JPH06310515A - Fine sphere alignment mounting method - Google Patents
Fine sphere alignment mounting methodInfo
- Publication number
- JPH06310515A JPH06310515A JP9576893A JP9576893A JPH06310515A JP H06310515 A JPH06310515 A JP H06310515A JP 9576893 A JP9576893 A JP 9576893A JP 9576893 A JP9576893 A JP 9576893A JP H06310515 A JPH06310515 A JP H06310515A
- Authority
- JP
- Japan
- Prior art keywords
- solder balls
- microspheres
- mounting
- mounting plate
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、微小球体の整列搭載方
法に関し、特に、半導体素子の接続パットに微小球体で
ある半田ボールを接合する時に於いて、パットと同配列
で半田ボールが搭載される搭載穴が有る搭載プレート
に、半田ボールを整列搭載する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for aligning and mounting microspheres, and more particularly, when solder balls, which are microspheres, are bonded to a connection pad of a semiconductor element, the solder balls are mounted in the same arrangement as the pads. The present invention relates to a method of aligning and mounting solder balls on a mounting plate having mounting holes.
【０００２】[0002]
【従来の技術】従来、微小球体である半田ボールを整列
搭載する方法として、微小粒体装着方法、特開平３−２
２５８３２号がある。それを図２に示す。2. Description of the Related Art Conventionally, as a method for aligning and mounting solder balls, which are fine spheres, a method for attaching fine particles, JP-A-3-2
There is 25832. It is shown in FIG.
【０００３】この方法は半導体素子のバンプ形成に用い
られる多数の微小粒体である半田ボール４を貯蔵してい
るストッカ５１から、真空発生器５２を用いて吸引作用
により、半田ボール４を網目状の蓋５３に吹き上げる。
圧縮空気は網から外へ逃し、１回のバンプ形成に必要な
半田ボール４を定量カップ５４に入れる。両面で径が異
なる多数の貫通穴を有し、径の大きい穴を有する面側に
前記半田ボール４を装着可能なガラス治具５５上に閉空
間５６を形成する。前記半田ボール４を圧縮空気５７で
供給し、前記ガラス治具５５の径が小さい貫通穴から吸
引することにより、前記ガラス治具５５の径が大きい貫
通穴に半田ボール４を吸引装着する。前記閉空間５６内
に過剰供給した半田ボール４を真空吸引作用により回収
する構成となっている。According to this method, the solder balls 4 are meshed by a vacuum generator 52 from a stocker 51 which stores a large number of fine solder particles 4 used for forming bumps of a semiconductor element. Blow up on the lid 53 of.
Compressed air escapes from the net and puts the solder balls 4 required for one bump formation into the fixed amount cup 54. A large number of through holes having different diameters are formed on both sides, and a closed space 56 is formed on a glass jig 55 on which the solder balls 4 can be mounted on the side having the large diameter holes. By supplying the solder balls 4 with compressed air 57 and sucking the solder balls 4 from the through holes having the small diameter of the glass jig 55, the solder balls 4 are attached to the through holes having the large diameter of the glass jig 55 by suction. The solder balls 4 excessively supplied into the closed space 56 are collected by a vacuum suction action.
【０００４】[0004]
【発明が解決しようとする課題】上記従来技術は図２に
示す如く、多数の微小球体である半田ボールを貯蔵して
いるストッカから、真空発生器を用いて吸引作用によ
り、半田ボールを網目状の蓋に吹き上げる。圧縮空気は
網から外へ逃したり、微小球体である半田ボールを圧縮
空気でガラス治具上に供給している。In the prior art described above, as shown in FIG. 2, the solder balls are reticulated from a stocker that stores a large number of solder balls, which are microspheres, by a suction action using a vacuum generator. Blow up on the lid. Compressed air escapes from the net, and solder balls, which are microspheres, are supplied onto the glass jig by compressed air.
