KR100326524B1 - Ball mounting apparatus for BGA semiconductor chip - Google Patents

Ball mounting apparatus for BGA semiconductor chip Download PDF

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Publication number
KR100326524B1
KR100326524B1 KR1019990017078A KR19990017078A KR100326524B1 KR 100326524 B1 KR100326524 B1 KR 100326524B1 KR 1019990017078 A KR1019990017078 A KR 1019990017078A KR 19990017078 A KR19990017078 A KR 19990017078A KR 100326524 B1 KR100326524 B1 KR 100326524B1
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KR
South Korea
Prior art keywords
ball
hole
ball supply
balls
semiconductor chip
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KR1019990017078A
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Korean (ko)
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KR19990064832A (en
Inventor
백명열
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김종기
(주)극동테크
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Priority to KR1019990017078A priority Critical patent/KR100326524B1/en
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Publication of KR100326524B1 publication Critical patent/KR100326524B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

Abstract

PURPOSE: A ball supply apparatus for fabricating a ball grid array(BGA) semiconductor chip is provided to prevent a contact defect by making balls float and pass through a ball supplying hole one by one while picking up the balls through a vacuum absorption method. CONSTITUTION: A plurality of contact point balls(2) are contained in a ball supplying case(10). A pick-up unit(20) picks up the balls from the ball supplying case and makes the balls settled on the rear surface of an integrated circuit(IC) substrate. An air spray hole(12) is formed on the bottom of the ball supplying case. A ball receiving unit(11) having a closed structure in which the ball supplying hole(13) is formed is included in the upper surface of the ball supplying case so that the ball pass through the ball supplying hole and is supplied to the pick-up unit. The bottom of the pick-up unit is separated from the top of the ball supplying case by an interval less than the diameter of the ball. A through hole(22) having the same pattern as an attach pattern of the ball is formed on the bottom of a vacuum chamber(21). The ball supplying hole has such a diameter that the ball can pass through the ball supplying hole one by one. The ball having the same pattern as the through hole is floated by the pressure of air supplied through the air spray hole and is absorbed to the through hole through the ball supplying case one by one.

Description

볼그리드어레이 반도체칩 제조용 볼 공급장치 {Ball mounting apparatus for BGA semiconductor chip}Ball supply apparatus for ball grid array semiconductor chip manufacturing {Ball mounting apparatus for BGA semiconductor chip}

본 발명은 볼그리어레이 반도체칩 제조용 볼 공급장치에 관한 것으로서, 좀 더 상세히는 볼을 픽업하는 과정에서 에러가 발생되지 않는 새로운 구조의 볼공급장치에 관한 것이다.The present invention relates to a ball supply apparatus for manufacturing a ball gray ray semiconductor chip, and more particularly, to a ball supply apparatus having a new structure in which no error occurs in the process of picking up a ball.

근래에 IC회로기판의 배면에 접점용 볼을 부착배열시킨 볼그리드어레이 IC회로기판이 사용되고 있다. 이와같이 IC회로기판에 볼을 부착하기 위해서는 도 1에 도시된 바와 같이, 다수의 볼(2)이 담긴 볼공급통(10)에서 볼(2)을 픽업하여 IC회로기판 즉, 스트립의 접착제가 도포된 배면에 안착시켜서 부착해야 한다. 이를 위해 접점볼의 부착패턴과 동일한 패턴으로 다수의 통공(22)이 저면에 형성된 진공챔버(21)로 이루어진 픽업기구(20)로 볼을 진공흡착하여 픽업해야 한다. 그런데, 도 1에 도시된 바와같이, 정전기나 습기에 의해, 또는 다른 어떠한 이유로 해서 하나의 통공(22)에 두 개 이상의 볼(2)이 흡착되거나 하나의 볼(2)도 부착되지 않는 경우에는 이를 그대로 회로기판에 접착제로 부착시키면 접접불량이 되어 불량품이 생기게 된다.In recent years, ball grid array IC circuit boards in which a contact ball is arranged and arranged on the back surface of an IC circuit board have been used. As such, in order to attach the ball to the IC circuit board, as shown in FIG. 1, the ball 2 is picked up from the ball supply container 10 containing the plurality of balls 2 and the adhesive of the IC circuit board, that is, the strip is applied. It should be seated on the back. To this end, the ball must be vacuum-sucked by the pick-up mechanism 20 formed of the vacuum chamber 21 formed on the bottom of the plurality of through holes 22 in the same pattern as the contact pattern of the contact ball. However, as shown in FIG. 1, when two or more balls 2 are adsorbed or not attached to one through hole 22 by static electricity or moisture or for any other reason, If it is attached to the circuit board with an adhesive as it is, poor contact results in defective products.

