JPH08162495A - Solder ball mounting device - Google Patents

Abstract

PURPOSE: To provide a solder ball mounting device of a structure, wherein when solder balls for forming bumps are mounted on a work, the balls in a container are prevented from being marred and moreover, the balls are made to fluidize with a small amount of the air and the balls are sucked and can be picked up by a head. CONSTITUTION: The interior of a container 12 is partitioned by meshes 21 and 22 and solder balls 1 are stagnated on the mesh 22. An air blow-off part 10 for blowing off the air is provided in the container 12 and a vibrator 19 for vibrating the container 10 is provided. The vibrator 19 vibrates the container 12 comparatively weak and a comparatively small amount of the air is blown off through the part 10, whereby the balls 1 on the mesh 22 are fully fluidized and the balls are reliably sucked in suction holes 29 bored in a head 30 and can be packed up by the head 30.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus for mounting a solder ball for forming a bump on a work such as a substrate.

[0002]

2. Description of the Related Art As a means for forming bumps (protruding electrodes) on electrodes of a work such as a substrate or a chip, there is known a method of mounting a solder ball on the work and then heating and melting and solidifying the solder ball. Generally, a large number of bumps are formed on a work, and therefore a large number of solder balls are mounted on the work. Hereinafter, a solder ball supply unit used in a conventional solder ball mounting apparatus for mounting a large number of solder balls on a workpiece all at once will be described.

FIG. 5 is a sectional view of a solder ball supply portion provided in a conventional solder ball mounting apparatus. 1 is a solder ball, which is stored in the container 2. A vibrator 3 is attached to the lower surface of the container 2. The container 2 is supported by the support portion 5 via the elastic member 4 so that the container 2 can vibrate.
Reference numeral 7 is a head, and a suction hole 8 for vacuum-sucking the solder ball 1 is formed on the lower surface thereof.

By driving the vibrating device 3 to vibrate the container 2, the head 7 is inserted into the plurality of suction holes 8 and the solder balls 1
Fluidize the solder balls 1 so that
In this state, the head 7 is lowered and raised to vacuum-suck the solder balls 1 into the suction holes 8 and pick them up. Next, the head 7 moves above a work (not shown) such as a substrate and mounts the solder ball 1 on the work.

FIG. 6 is a sectional view of a solder ball supply portion provided in another conventional solder ball mounting apparatus. Container 6
Solder balls 1 are stored therein. A tube 9 is connected to the container 6, and air is blown from the tube 9 and blown up from a hole 6a at the bottom of the container 6 (see an arrow) so that the head can easily suck the solder ball 1 in vacuum. Fluidize the ball 1.

[0006]

However, in the conventional example shown in FIG. 5, in order to sufficiently fluidize the solder ball 1, it is necessary to vibrate the solder ball 1 strongly with the vibrator 3. When the solder ball 1 is vibrated strongly, the solder balls 1 collide strongly with each other and are easily scratched, and oxidation progresses from the scratched portion, so that the material of the solder ball 1 is easily deteriorated. Further, as a result of the strong rubbing of the solder balls 1 with each other, metal powder is generated, and this metal powder adheres to the suction holes 8 of the head 7 and the suction holes 8 are easily clogged.

Further, in the conventional example shown in FIG. 6, the solder ball 1
In order to sufficiently fluidize the air, a large amount of air must be blown out from the tube 9, which causes a problem that the air consumption amount becomes extremely large. Moreover, in the factory where the solder ball mounting device is installed, in addition to the solder ball mounting device, various devices that consume air are often installed, and these devices and the solder ball mounting device are shared. Since air is often supplied from the air supply device, when the solder ball mounting device consumes a large amount of air, other devices tend to run out of air.

In view of the above, the present invention solves the problems of the above-mentioned conventional example, allows the solder balls to be sufficiently fluidized without damaging them, and has a solder ball supply portion which consumes less air. An object of the present invention is to provide a ball mounting device.