【０００５】上記従来技術では、半田ボールを真空発生
器を用いての吸引作用や圧縮空気を使用して高速移動さ
せると、軟らかい半田ボールが大きく傷付いたり、欠損
したりして体積が減少する。よって半導体素子の接続パ
ットの役目を果たさなくなる。本発明の目的は、上記事
項を一切なくして、確実に装着出来る半田ボールの整列
搭載方法を提供するものである。In the above-mentioned prior art, when the solder balls are moved at a high speed by using a suction action using a vacuum generator or compressed air, the soft solder balls are greatly damaged or chipped to reduce the volume. . Therefore, it does not serve as a connection pad for the semiconductor element. An object of the present invention is to provide a method for aligning and mounting solder balls that can be reliably mounted without any of the above matters.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成する為に
本発明は、微小球体である半田ボールを整列に搭載出来
且つ、保持出来る搭載プレート上に、供給された半田ボ
ールを外にこぼさない為のサイドカバーを下降し固定す
る。半田ボールを貯蔵しているスクリューフィーダから
搭載プレート上に搭載する数以上の一定量の半田ボール
を供給する。半田ボールの供給が終了したならばサイド
カバーを上昇させる。In order to achieve the above object, the present invention does not spill the supplied solder balls on a mounting plate that can mount and hold solder balls that are microspheres in an aligned manner. Lower the side cover for fixing. A certain amount of solder balls to be mounted on the mounting plate is supplied from the screw feeder storing the solder balls. When the supply of solder balls is completed, raise the side cover.
【０００７】搭載プレート表面には半田ボールが１個入
るだけの搭載穴が有る又、搭載プレート裏面には真空吸
引し半田ボールを固定保持する為の吸引穴が開いてい
る。There is a mounting hole on the surface of the mounting plate for only one solder ball, and a suction hole is formed on the rear surface of the mounting plate for vacuum suction to fix and hold the solder ball.
【０００８】バイブレータでプレート固定ブロックに振
動を与えながら真空ポンプで搭載プレートを介して半田
ボールを固定保持する。The solder balls are fixedly held by the vacuum pump through the mounting plate while vibrating the plate fixing block with the vibrator.
【０００９】搭載されずに残った余分な半田ボールは、
振動を与えているので、搭載プレート上から半田ボール
を排出する為の排出ストッカに落下していく。The extra solder balls left without being mounted are
Since it is vibrating, it drops onto the ejection stocker for ejecting solder balls from the mounting plate.
【００１０】搭載プレートの表面に全数搭載されたか確
認する為に、装置ユニットはＴＶカメラ側に移動する。The device unit is moved to the TV camera side in order to confirm whether all the devices are mounted on the surface of the mounting plate.
【００１１】静電気等で搭載プレート上に若干残った半
田ボールに、イオンエアを吹き付けて帯電した半田ボー
ルを中和させる。その後緩やかな不活性ガスのエアで半
田ボールを排出する。Ion air is blown to the solder balls slightly left on the mounting plate due to static electricity or the like to neutralize the charged solder balls. After that, the solder balls are discharged by a gentle inert gas air.
【００１２】ＴＶカメラにより搭載プレートに半田ボー
ルが全数搭載されたか確認し、未搭載が１個でもあった
ならば一連の動作を再度繰返し、全数搭載する迄動作を
続ける。全数搭載され、搭載プレート上に帯電した残存
半田ボールが１個でもあったならば、イオンエアと不活
性ガスのエアで半田ボールを排出する。It is confirmed by the TV camera whether all the solder balls are mounted on the mounting plate, and if there is only one solder ball, a series of operations is repeated again, and the operation is continued until all the solder balls are mounted. If all the mounted solder balls have one charged residual solder ball on the mounting plate, the solder balls are discharged with ion air and inert gas air.