본 발명은 전술한 바와같은 종래의 볼공급장치의 볼픽업시의 에러가능성에 착안하여 제안된 것으로서, 볼픽업시 하나의 통공에는 하나의 볼만 정확하게 흡착되도록 할 수 있는 새로운 구조의 볼공급장치를 제공하고자 하는 것이다.The present invention has been proposed in view of the possibility of error in the ball pick-up of the conventional ball supply device as described above, and provides a ball supply device of a new structure that allows only one ball to be correctly adsorbed to one through hole during the ball pick-up I would like to.

도 1은 종래의 볼공급장치의 개략 구성도1 is a schematic configuration diagram of a conventional ball supply device

도 2는 본 발명에 따른 볼공급장치의 개략구성도2 is a schematic configuration diagram of a ball supply device according to the present invention;

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

2. 볼 10. 볼공급통2. Ball 10. Ball Supply Container

12. 에어분사공 13. 볼공급공12. Air sprayer 13. Ball supply hole

20. 픽업기구 21. 진공챔버20. Pickup mechanism 21. Vacuum chamber

22. 통공22. Through

본 발명에 따르면, 다수의 접점용 볼(2)이 담긴 볼공급통(10)과, 상기 볼공급통(10)에서 볼(2)을 픽업하여 IC회로기판의 배면에 안착시키는 픽업기구(20)로 이루어진 볼그리드어레이 반도체칩 제조용 볼 공급장치에 있어서, 상기 볼공급통(10)은 저면에 에어분사공(12)이 형성되고 상면에는 볼(2)이 통과하여 상기 픽업기구(20)로 공급될 수 있도록 하는 볼공급공(13)이 형성된 폐쇄된 구조의 볼수용부(11)를 포함하고, 상기 픽업기구(20)는 그 저면이 상기 볼공급통(10)의 상면과 볼(2)의 직경보다 작은 간격만큼 이격되고 또한 그 저면에 볼의 부착패턴과 동일한 패턴의 통공(22)이 형성된 진공챔버(21)로 구성되며, 상기 볼공급공(13)은 한번에 하나의 볼만이 통과할 수 있는 지름으로 구성되며 상기 픽업기구(20)의 통공(22)과 동일한 패턴으로 형성되어, 상기 에어분사공(12)을 통해 공급되는 에어의 압력에 의해 부상된 볼(2)은 상기 볼공급통(13)을 통해 픽업기구(20)의 통공(22)에 한번에 하나씩 공급되어 흡착되는 것을 특징으로 하는 볼그리드어레이 반도체칩 제조용 볼 공급장치가 제공된다.According to the present invention, the ball supply cylinder 10 containing a plurality of contact balls (2), and the pickup mechanism for picking up the ball (2) from the ball supply cylinder 10 and seated on the back of the IC circuit board In the ball supply device for manufacturing a ball grid array semiconductor chip, the ball supply cylinder 10 has an air spraying hole 12 formed at a bottom surface thereof, and a ball 2 passing through the ball supply tube 20 to the pickup mechanism 20. And a ball receiving part 11 having a closed structure in which a ball supply hole 13 is formed to be supplied, and the pickup mechanism 20 has a bottom surface of the ball supply container 10 and a ball 2. It consists of a vacuum chamber 21 spaced apart by a distance smaller than the diameter of the through hole 22 having the same pattern as the attachment pattern of the ball on the bottom surface, the ball supply hole 13 can pass only one ball at a time It is composed of a diameter that can be formed in the same pattern as the through-hole 22 of the pickup mechanism 20, the air injection hole Ball 2, which is floated by the pressure of the air supplied through 12 is supplied to the through-hole 22 of the pick-up mechanism 20 one by one through the ball supply cylinder 13 is adsorbed at a time Provided is a ball supply apparatus for manufacturing a grid array semiconductor chip.

