한 분석이 가능하며 알루미늄 소재로 이루어져 2차 전자에 의한 빔 쌓임을 방지하는 것은 물론 누설전류를 차단하여 정확한 측정을 가능케하는 잇점이 있는 반도체 제조용 패키지 샘플 고정홀더이다.The present invention relates to a package sample holding holder for semiconductor manufacturing which makes a fixing holder for mounting a package sample in a vacuum device to facilitate the detachment of the package sample during an analysis operation. The time required to remove the conductive adhesive for the test after completion of the hardening of the adhesive and the work is completed, and the leakage current is generated by the conductive adhesive remaining between the pins and the pins. There was a problem that can not be carried out accurate test to the case where the movement occurs, the present invention is a bottom plate fixed in the vacuum apparatus, and the screw is fixed at a predetermined interval apart from the bottom plate to form a number of holes in the upper surface Between the upper support plate and the bottom plate and the upper support plate A sample loading plate which is guided and conveyed, and a handle is formed at one end and supported by a spring at the other end, and is formed on top of the sample loading plate to support a package sample and is moved between the inner side of the long hole while being engaged with the sample. It consists of a locking jaw that fixes the package sample on the loading plate, so that the package sample can be easily installed, and the installation time can be shortened and the package sample can be tilted at an angle to be mounted for various analysis. It is a package sample holder for semiconductor manufacturing that has the advantage of preventing beam accumulation and blocking leakage current to make accurate measurements.
Description
본 고안은 반도체 제조용 패키지 샘플 고정홀더에 관한 것으로 더욱 상세하게는 진공장치내에 패키지 샘플을 장착하는 고정홀더를 형성하여 분석작업시 패키지 샘플의 착탈을 용이하게 하는 반도체 제조용 패키지 샘플 고정홀더에 관한 것이다.The present invention relates to a package sample holding holder for semiconductor manufacturing, and more particularly, to a package sample holding holder for semiconductor manufacturing, which forms a fixing holder for mounting a package sample in a vacuum device to facilitate the detachment of the package sample during an analysis operation.
일반적으로 진공장치내에 패키지 샘플을 투입하여 2차전자나 2차이온을 이용하여 패키지 샘플의 표면분석, 단면분석, 물질분석 및 성분분석등 여러종류의 분석이 이루어진다.Generally, package samples are put in a vacuum apparatus and various types of analyzes are performed, such as surface analysis, cross-sectional analysis, material analysis, and component analysis, using secondary electrons or secondary ions.
이러한 진공장치내에 패키지 샘플을 장착하기 위한 종래의 패키지 샘플 고정홀더는 도 1에서 도시된 바와같이 실리콘 웨이퍼(1)와, 상기 실리콘 웨이퍼(1)상에 도전성 접착제(5)로 고정되며 측면에 다 수개의 리드(9)가 형성되는 패키지 샘플(3)과, 상기 패키지 샘플(3)과 실리콘 웨이퍼(1) 사이에 연결되어 접지되는 그라운드선(7)으로 구성된다.A conventional package sample holder for mounting a package sample in such a vacuum apparatus is fixed with a silicon wafer 1 and a conductive adhesive 5 on the silicon wafer 1, as shown in FIG. It consists of a package sample 3 on which several leads 9 are formed, and a ground line 7 connected between the package sample 3 and the silicon wafer 1 and grounded.
상기와 같은 종래의 패키지 샘플 고정홀더는 실리콘 웨이퍼(1) 상에 도전성 접착제(5)를 사용하여 패키지 샘플(3)과 패키지 샘플(3)의 리드(9)에 연결된 그라운드선(7)을 고정한 후 백열전구(11)의 열을 이용하여 도전성 접착제(5)를 고착시킨다.The conventional package sample holding holder as described above uses the conductive adhesive 5 on the silicon wafer 1 to fix the ground line 7 connected to the package sample 3 and the lead 9 of the package sample 3. After that, the conductive adhesive 5 is fixed by using the heat of the incandescent bulb 11.
이렇게 패키지 샘플(3)이 고정된 실리콘 웨이퍼(1)를 진공장치내에 투입하여 다양한 종류의 분석을 실시한다. 이때 진공장치내에서 분석중에 상기 패키지 샘플(3)이 움직이지 않도록 주의해야 한다.Thus, the silicon wafer 1 in which the package sample 3 is fixed is put into a vacuum apparatus, and various types of analysis are performed. Care should be taken to ensure that the package sample 3 does not move during analysis in a vacuum apparatus.