【００１３】[0013]
【作用】この様に本発明は、半田ボールの移動手段に真
空吸引による高速移動や圧縮空気による高速移動を採用
していない。よって高速移動による衝突で半田ボールが
強く帯電しチューブ等の壁に付着したり又、軟らかい半
田ボールが変形し搭載プレートに入らなかったり、傷つ
いたり欠損したりする、上記事項で体積が減少し、半導
体素子の接続パットの役目を果たさなくなる要因を排除
する事が出来る。As described above, the present invention does not adopt high speed movement by vacuum suction or high speed movement by compressed air as the means for moving the solder balls. Therefore, the solder balls are strongly charged by the collision due to high speed movement and adhere to the wall of the tube, etc., or the soft solder balls are deformed and do not enter the mounting plate, or are damaged or missing, the volume is reduced by the above items, It is possible to eliminate the factor that does not serve the function of the connecting pad of the semiconductor element.
【００１４】[0014]
【実施例】以下、本発明の実施例を図１，図３，図４を
用いて説明する。図１は、本発明の一実施例の概要を示
すものである。Embodiments of the present invention will be described below with reference to FIGS. 1, 3 and 4. FIG. 1 shows the outline of one embodiment of the present invention.
【００１５】Ｘ方向移動ユニット１７はＸレール１８の
左端に移動し、搭載プレート３がサイドカバー５の真下
迄移動する。Ｘ方向移動ユニット１７の固定ブロック１
３上に固定された搭載プレート３がサイドカバー５の真
下迄移動する。移動したならばＺ方向移動ユニット１０
に取付けられているサイドカバー５はサイドカバー支持
柱１２に取付けられているＺレール上に沿って真下に移
動する。サイドカバー５は固定ブロック１３に固定され
ている搭載プレート３に位置決めされる。The X-direction moving unit 17 moves to the left end of the X rail 18, and the mounting plate 3 moves to just below the side cover 5. Fixed block 1 of X-direction moving unit 17
The mounting plate 3 fixed on 3 is moved to a position right below the side cover 5. If moved, Z direction movement unit 10
The side cover 5 attached to the side cover 5 moves right below along the Z rail attached to the side cover support column 12. The side cover 5 is positioned on the mounting plate 3 fixed to the fixed block 13.
【００１６】スクリューフィーダ１には微小球体である
半田ボール４が貯蔵されており、搭載プレート３に搭載
する数以上の一定量の半田ボール４を排出口２より排出
する。この時サイドカバー５は半田ボール４をスクリュ
ーフィーダ１より搭載プレート３上に落下させる時、他
に飛び散らない役目を果たす。The screw feeder 1 stores solder balls 4 which are fine spheres, and discharges a fixed amount of solder balls 4 mounted on the mounting plate 3 from the discharge port 2. At this time, when the solder balls 4 are dropped onto the mounting plate 3 from the screw feeder 1, the side covers 5 serve not to scatter other parts.
【００１７】搭載プレート３は微小球体を一定数整列に
搭載出来且つ、保持出来る。その構造を図３，図４に示
す。搭載プレート３の表面に搭載穴６２があり、そこに
は半田ボール４が１個だけ入れる又、搭載プレート３の
裏面には、吸引穴６３があり半田ボール４を真空吸引し
て固定保持する。搭載穴６２の配列は半導体素子の接続
パットの配列と合うように設けられている。The mounting plate 3 can mount and hold a certain number of microspheres in an aligned manner. Its structure is shown in FIGS. There is a mounting hole 62 on the front surface of the mounting plate 3, and only one solder ball 4 is inserted therein. Further, a suction hole 63 is provided on the back surface of the mounting plate 3 to vacuum-hold and hold the solder ball 4. The arrangement of the mounting holes 62 is provided so as to match the arrangement of the connecting pads of the semiconductor element.
【００１８】Ｘ方向移動ユニット１７上にはバイブレー
タ７と固定ブロック１３とを連結している真空ポンプ１
６がある。搭載プレート３上に供給された半田ボール４
を振動と真空吸引により搭載プレート３上の搭載穴６２
に整列搭載する。固定ブロック１３と真空ポンプ１６を
連結するチューブ１５の間にはフィルタ１４がある。こ
のフィルタ１４は半田ボール４が間違って搭載プレート
３を真空吸引している固定ブロック１３中に入り、真空
ポンプ１６中に入るのを防ぐ役目を果たす。更にバイブ
レータ７と固定ブロック１３の下には防振ゴム８，９が
設置されておりバイブレータ７の振動をＸ方向移動ユニ
ット１７に伝えるのを防ぐ。A vacuum pump 1 connecting a vibrator 7 and a fixed block 13 on the X-direction moving unit 17.