[0009]

To this end, according to the present invention, an air blowing means for blowing air into a container in which a solder ball is stored and a vibration imparting means for vibrating the container are provided. And means.

[0010]

According to the above structure, the solder ball can be sufficiently fluidized by blowing a relatively small amount of air into the container while vibrating the solder ball relatively weakly by the vibration applying means.

[0011]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a solder ball supply portion provided in the solder ball mounting apparatus, FIG. 3 is a plan view of FIG. FIG. 3 is a partial sectional view of the head.

In FIG. 1, reference numeral 11 is a solder ball supply unit, which will be described in detail with reference to FIGS. 2 and 3. Reference numeral 12 is a container in which the solder balls 1 are stored. Reference numeral 10 denotes an air blowing portion provided at the bottom of the container 12, and a gas supply device 20 (FIG. 1) via a tube 13.
It is connected to the. Inside the container 12, upper and lower two stages of meshes 21 and 22 are provided. The solder balls 1 are stored on the upper mesh 22. Further, the lower mesh 21 makes the flow of the air blown out from the air blowing portion 10 uniform.

Reference numeral 14 is a base plate. On base plate 14 and container 12
Stops 15 and 16 are attached to the lower surface of the. The upper and lower ends of a spring material 17 made of a leaf spring are fixed to the stopper 15 on the base plate 14 and the stopper 16 on the lower surface of the container 12 with screws 18. There are four spring members 17, which are fixed to the stoppers 15 and 16 in an inclined posture. A vibrator 19 is attached to the center of the lower surface of the container 12.

In FIG. 2, when the vibrator 19 vibrates,
The spring material 17 vibrates in the diagonal direction N1 orthogonal to the length direction, and the container 12 coupled to the spring material 17 also vibrates in the same diagonal direction. The diagonal direction N1 has components in the vertical direction N2 and the horizontal direction N3. Therefore, the vibration direction of the container 12 also includes a component in the vertical direction N2 and a component in the horizontal direction N3. Therefore, the solder balls 1 stored in the container 12 vibrate not only in the vertical direction N2 but also in the horizontal direction N3.

Here, the vibration in the vertical direction N2 acts so as to cause the upper surface of the solder ball 1 to undulate as shown in FIG. 5, while the vibration in the horizontal direction N3 acts to disperse this undulation. Therefore, when the solder ball 1 is fluidized by driving the vibrator 19 to vibrate the container 12,
The upper surface of the solder ball 1 maintains a substantially horizontal surface. Further, the four spring members 17 are inclined in the same direction when viewed from the center of the container 12, and therefore the solder ball 1 in the container 12 is indicated by an arrow Q in FIG. 3 due to the vibration component in the horizontal direction N3.
As shown by, it rotates in the same direction as a whole.

In FIG. 1, a movable table 25 as a work positioning unit is installed on the side of the supply unit 11. A clamper 26 is provided on the movable table 25, and the substrate 27 is clamped by the clamper 26 and positioned. When the movable table 25 is driven, the substrate 27 moves in the horizontal direction and its position is adjusted.

In FIG. 1, reference numeral 30 is a head, which is held by a block 32 via a shaft 31. Although not shown, the block 32 is provided with a vertically moving means for vertically moving the head 30. In FIG. 2, reference numeral 29 is a suction hole formed on the lower surface of the head 30. A moving table 33 is installed between the supply unit 11 and the movable table 25. The moving table 33 is provided with a horizontal feed screw 34. A nut 35 provided on the back surface of the block 32 is screwed onto the feed screw 34. When the motor 36 is driven and the feed screw rotates, the block 32 and the head 30 move laterally along the feed screw 34.
The head 30 is connected to a vacuum device 38 via a tube 37.
It is connected to the.

The solder ball mounting device is constructed as described above, and its operation will be described below. 1 and 3
At, the head 30 descends toward the box 12, and the solder ball 1 stored in the container 21 is vacuum-sucked to the suction hole 29 by the suction force of the vacuum device 38. Next, after the head 30 moves up, the motor 36 is driven to rotate the feed screw 34, and the head 30 moves above the substrate 27. Then, the head 30 descends, the solder balls 1 vacuum-adsorbed on the lower surface thereof are mounted on the substrate 27, the vacuum adsorption state is released, and then the head 30 ascends.
Next, the head is moved to the container 1 by driving the motor 36.
2, and the above operation is repeated.