이하에서 도면을 참조하여 본 발명의 바람직한 실시예를 설명한다. 도 2는 본 발명에 따른 볼 공급장치의 개략적 구성도이다. 도시된 바와 같이 본 발명에 따르면, 폐쇄된 구조의 볼공급통(10)과, 이 볼공급통(10)의 상부에 근접배치된 픽업기구(20)로 구성된다. 이 볼공급통(10)은 내부에 볼수용부(11)를 포함하는데, 이 볼수용부(11)의 하부에는 에어분사공(12)으로 연통되는 에어덕트(11)가 구비된다. 따라서, 에어덕트(11)에서 공기가 유입함으로써 볼(2)을 부상시킬 수 있다. 한편, 이 볼수용부(11)의 상면에는 볼공급공(13)이 구비된다. 이 볼공급공(13)은 회로기판의 볼 부착패턴과 동일한 패턴으로 구성되고, 한번에 하나의 볼만이 통과될 수 있는 크기로 제작된다. 그리고, 바람직하게는 이 볼공급공(13)의 길이는 다수의 볼이 정렬될 수 있는 충분한 길이로 제작된다.Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention. 2 is a schematic configuration diagram of a ball supply apparatus according to the present invention. According to the present invention as shown, it is composed of a ball supply cylinder 10 of a closed structure, and the pickup mechanism 20 disposed close to the top of the ball supply cylinder (10). The ball supply cylinder 10 includes a ball accommodation portion 11 therein, the lower portion of the ball accommodation portion 11 is provided with an air duct 11 in communication with the air injection hole (12). Therefore, the air can flow from the air duct 11 to float the ball 2. On the other hand, the ball supply hole 13 is provided on the upper surface of the ball accommodation portion (11). This ball supply hole 13 is made of the same pattern as the ball attachment pattern of the circuit board, and is manufactured in a size that can pass only one ball at a time. And, preferably, the length of the ball supply hole 13 is made of sufficient length so that a plurality of balls can be aligned.

본 발명의 픽업기구(20)는 저면에 다수의 통공(22)이 형성된 진공챔버(21)로 이루어진다. 이 통공(22)도 상기 볼공급공(13)과 대응하도록 접점볼의 부착패턴과 동일한 패턴으로 구성된다. 그리고, 이 픽업기구(20)의 저면은 상기 볼공급통(10)과 근접배치됨으로써 그 틈새(d)로 볼(2)이 빠져나오지 못하도록 한다.The pickup mechanism 20 of the present invention comprises a vacuum chamber 21 in which a plurality of through holes 22 are formed on a bottom surface thereof. The through hole 22 also has the same pattern as the contact pattern of the contact ball so as to correspond to the ball supply hole 13. And the bottom surface of this pick-up mechanism 20 is arrange | positioned close to the said ball supply cylinder 10, and the ball 2 is prevented from coming out in the clearance d.

이러한 구성에 따르면, 볼공급통(10)의 볼(2)이 에어압력에 의해 부상하여 볼공급공(13)을 통해 하나씩 배출되고, 배출된 볼(2)은 픽업기구(20)의 통공(22)을 통해 진공흡착시키게 된다. 이때, 볼공급공(13)을 통해 배출되는 볼(2)은 하나씩이므로 한번에 두 개의 볼이 흡착되는 일이 없게되고, 볼공급공(13)에는 다수의 볼(2)이 채워져 대기함으로써 통공(22)에 부상된 볼(2)이 부착되지 않을 확률이 매우 적게 된다. 따라서, 볼 픽업시 하나의 통공에 다수의 볼이 부착되거나 하나의 볼도 부착되지 않는 에러의 발생이 거의 없게 되어 제작되는 반도체칩이 접점불량이 현저히 감소되게 된다.According to this configuration, the ball 2 of the ball supply cylinder 10 is floated by the air pressure and discharged one by one through the ball supply hole 13, the discharged ball (2) is a through hole of the pickup mechanism (20) 22) is vacuum adsorbed. At this time, since the balls 2 discharged through the ball supply hole 13 are one by one, two balls are not adsorbed at a time, and the ball supply hole 13 is filled with a plurality of balls 2 and is filled with air through the air ( There is a very small probability that the injured ball 2 will not attach to 22). Therefore, there is little occurrence of an error in which a plurality of balls are attached to one through hole or one ball is not attached at the time of ball pick-up, so that the defective semiconductor chip is significantly reduced.

