KR200164520Y1 - Package converting apparatus - Google Patents
Package converting apparatus Download PDFInfo
- Publication number
- KR200164520Y1 KR200164520Y1 KR2019950010793U KR19950010793U KR200164520Y1 KR 200164520 Y1 KR200164520 Y1 KR 200164520Y1 KR 2019950010793 U KR2019950010793 U KR 2019950010793U KR 19950010793 U KR19950010793 U KR 19950010793U KR 200164520 Y1 KR200164520 Y1 KR 200164520Y1
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- Prior art keywords
- package
- vacuum
- aero
- cylinder
- rod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 고안은 180도 회전하는 에어로타리 실린더와; 에어로타리실린더에 일단이 결합되어 연동하며, 다른단은 진공을 제공받는 진공홀이 형성된 반전봉과; 상기 반전봉 외주 상하면에 일정간격으로 배열고정되며, 상기 진공홀과 관통되어 진공 흡착력을 제공받는 다수의 고정구를 포함하여 이루어진 패키지 반전장치이며, 고정구를 사양을 변경하면 인쇄회로기판 등의 반전 작업시에도 사용가능하고, 에어로타리실린더에 반전공을 180도씩 회전시키고 반전봉에는 보트의 크리스탈 안착캡 대응부위에 고정구를 설치하여 패키지를 반전 공급케 함으로써 보우트를 뒤집지 않고 본 반전 장치에 의해 패키지 제조를 용이하게 수행가능하다.The present invention is an aero cylinder that rotates 180 degrees; An inverted rod having one end coupled to and interlocked with the aero cylinder, and the other end having a vacuum hole for receiving a vacuum; Arranged and fixed at a predetermined interval on the upper and lower outer periphery of the inverting rod, and is a package inverting device comprising a plurality of fasteners penetrating the vacuum hole to receive a vacuum suction force, when changing the specification of the fasteners when inverting the printed circuit board It is also possible to use it, and by rotating the inverting hole by 180 degrees in the aero cylinder and installing the fixture on the counter seat of the crystal seating cap on the inverting rod, the package is reversed and supplied. It can be done.
Description
제1도는 일반적인 보트 평면도.1 is a top view of a typical boat.
제2도는 제1도의 측면도.2 is a side view of FIG.
제3도는 종래의 보트사용상태를 나타낸 측면도.3 is a side view showing a conventional boat use state.
제4도는 본 고안의 반전장치 평면도.4 is a plan view of the inverter of the present invention.
제5도는 본 고안의 반전장치 정면도.5 is a front view of the reversing apparatus of the present invention.
제6도는 본 고안의 고정구 평면도.6 is a plan view of the fixture of the present invention.
제7도는 본 고안의 일부절결 정면도.Figure 7 is a partially cutaway front view of the present invention.
제8a∼제8d도는 본 고안의 고정구 작동 순서도이다.8a to 8d are a flow chart of the fixture operation of the present invention.
본 고안은 패키지 반전장치에 관한 것으로, 특히 이피롬(EP-ROM)계열의 세라믹 패키지에서 패키지의 크리스탈 커버를 결착시키는데 사용하는 패키지 반전장치에 관한 것이다.The present invention relates to a package inverting device, and more particularly, to a package inverting device used to bind a crystal cover of a package in an EP-ROM-based ceramic package.
일반적으로 세라믹 패키지 등은 작업 공정에서 이송할 때 제1도 및 제2도에 나타낸 보트를 사용하여 이송한다. 이러한 보트(1)는 패키지 등을 받쳐주는 T자형 받침판(1-1)과, T자형 받침판(1-1)주위에서 외부리드가 끼워지는 관통공(1-2)과, T자형 받침판(1-1) 목부에 설치되어 패키지의 길이방향이동을 제한하는 고정구(1-3)를 포함한다. 상기 T자형 받침판(1-1)은 일정거리를 두고 관통공(1-2)에 형성되며, 크리스탈캡 등이 양헤드에 안착될 수 있는 거리이어야 한다.In general, ceramic packages and the like are transported using the boats shown in FIGS. The boat 1 has a T-shaped support plate (1-1) for supporting a package, a through hole (1-2) in which an external lead is fitted around the T-shaped support plate (1-1), and a T-shaped support plate (1). -1) includes a fixture (1-3) installed in the neck to limit the longitudinal movement of the package. The T-shaped support plate (1-1) is formed in the through hole (1-2) at a predetermined distance, it should be a distance that the crystal cap or the like can be seated on both heads.
이러한 보트(1)를 사용하여 패키지를 조립할 때, 하나의 보트(1)에는 캡을 T자형 받침판(1-1) 바닥면에 각각 안착시킨다. 이 때 캡은 접착제를 흡착시킨 상태의 것이다.When assembling the package using such a boat (1), one boat (1) is seated on the bottom surface of the T-shaped support plate (1-1), respectively. At this time, the cap is in a state where the adhesive is adsorbed.