In FIG. 2, when the head 30 descends to suck the solder balls 1 in the container 12 under vacuum, air is blown into the container 12 from the air blowing portion 10 so that the solder ball 1 in the container 12 can be easily sucked under vacuum. The solder ball 1 is fluidized by driving 19 to vibrate the container 12. In this case, since the vibration direction of the container 12 has not only the component in the vertical direction N2 but also the component in the horizontal direction N3 as described above, the upper surface of the solder ball 1 maintains a substantially horizontal surface, and therefore all the suction holes 29 have The solder balls 1 can be reliably vacuum-sucked and picked up.

As shown in FIG. 4, a plurality of solder balls 1 are easily vacuum-sucked in the suction holes 7, but since the solder balls 1 also vibrate in the horizontal direction N3, they are strongly vacuum-sucked directly in the suction holes 29. The attached extra solder balls 1 other than the solder balls 1 (painted in black) have a small vacuum suction force, and are shaken off by the vibration in the horizontal direction N3.
Therefore, the plurality of solder balls 1 are not vacuum-sucked in one suction hole 29, and only one solder ball 1 directly vacuum-sucked in the suction hole 29 is picked up and mounted on the substrate 27. Further, in the present embodiment, since the solder balls 1 in the container 12 are moved in the horizontal direction (arrow Q in FIG. 3), the solder balls 1 which are not directly adsorbed by the adsorption holes 29 and are shaken off are removed. .

Since the solder ball 1 is fluidized by the combined force of the pressure of the air blown from the air blowing portion 10 and the vibration force of the vibrator 19, the pressure of the air and the vibration force of the vibrator 19 are generated. Can be relatively weak. That is, the vibrator 1
The vibration force of 9 may be weaker than in the case of the conventional example shown in FIG. 5, so that the solder balls 1 do not collide strongly with each other and are not damaged, nor are they rubbed strongly to generate metal powder.
Further, the air consumption amount may be smaller than that of the conventional example shown in FIG. 6, and a relatively small amount of air may be blown out.

[0022]

As described above, according to the present invention, since the air blowing means and the vibration applying means are provided as means for fluidizing the solder balls in the container, the vibrating means vibrates the solder balls relatively weakly. By blowing out a relatively small amount of air into the container while doing so, the solder balls can be sufficiently fluidized and vacuum sucked into the suction holes of the head to be picked up. Also, by applying vibration having vertical and horizontal components to the container, the excess solder balls are shaken off, and one solder ball is vacuum-sucked to one suction hole.
Can be mounted on the work.

[Brief description of drawings]

FIG. 1 is a side view of a solder ball mounting device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a solder ball supply unit provided in a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a plan view of a solder ball supply unit provided in a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of a head included in a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view of a solder ball supply unit provided in a conventional solder ball mounting device.

FIG. 6 is a cross-sectional view of a solder ball supply unit provided in another conventional solder ball mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder ball 10 Air blowout part 11 Supply part 12 Container 17 Spring material 19 Vibrator 25 Movable table (positioning part) 27 Substrate (work) 29 Adsorption hole 30 Head 33 Moving table

Claims (2)

[Claims] 1. A solder ball supply section, a workpiece positioning section, a head having a plurality of suction holes for vacuum-sucking the solder ball formed on the lower surface, and a head disposed between the supply section and the positioning section. A device for mounting a solder ball, comprising: a moving means for moving the supply ball, wherein the supply part stores a solder ball, an air blowing means for blowing air into the container, and a vibration for the container. A solder ball mounting apparatus comprising: a vibration applying unit. 2. The solder ball mounting apparatus according to claim 1, wherein the vibration applying means is vibration applying means for applying vibration having vertical and horizontal components to the container.