이상에서 설명한 본 발명에 따르면, 볼을 에어에 의해 부상시켜서 하나씩만 볼공급공(13)을 통해 통과시키면서, 진공흡착하여 픽업함으로써 볼공급의 에러로 인한 접점불량을 방지하여 고품질의 반도체칩 제조에 크게 기여할 수 있다.According to the present invention described above, by floating the ball through the ball supply hole 13 by floating the ball by air, and picked up by vacuum adsorption to prevent contact failure due to the ball supply error to produce a high-quality semiconductor chip It can contribute greatly.

Claims (1)

다수의 접점용 볼(2)이 담긴 볼공급통(10)과, 상기 볼공급통(10)에서 볼(2)을 픽업하여 IC회로기판의 배면에 안착시키는 픽업기구(20)로 이루어진 볼그리드어레이 반도체칩 제조용 볼 공급장치에 있어서, 상기 볼공급통(10)은 저면에 에어분사공(12)이 형성되고 상면에는 볼(2)이 통과하여 상기 픽업기구(20)로 공급될 수 있도록 하는 볼공급공(13)이 형성된 폐쇄된 구조의 볼수용부(11)를 포함하고, 상기 픽업기구(20)는 그 저면이 상기 볼공급통(10)의 상면과 볼(2)의 직경보다 작은 간격만큼 이격되고 또한 그 저면에 볼의 부착패턴과 동일한 패턴의 통공(22)이 형성된 진공챔버(21)로 구성되며, 상기 볼공급공(13)은 한번에 하나의 볼만이 통과할 수 있는 지름으로 구성되며 상기 픽업기구(20)의 통공(22)과 동일한 패턴으로 형성되어, 상기 에어분사공(12)을 통해 공급되는 에어의 압력에 의해 부상된 볼(2)은 상기 볼공급통(13)을 통해 픽업기구(20)의 통공(22)에 한번에 하나씩 공급되어 흡착되는 것을 특징으로 하는 볼그리드어레이 반도체칩 제조용 볼 공급장치.Ball grid consisting of a ball supply cylinder 10 containing a plurality of contact balls (2), and a pick-up mechanism (20) for picking up the ball (2) from the ball supply cylinder 10 and seated on the back of the IC circuit board In the ball supply apparatus for manufacturing an array semiconductor chip, the ball supply cylinder 10 has an air spraying hole 12 formed at a bottom thereof, and a ball 2 passing through the ball supply cylinder 10 to be supplied to the pickup mechanism 20. And a ball receiving portion 11 having a closed structure in which a ball supply hole 13 is formed, and the pickup mechanism 20 has a bottom surface of which is smaller than an upper surface of the ball supply container 10 and a diameter of the ball 2. It is composed of a vacuum chamber 21 spaced apart and also formed on the bottom surface of the through hole 22 of the same pattern as the attachment pattern of the ball, the ball supply hole 13 is composed of a diameter that can pass only one ball at a time It is formed in the same pattern as the through-hole 22 of the pickup mechanism 20, it is supplied through the air injection hole (12) Ball supply for the ball grid array semiconductor chip manufacturing, characterized in that the ball (2) floating by the pressure of air is supplied to and adsorbed one by one to the through-hole 22 of the pickup mechanism 20 through the ball supply cylinder 13 at a time. Device.
KR1019990017078A 1999-05-13 1999-05-13 Ball mounting apparatus for BGA semiconductor chip KR100326524B1 (en)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR102039507B1 (en) 2019-08-26 2019-11-01 주광정밀주식회사 Manufacturing method of attach plate for ball grid array jig
KR102060126B1 (en) 2019-08-26 2019-12-27 주광정밀주식회사 Jig for ball grid array

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Publication number Priority date Publication date Assignee Title
JPH07307340A (en) * 1994-05-13 1995-11-21 Matsushita Electric Ind Co Ltd Equipment for bonding solder balls
JPH08162495A (en) * 1994-12-02 1996-06-21 Matsushita Electric Ind Co Ltd Solder ball mounting device
JPH10303250A (en) * 1997-04-25 1998-11-13 Matsushita Electric Ind Co Ltd Method for transferring conductive ball
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102039507B1 (en) 2019-08-26 2019-11-01 주광정밀주식회사 Manufacturing method of attach plate for ball grid array jig
KR102060126B1 (en) 2019-08-26 2019-12-27 주광정밀주식회사 Jig for ball grid array

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