그러나 종래의 실리콘 웨이퍼에 패키지 샘플을 장착하는 경우 패키지 샘플을 고정하기 위한 접착제 굳힘 및 작업 완료후 테스트를 위하여 도전성 접착제를 제거하는데 소요되는 시간이 길어지며 핀과 핀사이에 잔류하는 도전성 접착제에 의한 누설전류가 발생하는 것은 물론 진공장치내에서 분석중에 실리콘 웨이퍼가 이동되는 경우가 발생하여 정확한 테스트를 실시할 수 없는 문제점이 있다.However, when the package sample is mounted on a conventional silicon wafer, the adhesive hardening to fix the package sample and the time required to remove the conductive adhesive for the test after the completion of work are increased, and the leakage caused by the conductive adhesive remaining between the pins and the pins is long. In addition to the generation of current, there is a problem in that the silicon wafer is moved during the analysis in the vacuum apparatus, so that accurate testing cannot be performed.
또한 도전성 접착제에 패키지 샘플을 고정하는 과정에서 무리한 힘이 가해져 패캐지의 핀이 변형되고 패키지 샘플을 일정각도로 기울여 접착제를 도포할 수 없어 분석시험에 제약을 받는 문제점이 있다.In addition, there is a problem in that an excessive force is applied in the process of fixing the package sample to the conductive adhesive, the pin of the package is deformed, and the adhesive cannot be applied by tilting the package sample at an angle.
본 고안의 목적은 진공장치내에 패키지 샘플이 이동되지 않도록 장착하는 패키지 샘플 고정홀더를 형성하여 패키지 샘플의 설치를 용이하게 하는 반도체 제조용 패키지 샘플 고정홀더를 제공하는 데 있다.An object of the present invention is to provide a package sample holding holder for manufacturing a semiconductor to facilitate the installation of the package sample by forming a package sample holding holder for mounting so that the package sample is not moved in the vacuum apparatus.
따라서, 본 고안은 상기의 목적을 달성하고자, 패키지 샘플을 분석하는 진공장치에 있어서, 상기 진공장치내에 고정되는 바닥판과, 상기 바닥판과 임의간격만큼 이격되어 나사고정되며 상부면에 다 수개의 장공을 형성하는 상부 지지판과, 상기 바닥판과 상부 지지판 사이에서 안내되며 이송되고 일측단에는 손잡이가 형성되고 타측단에는 스프링에 의하여 탄지되는 샘플 적재판과, 상기 샘플 적재판의 상부에 형성되어 패키지 샘플을 지지하는 동시에 상기 장공의 내측면 사이에서 이동되며 맞물려 샘플 적재판에 패키지 샘플을 고정하는 걸림턱으로 구성되는 것을 특징으로 한다.Therefore, in order to achieve the above object, the present invention is a vacuum device for analyzing a package sample, the bottom plate is fixed in the vacuum device, and the screw is spaced apart by a predetermined distance from the bottom plate and a plurality of top surfaces An upper support plate forming a long hole, a sample loading plate guided and transported between the bottom plate and the upper support plate, a handle formed at one end, and held by a spring at the other end, and a package formed on the sample loading plate At the same time supporting the sample is moved between the inner surface of the long hole is characterized in that it comprises a locking jaw for fixing the package sample to the sample loading plate.
도 1은 종래의 패키지 샘플을 웨이퍼에 고정하는 것을 도시한 사용상태도이고,1 is a use state diagram showing the fixing of a conventional package sample to a wafer,
도 2는 본 고안의 고정홀더에 패키지 샘플이 장착된 것을 도시한 사용상태도이고,2 is a use state diagram showing that the package sample is mounted on the fixed holder of the present invention,
도 3은 도 2의 A - A선 단면도이고,3 is a cross-sectional view taken along the line A-A of FIG.
도 4는 본 고안의 고정홀더에 패키지 샘플이 설치되지 않은 상태를 도시한 도 2의 A - A선 단면도이다.4 is a cross-sectional view taken along the line A-A of Figure 2 showing a state in which a package sample is not installed in the fixed holder of the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1 : 실리콘 웨이퍼, 3 : 패키지 샘플,1: silicon wafer, 3: package sample,
5 : 도전성 접착제, 7 : 그라운드선,5: conductive adhesive, 7: ground wire,
100 : 패키지 샘플 고정홀더, 101 : 바닥판,100: package sample holder, 101: bottom plate,
103 : 상부 지지판, 105 : 장공,103: upper support plate, 105: long hole,
107 : 샘플 적재판, 109 : 걸림턱,107: sample loading plate, 109: locking jaw,
111 : 스프링, 113 : 나사,111: spring, 113: screw,
115 : 손잡이.115: handle.