또한 다른 하나의 보트(1')에는 캡(2')을 부착시킬 상태의 패키지(2)를 고정구(1-3) 부위에 안착시킨다. 이어 T자형 받침판(1-1) 정도의 자석이 T자형 받침판(1-1) 대응부위에 형성된 별도의 지그를 사용하여 보트(1)를 반전시킨 다음, 상기 제3도 상태와 같이 위치시킨 상태에서 지그를 분리시키면 패키지(2)가 점선상태에서 아래 보트(1')의 표면으로 낙하하고, 이 상태에서 열을 가하면 캡(2')의 접착제에 의해 패키지(2)의 캡수장홈과 결착된다.In addition, the other boat 1 ′ mounts the package 2 in a state where the cap 2 ′ is attached to the fastener 1-3. Subsequently, the magnet about the T-shaped support plate 1-1 is inverted by the boat 1 using a separate jig formed on the corresponding portion of the T-shaped support plate 1-1, and then positioned as shown in FIG. 3. When the jig is removed from the package, the package 2 drops from the dotted line to the surface of the lower boat 1 ', and when heated in this state, the package 2 binds to the cap receiving groove of the package 2 by the adhesive of the cap 2'. do.
이러한 방식의 패키지 제조공정은 보트를 사용하므로 보트에 로딩시 리드가 손상되기도 하고, 보트를 통채로 반전시키므로 공정상의 조그만 미스가 있어도 캐핑 공정이 불량화되는 단점이 있다.Since the package manufacturing process of the method uses a boat, the lid may be damaged when loading the boat, and the boat is inverted as a whole, and thus the capping process may be deteriorated even if there is a small miss in the process.
본 고안은 이를 해결코자 하는 것으로, 에어로타리 실린더에 의해 회전하는 반전봉에 패키지 안착고정구를 보트 적재 패키지수만큼 설치하고, 각 고정구는 진공에 의해 패키지를 흡착되도록 하며, 흡착용 진공은 반전봉을 통해 제공받도록 하여 보트의 반전없이 패키지를 제조가능케 하는 반전장치를 제공함을 특징으로 한다.The present invention is to solve this problem, the package mounting fixture is installed on the reversing rod rotated by the aero cylinder, the number of boat loading package, each fixture is to adsorb the package by vacuum, the adsorption vacuum It is characterized in that it provides an inverting device that allows the package to be manufactured without being inverted by the boat.
즉, 본 고안은 180도 회전하는 에어로타리 실린더와, 에어로타리실린더에 일단이 결합되어 연동하며, 다른단은 진공을 제공받는 진공홀이 형성된 반전봉과, 상기 반전봉 외주 상하면에 일정간격으로 배열고정되며, 상기 진공홀과 관통되어 진공 흡착력을 제공받는 다수의 고정구를 포함하여 이루어진다.In other words, the present invention is a 180 degree rotation of the aero cylinder, one end is coupled to the aero cylinder, the other end is inverted rod formed with a vacuum hole for receiving a vacuum, and the fixed arrangement arranged at regular intervals on the upper and lower outer periphery of the reverse rod And a plurality of fasteners penetrating the vacuum hole to receive the vacuum suction force.
이하 도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the drawings will be described in detail.
180도 회전하는 에어로타리 실린더(10)와, 에어로타리실린더(10)에 일단이 결합되어 연동하며, 다른단은 진공을 제공받는 진공홀(21)이 형성된 반전봉(20)과, 상기 반전봉(20) 외주 상하면에 일정간격으로 배열고정되며, 상기 진공홀(21)과 관통되어 진공 흡착력을 제공받는 다수의 고정구(30)를 포함하여 이루어진다.An inverted rod 20 having an aero cylinder 10 rotated 180 degrees, one end coupled to the aero cylinder 10, and the other end is provided with a vacuum hole 21 for receiving a vacuum, and the inverted rod 20 is fixed to the upper and lower outer periphery arranged at a predetermined interval, and comprises a plurality of fasteners 30 penetrated through the vacuum hole 21 to receive a vacuum suction force.
상기 진공홀(21)은 반전봉(20)의 길이 방향으로 상하 2개소에 개별적으로 형성된다. 상기 단위고정구(30)는 평면상 중앙에 길이 방향으로 장홈(31)이 있고, 장홈(31) 양측에는 반전봉(20)에 고정시키는 고정나사공(33)이 형성되며, 길이 방향 양측면에는 패키지 가이드바(34)가 한쌍씩 돌설된다.The vacuum holes 21 are formed separately at two positions in the vertical direction of the inversion bar 20. The unit fixing tool 30 has a long groove 31 in the longitudinal direction in the center on the plane, the fixing screw hole 33 for fixing to the reversing rod 20 on both sides of the long groove 31, the package on both sides of the longitudinal direction The guide bar 34 protrudes one by one.