There is 6. Solder balls 4 supplied on the mounting plate 3
The mounting hole 62 on the mounting plate 3 by vibrating and vacuum suction
To line up. A filter 14 is provided between the fixed block 13 and the tube 15 connecting the vacuum pump 16. This filter 14 serves to prevent the solder balls 4 from accidentally entering the fixed block 13 that is vacuum-sucking the mounting plate 3 and entering the vacuum pump 16. Further, vibration-proof rubbers 8 and 9 are installed below the vibrator 7 and the fixed block 13 to prevent the vibration of the vibrator 7 from being transmitted to the X-direction moving unit 17.
【００１９】半田ボール４の排出はバイブレータ７の振
動が始まる直前にサイドカバー５が上昇し、バイブレー
タ７の振動により排出ストッカ６に排出される。The solder balls 4 are discharged to the discharge stocker 6 by the vibration of the vibrator 7 as the side cover 5 rises immediately before the vibration of the vibrator 7 starts.
【００２０】半田ボール４を全数搭載する動作が終了し
たならば、搭載プレート３はＸレール１８を伝わって右
端に移動し、認識動作に移る。バイブレータ７の振動に
より半田ボール４と搭載プレート３の表面が摩擦をし帯
電したものは、振動により排出ストッカ６に排出され
ず、搭載プレート３の表面に帯電したまま残る。帯電し
た半田ボール４と搭載プレート３の表面は静電気除去装
置２３よりイオンエア２４が流れ半田ボール４と搭載プ
レート３の表面は中和される。中和された半田ボール４
は、排出ノズル２１より圧縮エア２２が流れ排出ストッ
カ６に排出される。ここで、静電気除去装置２３のイオ
ンエア２４と排出ノズル２１の圧縮エア２２に使用する
気体は不活性ガスが使用される。不活性ガスを使用する
事により、一般に使用される空気の圧縮エアと比べて付
着，凝集，架橋，酸化，静電気等が発生しにくくなり、
半田ボール４が搭載プレート３に付着しない。When the operation of mounting all the solder balls 4 is completed, the mounting plate 3 moves to the right end along the X rail 18 and shifts to the recognition operation. What is charged by friction between the solder balls 4 and the surface of the mounting plate 3 due to the vibration of the vibrator 7 is not discharged to the discharge stocker 6 due to the vibration and remains charged on the surface of the mounting plate 3. Ion air 24 flows from the static electricity removing device 23 to the surfaces of the charged solder balls 4 and the mounting plate 3 to neutralize the surfaces of the solder balls 4 and the mounting plate 3. Neutralized solder balls 4
The compressed air 22 flows from the discharge nozzle 21 and is discharged to the discharge stocker 6. Here, as the gas used for the ion air 24 of the static electricity removing device 23 and the compressed air 22 of the discharge nozzle 21, an inert gas is used. By using an inert gas, adhesion, aggregation, cross-linking, oxidation, static electricity, etc. are less likely to occur compared to compressed air that is generally used,
The solder balls 4 do not adhere to the mounting plate 3.
【００２１】ＴＶカメラ２０と画像処理装置２７は搭載
プレート３の表面の搭載穴６２全数に半田ボール４が搭
載されている事と、搭載プレート３の表面に排出されな
いで残った半田ボール４の有無を撮影確認する装置であ
る。In the TV camera 20 and the image processing device 27, the solder balls 4 are mounted in all the mounting holes 62 on the surface of the mounting plate 3, and the presence or absence of the solder balls 4 left on the surface of the mounting plate 3 without being discharged. Is a device for confirming shooting.