이하, 첨부된 도면을 참조하여 본 고안을 설명하면 다음과 같다.Hereinafter, the present invention with reference to the accompanying drawings as follows.
도 2는 본 고안의 패키지 샘플 고정홀더에 패키지 샘플이 장착된 것을 도시한 사용상태도이고, 도 3은 도 2의 A - A선 단면도이다.Figure 2 is a state diagram showing the use of a package sample is mounted on the package sample holder of the present invention, Figure 3 is a cross-sectional view taken along line AA of FIG.
다 수개의 장공(105)이 소정간격으로 상측에 천공된 상부 지지판(103)이 형성되어 이러한 상부 지지판(103)과 임의간격으로 이격되는 바닥판(101)에 나사(113)로 상호체결된다.A plurality of long holes 105 are formed in the upper support plate 103 perforated on the upper side at a predetermined interval and is mutually fastened with screws 113 to the bottom plate 101 spaced at random with the upper support plate 103.
상기 상부 지지판(103)과 바닥판(101) 사이에, 일측에는 손잡이(115)가 형성되고 타측에는 스프링(111)에 의하여 탄지되는 샘플 적재판(107)이 삽입되어 내측면을 따라 슬라이딩된다.Between the upper support plate 103 and the bottom plate 101, the handle 115 is formed on one side and the sample loading plate 107 carried by the spring 111 on the other side is inserted and slides along the inner surface.
이때 상기 스프링(111)은 바닥판(101)의 일측단에 고정되는 것이 바람직하다.At this time, the spring 111 is preferably fixed to one side end of the bottom plate (101).
상기 샘플 적재판(107)의 상면에는 다 수개의 걸림턱(109)이 수직으로 돌출되어 상부 지지판(103)의 장공(105) 내측면과 맞물리며 샘플 적재판(107)을 장공(105)의 폭만큼의 구간에서 이동되도록한다.A plurality of locking jaws 109 protrude vertically on the upper surface of the sample loading plate 107 to engage with the inner surface of the long hole 105 of the upper support plate 103, and the width of the long hole 105 of the sample loading plate 107. Move in as many sections.
따라서 상기 샘플 적재판(107)은 바닥판(101)과 상부 지지판(103)의 사이에서 스프링(111)에 의하여 탄지되며 슬라이딩되고 샘플 적재판(107)의 걸림턱(109)과 상부 지지판(103)의 장공(105) 사이에 패키지 샘플(3)이 안착되어 고정되도록 구성된다.Accordingly, the sample loading plate 107 is supported by the spring 111 between the bottom plate 101 and the upper support plate 103 and slides, and the locking step 109 and the upper support plate 103 of the sample loading plate 107. The package sample 3 is configured to be seated and fixed between the holes 105.
이와같이 구성되는 패키지 샘플 고정홀더(100)는 진공장치의 내측에 탈착가능토록 설치됨이 바람직하다.The package sample holding holder 100 configured as described above is preferably installed to be detachable inside the vacuum apparatus.
또한 상기 패키지 샘플 고정홀더(100)의 바닥판(101)과 상부 지지판(103) 및 샘플 적재판(107)은 알루미늄 소재로 형성되어 패키지 샘플(3)이 그라운드선없이 접지되도록 하는 동시에 진공장치내의 분석시 방출되는 전자 빔에의한 차징효과(Charging effect)를 감소시킨다.In addition, the bottom plate 101, the upper support plate 103, and the sample loading plate 107 of the package sample holder 100 are made of aluminum so that the package sample 3 is grounded without a ground line. It reduces the charging effect by the electron beam emitted in the analysis.
본 고안의 고정홀더에 의한 패키지 샘플 장착과정을 알아보면 다음과 같다.Looking at the package sample mounting process by the fixing holder of the present invention is as follows.
도 3은 패키지 샘플 고정홀더(100)에 패키지 샘플(3)이 장착된 상태를 도시한 것으로 바닥판(101)과 상부 지지판(103)의 사이에서 슬라이딩되는 샘플 적재판(107)을 스프링(111)에 의하여 탄지되는 안쪽으로 이동시켜 샘플 적재판(107)의 상부에 형성된 걸림턱(109)과 상부 지지판(103)의 장공(105)측면이 이격되도록 한다.3 illustrates a state in which the package sample 3 is mounted on the package sample holder 100, and the sample loading plate 107 sliding between the bottom plate 101 and the upper support plate 103 is spring 111. Inwardly moved by the inner side so as to be spaced apart from the side surface of the engaging jaw 109 formed in the upper portion of the sample loading plate 107 and the long hole 105 of the upper support plate 103.