이를 설치할 때에는 제6도 및 제7도와 같은 고정구(30)를 나사(33-1)를 이용하여 반전봉(20)에 각각 결착시키고, 반전봉(20)은 에어로타리실린더(10)의 회전력을 제공받도록 에어로타리실린더(10)와 결착시킨다.When installing this, fasteners 30 as shown in FIGS. 6 and 7 are fastened to the reversing rods 20 using screws 33-1, respectively, and the reversing rods 20 rotate the rotational force of the aero cylinder 10. Bond with the aero cylinder 10 to be provided.
이는 제4도 및 제5도와 같은 상태를 이루며, 에어로타리 실린더(10)의 에어주입구(11)를 통해 에어를 공급시키면(에어 공급 수단의 도시는 생략함) 반전봉(20)이 180도씩 반복 회전한다. 이 때 고정구(30)에는 제3도 등에서 보인 패키지(2)를 각각 안착시키고 진공홀(21)을 통해 진공을 공급하여 고정진공홀(32)에 의해 단위패키지(2)마다 흡착고정시킨다. 이 상태에서 반전봉(20)이 180도 회전하면 상단의 패키지(2)가 하단으로 이동되고, 이 때 진공홀(21)을 통한 진공공급을 해제시키면 패키지(2)가 하단으로 자유낙하하게 된다. 이는 제8a도∼제8b도와 같은 상태로 패키지(2)가 고정구(30)에서 반전되는 것이다. 물론 이에 앞서 제3도에 보인 보트(1')에는 상기 고정구(30) 대응위치마다 T자형 받침판(1-1) 부위에 크리스탈캡(2')이 안착된 보트(1')에 패키지(2)가 낙하되면 가열에 의해 패키지(2)에 크리스탈캡(2')이 접착된다.This is the same as FIG. 4 and 5, and when the air is supplied through the air inlet 11 of the rotary cylinder 10 (not shown in the air supply means) the reversing rod 20 is repeated by 180 degrees Rotate At this time, the fixtures 30 are respectively seated on the package 2 shown in FIG. 3 and supplied with a vacuum through the vacuum hole 21 to be fixed by suction per unit package 2 by the fixed vacuum hole 32. In this state, when the reversing rod 20 rotates 180 degrees, the upper package 2 is moved to the lower end, and when the vacuum supply through the vacuum hole 21 is released, the package 2 falls freely to the lower end. . That is, the package 2 is reversed in the fixture 30 in the same state as in FIGS. 8A to 8B. Of course, in the boat 1 'shown in FIG. 3, the package 2 is mounted on the boat 1' in which the crystal cap 2 'is seated on the T-shaped support plate 1-1 at each corresponding position of the fixture 30. When is dropped, the crystal cap 2 'is bonded to the package 2 by heating.
상기에서는 고정구(30)를 패키지(2)를 가능한 형태로 도시하였으나, 메모리모듈(예를 들어 SIMM PCB)의 양면작업시 전면 작업을 완료하고 이면 작업을 요할 때 고정구(30) 형태를 변형시켜 메모리 모듈용 반전장치로도 사용가능하다.In the above, the fixture 30 is shown in the form of a package 2, but when the double-sided operation of the memory module (for example SIMM PCB) to complete the front work and when the rear work required to deform the shape of the fixture 30 memory Can also be used as a module inverter.
이상과 같이 본 고안은 에어로타리실린더에 반전봉을 180도씩 회전시키고 반전봉에는 보트의 크리스탈 안착캡 대응부위에 고정구를 설치하여 패키지를 반전 공급케 함으로써 보트를 뒤집지 않고 본 반전 장치에 의해 패키지 제조를 용이하게 수행가능하다.As described above, the present invention rotates the reversing rod by 180 degrees in the aero cylinder, and installs a fixture on the crystal seating cap corresponding part of the boat so that the package is inverted and supplied. It can be easily performed.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950010793U KR200164520Y1 (en) | 1995-05-20 | 1995-05-20 | Package converting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950010793U KR200164520Y1 (en) | 1995-05-20 | 1995-05-20 | Package converting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960038763U KR960038763U (en) | 1996-12-18 |
| KR200164520Y1 true KR200164520Y1 (en) | 2000-01-15 |
Family
ID=19413623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950010793U KR200164520Y1 (en) | 1995-05-20 | 1995-05-20 | Package converting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200164520Y1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100433837B1 (en) * | 2002-06-12 | 2004-05-31 | 삼성테크윈 주식회사 | The flip apparatus for semiconductor package |
| KR100653468B1 (en) * | 2000-05-31 | 2006-12-04 | 비오이 하이디스 테크놀로지 주식회사 | Apparatus for reversing lcd module |
-
1995
- 1995-05-20 KR KR2019950010793U patent/KR200164520Y1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100653468B1 (en) * | 2000-05-31 | 2006-12-04 | 비오이 하이디스 테크놀로지 주식회사 | Apparatus for reversing lcd module |
| KR100433837B1 (en) * | 2002-06-12 | 2004-05-31 | 삼성테크윈 주식회사 | The flip apparatus for semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| KR960038763U (en) | 1996-12-18 |
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