【００２２】制御装置２５，２６はＴＶカメラ２０と画
像処理装置２７により半田ボール４が全数搭載されずに
１個でも未搭載の搭載穴６２があったり、１個でも排出
されないで搭載プレート３の表面に残った半田ボール４
が有ったならば情報を受け再トライする。搭載プレート
３の表面の搭載穴６２に半田ボール４が全数搭載され、
全て排出されていたならば次の搭載プレート３に搭載す
る。以上説明した動作を繰り返して微小球体である半田
ボール４を一定数整列に搭載出来且つ、保持出来る事を
特徴とする微小球体整列搭載方法である。The control devices 25 and 26 have the mounting holes 62 which are not yet mounted by the TV camera 20 and the image processing device 27 and in which all the solder balls 4 are not mounted. Solder ball 4 left on the surface
If there is, receive the information and try again. All the solder balls 4 are mounted in the mounting holes 62 on the surface of the mounting plate 3,
If all of them have been discharged, they are mounted on the next mounting plate 3. This is a method for aligning and mounting microspheres characterized in that the solder balls 4, which are microspheres, can be mounted and held in a fixed number by repeating the above-described operation.
【００２３】[0023]
【発明の効果】以上説明した様に本発明によれば、微小
球体を一定数整列に搭載出来且つ、保持する事が出来
る。As described above, according to the present invention, it is possible to mount and hold a certain number of microspheres in an array.
【図１】本発明の実施例を示す正面図である。FIG. 1 is a front view showing an embodiment of the present invention.
【図２】従来の実施例を示す正面図である。FIG. 2 is a front view showing a conventional example.
【図３】両面に穴があいている搭載プレートを示す略図
である。FIG. 3 is a schematic diagram showing a mounting plate with holes on both sides.
【図４】搭載プレートに半田ボールが搭載されている状
態を示す部分断面図である。FIG. 4 is a partial cross-sectional view showing a state where solder balls are mounted on a mounting plate.
１…スクリューフィーダ、２…排出口、３…搭載プレー
ト、４…半田ボール、５…サイドカバ、６…排出ストッ
カ、７…バイブレータ、８…防振ゴム、９…防振ゴム、
１０…Ｚ方向移動ユニット、１１…Ｚレール、１２…サ
イドカバー支持柱、１３…固定ブロック、１４…フィル
タ、１５…チューブ、１６…真空ポンプ、１７…Ｘ方向
移動ユニット、１８…Ｘレール、１９…不活性ガス供給
装置、２０…ＴＶカメラ、２１…排出ノズル、２２…圧
縮エア、２３…静電気除去装置、２４…イオンエア、２
５…制御装置、２６…制御装置、２７…画像処理装置。DESCRIPTION OF SYMBOLS 1 ... Screw feeder, 2 ... Ejection port, 3 ... Mounting plate, 4 ... Solder ball, 5 ... Side cover, 6 ... Ejection stocker, 7 ... Vibrator, 8 ... Antivibration rubber, 9 ... Antivibration rubber,
10 ... Z direction moving unit, 11 ... Z rail, 12 ... Side cover support pillar, 13 ... Fixed block, 14 ... Filter, 15 ... Tube, 16 ... Vacuum pump, 17 ... X direction moving unit, 18 ... X rail, 19 ... Inert gas supply device, 20 ... TV camera, 21 ... Discharge nozzle, 22 ... Compressed air, 23 ... Static electricity removing device, 24 ... Ion air, 2
5 ... Control device, 26 ... Control device, 27 ... Image processing device.
Claims (5)
持出来ることを特徴とする搭載プレート。1. A mounting plate capable of mounting and holding a fixed number of microspheres in an array.
を一定数以上プレート上に供給する手段と、供給された
微小球体を一定数整列に搭載出来且つ、保持する手段
と、余分な微小球体を排除する手段とを兼ね備えたこと
を特徴とする微小球体整列搭載方法。2. The mounting plate according to claim 1, means for supplying a predetermined number or more of microspheres onto the plate, means for mounting and holding a fixed number of the supplied microspheres in an aligned manner, and extra fine particles. A method for aligning and mounting microspheres, which is also provided with a means for eliminating spheres.