이렇게 상호 이격된 걸림턱(109)과 장공(105)측면 사이에 패키지 샘플(3)을 삽입하여 안착하고 내측으로의 가압력을 제거하면 압축된 스프링(111)의 복원력에 의하여 걸림턱(109)이 패키지 샘플(3)을 일정한 힘으로 밀어주어 걸림턱(109)과 장공(105)측면 사이에 패키지 샘플(3)이 고정된다.When the package sample 3 is inserted and seated between the latching jaw 109 and the side of the long hole 105 spaced apart from each other, and the pressing force to the inside is removed, the locking jaw 109 is moved by the restoring force of the compressed spring 111. The package sample 3 is fixed between the latching jaw 109 and the side of the long hole 105 by pushing the package sample 3 with a constant force.
따라서 진공장치내에 설치된 상기 패키지 샘플 고정홀더(100)에 패키지 샘플(3)이 고정되어 분석이 가능토록 셋팅된다.Therefore, the package sample 3 is fixed to the package sample holder 100 installed in the vacuum apparatus, and set to allow analysis.
이때 상기 진공장치 내에서의 분석시 방출되는 2차 전자에 의한 차징효과는 알루미늄으로 이루어진 패키지 샘플 고정홀더(100)에 의하여 감소된다.At this time, the charging effect by the secondary electrons emitted during the analysis in the vacuum apparatus is reduced by the package sample holder 100 made of aluminum.
또한 상기 걸림턱(109)과 장공(105)측면에 삽입되는 패키지 샘플(3)을 일정각도로 기울인 상태에서도 장착이 가능하여 다양한 상태에서의 분석을 가능케함은 물론이다.In addition, the mounting step 109 and the package sample (3) inserted into the long hole 105 side can be mounted even in a state inclined at a predetermined angle to enable analysis in various states, of course.
이렇게 진공장치에서의 분석이 끝난 후 상기 패키지 샘플을 탈거하기 위해서는 도 4에서 도시된 바와같이 스프링(111)의 탄지력을 극복하면서 샘플 적재판(3)을 안쪽으로 밀어 걸림턱(109)과 장공(105)측면 사이에 여유간격을 형성하여 안착된 패키지 샘플(3)을 탈거한다.In order to remove the package sample after the analysis in the vacuum apparatus, as shown in FIG. 4, the sample loading plate 3 is pushed inward while overcoming the holding force of the spring 111. (105) A clearance gap is formed between the sides to remove the seated package sample (3).
이렇게 패키지 샘플(3)이 탈거된 후 샘플 적재판(107)에 가해진 힘을 제거하면 압축된 스프링(111)의 복원력에 의하여 샘플 적재판(107)이 슬라이딩되며 스프링(111)과 반대방향으로 이동되고 이에따라 걸림턱(109)이 장공(105)의 내측일면과 맞닿으면서 정지되어 원위치된다.When the package sample 3 is removed in this way and the force applied to the sample loading plate 107 is removed, the sample loading plate 107 is slid by the restoring force of the compressed spring 111 and moves in the opposite direction to the spring 111. As a result, the locking jaw 109 is stopped while contacting the inner surface of the long hole 105 and is returned to its original position.
상기에서 상술된 바와 같이, 본 고안은 진공장치내에서 설치된 패키지 샘플 고정홀더에 패키지 샘플을 용이하게 설치할 수 있도록 하므로써 설치시간을 단축하고 패키지 샘플을 일정각도로 기울여 장착하여 다양한 분석이 가능하며 알루미늄 소재로 이루어져 2차 전자에 의한 빔 쌓임을 방지하는 것은 물론 누설전류를 차단하여 정확한 측정을 가능케하는 잇점이 있다.As described above, the present invention enables easy installation of the package sample in the package sample holding holder installed in the vacuum apparatus, thereby shortening the installation time and tilting the package sample at an angle so that various analyzes are possible. Consists of preventing the beam accumulation by the secondary electrons, as well as blocking the leakage current has the advantage of enabling accurate measurement.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970032342U KR200174035Y1 (en) | 1997-11-15 | 1997-11-15 | Package sample holder for fabricating semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970032342U KR200174035Y1 (en) | 1997-11-15 | 1997-11-15 | Package sample holder for fabricating semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990019032U KR19990019032U (en) | 1999-06-05 |
| KR200174035Y1 true KR200174035Y1 (en) | 2000-03-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970032342U KR200174035Y1 (en) | 1997-11-15 | 1997-11-15 | Package sample holder for fabricating semiconductor |
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| Country | Link |
|---|---|
| KR (1) | KR200174035Y1 (en) |
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1997
- 1997-11-15 KR KR2019970032342U patent/KR200174035Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR19990019032U (en) | 1999-06-05 |
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