載されているか確認し、未搭載が有った場合は、未搭載
がなくなる迄再度請求項２の動作を繰り返すフィードバ
ック機構が有ることを特徴とする微小球体整列搭載方
法。3. After completion of the operation of claim 2, it is confirmed whether all the microspheres are mounted, and if they are not mounted, there is a feedback mechanism that repeats the operation of claim 2 until there is no mounting. A method for aligning and mounting microspheres characterized by the above.
を使用している時は付着，凝集，架橋，静電気等が発生
しない様に不活性ガスとイオンエア中で使用し、品質の
安定化を図ったことを特徴とする微小球体の品質管理方
法。4. When the microspheres are used for the purpose of quality control of the microspheres, the quality is stabilized by using in an inert gas and ion air so that adhesion, aggregation, cross-linking, static electricity, etc. do not occur. A quality control method for microspheres, which is characterized.
の移動方法は真空吸引や圧縮空気による高速移動によら
ないで、自然落下や緩やかな圧縮空気による低速移動を
採用したことを特徴とする微小球体整列搭載方法。5. A method of moving the microspheres for the purpose of quality control of the microspheres does not rely on high-speed movement by vacuum suction or compressed air, but adopts slow movement by natural fall or gentle compressed air. Microsphere alignment mounting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9576893A JPH06310515A (en) | 1993-04-22 | 1993-04-22 | Fine sphere alignment mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9576893A JPH06310515A (en) | 1993-04-22 | 1993-04-22 | Fine sphere alignment mounting method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000126286A Division JP2000332040A (en) | 2000-01-01 | 2000-04-21 | Method and equipment for fine sphere alignment mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06310515A true JPH06310515A (en) | 1994-11-04 |
Family
ID=14146671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9576893A Pending JPH06310515A (en) | 1993-04-22 | 1993-04-22 | Fine sphere alignment mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06310515A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998009323A1 (en) * | 1996-08-29 | 1998-03-05 | Nippon Steel Corporation | Method and device for forming very small ball bump |
| WO1998033210A1 (en) * | 1997-01-24 | 1998-07-30 | Unisys Corporation | Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package |
| US5831247A (en) * | 1995-06-19 | 1998-11-03 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for producing an electronic component provided with bumps |
| US5976965A (en) * | 1997-06-18 | 1999-11-02 | Nec Corporation | Method for arranging minute metallic balls |
| US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
| US6158649A (en) * | 1998-06-23 | 2000-12-12 | Nec Corporation | Solder ball mounting apparatus and method |
| US6170737B1 (en) | 1997-02-06 | 2001-01-09 | Speedline Technologies, Inc. | Solder ball placement method |
| JP2002295914A (en) * | 2001-03-30 | 2002-10-09 | Ekuteii Kk | Seat type cold storage member and its manufacturing method, and cold storage apparatus and freezer using same |
-
1993
- 1993-04-22 JP JP9576893A patent/JPH06310515A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5831247A (en) * | 1995-06-19 | 1998-11-03 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for producing an electronic component provided with bumps |
| WO1998009323A1 (en) * | 1996-08-29 | 1998-03-05 | Nippon Steel Corporation | Method and device for forming very small ball bump |
| WO1998033210A1 (en) * | 1997-01-24 | 1998-07-30 | Unisys Corporation | Vibrating template method of placing solder balls on the i/o pads of an integrated circuit package |
| US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
| US6170737B1 (en) | 1997-02-06 | 2001-01-09 | Speedline Technologies, Inc. | Solder ball placement method |
| US5976965A (en) * | 1997-06-18 | 1999-11-02 | Nec Corporation | Method for arranging minute metallic balls |
| US6158649A (en) * | 1998-06-23 | 2000-12-12 | Nec Corporation | Solder ball mounting apparatus and method |
| JP2002295914A (en) * | 2001-03-30 | 2002-10-09 | Ekuteii Kk | Seat type cold storage member and its manufacturing method, and cold storage apparatus and freezer using same |
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