KR200161975Y1 - Device for driving pick and place of handler system for testing semiconductor device - Google Patents

Abstract

The present invention relates to a pick and place transfer apparatus of a handler system for testing semiconductor devices for transferring pick and place to an X-Y axis. The conveying apparatus supports a pick and place 14 and is connected to an X-axis timing belt 5 driven by an X-axis driving motor, and is conveyed to the X-axis direction between trays by a conveying table 1. Is provided on one side of the transfer table 1, and is provided below the Y-axis drive motor 2 and the Y-axis drive motor 2 for driving the pick and place 14 to the Y-axis, One pulley 7 receives the driving force of the Y-axis drive motor 2 by an intermediate timing belt 10 connected to the Y-axis drive motor 2, and the other pulley 8 picks and places 14. It is characterized in that it comprises a pair of intermediate timing pulleys (7, 8) connected to the timing pulley (11) located on the other side of the transfer table (1) via the Y-axis timing belt (4) to which is connected.

Description

Pick and place transfer device for handler system for semiconductor device testing

The present invention relates to a pick and place transfer device of a handler system for testing a semiconductor device, and more particularly, to a pick and place transfer device for transporting from a customer tray containing a plurality of devices to a test tray and vice versa. A pick-and-place transfer device for a handler system for testing semiconductor devices having a structure that facilitates replacement of a timing belt used in the present invention.

In the electronics industry, it is absolutely necessary to make electronic components such as integrated circuits and semiconductor chips cheaper and smaller, and in order to increase the productivity of such electronic components, one of the methods for reducing the unit cost is a large amount of such electronic components simultaneously. Speed up the test by testing

Such an electronic component test system (e.g. IC tester) generates a variety of test signals in response to the test, and the master unit for determining the output signal of the result, and automatically move the component to be tested to the test head It consists of an automatic test handler that classifies the tested parts according to the test results.

When the device under test is tested in the semiconductor device test handler, the transfer is carried out using a tray containing a plurality of devices under test as one unit. Here, a tray used for input / output by the user side is called a customer tray, while a tray in which a semiconductor device is placed and tested is called a test tray. The measurement semiconductor device is conveyed between the customer tray and the test tray by pick and place.

FIG. 1 shows a schematic configuration of a handler system disclosed in US Patent No. 5,1234,011 of an Advanced Test Company in Japan.

Referring to FIG. 1, the handler 100 is composed of a lower cabinet 121, an intermediate portion 122, and an upper portion 123. The lower cabinet 121 houses cables, power components, and electrical connections that control the function and order of testing operations that are predominantly made in the middle and upper portions 122, 123 of the handler 100.

In FIG. 1A, the magazine input area 124 starting at the left side of the middle portion 122 is immediately adjacent to the magazine output area 125 surrounding the front center and right side of the middle portion 122 of the handler 100. These magazine input and output regions 124 and 125 may include a plurality of stations that accommodate cassettes or magazines 127 in which a plurality of customer trays 128 in which semiconductor devices 129 to be tested are arranged by the handler 100 are stacked and housed. 126). This customer tray magazine 127 and customer tray 128 are shown in exploded perspective view in FIG. 1B, and in FIG. 1A only one customer tray magazine 127 located in the magazine input area 124 is provided for ease of understanding. Although shown, it will be appreciated that the various stations of the magazine input and output regions 124 and 125 are each suitable for accommodating similar magazines 127.

In the example shown in FIG. 1A, a total of ten stations 126 are shown in the output area 125, and the number of such stations is one for testing a semiconductor device, one retest station, according to eight different categories. It provides one empty customer tray station. The number of stations in this magazine output area can be changed according to the designer's intention.

A soak chamber 131 is located to the left of the middle portion 122 of the handler 100 and extends just above the top surface 132. The infiltration chamber 131 receives the test tray 133 from the upper surface 132, the test tray 133 receives the semiconductor device 129 to be tested from the presizer 136, which in turn is the loader region 134. The semiconductor device 129 is received from the load stages 135a and 135b positioned at. The semiconductor devices 129 are conveyed from the load stages 135a and 135b to the presizer 136 and tested by means of a load pick and place 137 which is carried directly above the top surface 132 of the handler 100. It is conveyed to the tray 133.

Also, a pair of unload pick and place mechanisms including a left unload pick and place 138 and a right pick and place 139 are located just to the right of the pick and place 137. The unload pick and place 138, 139 classifies the semiconductor device 129 according to the test results, and the unload stages 62, 64 for continuous transport to the appropriate category magazine stored in the magazine output area 125 directly below. The semiconductor device 129 is positioned on the substrate. The test tray 133 containing the tested semiconductor device 129 reaches the unload pick and place 138, 139 from an unsoak chamber 140 located on the rear right side of the handler 100.

Pick and place 137, 138, and 139 picking up the semiconductor device 129 are Y along the Y-axis guide bar 141 from the customer tray 128 to the test tray 133 and vice versa, as shown in FIG. 1. It is conveyed to an axis | shaft and is also conveyed to an X-axis direction along the X-axis guide bar 142 as needed.

The X-axis feed of the pick and place 137, 138, 139 is driven by the drive of the timing belt 143 connected through the spline and the drive motor installed in the frame, the Y-axis feed is also driven motor (not shown) respectively installed in the frame Driven by.

However, the pick-and-place transfer device of the handler system for testing a conventional semiconductor device as described above has a timing belt in which pick-and-place Y-axis transfer is coupled to a timing pulley in which power of a drive motor installed in a frame is driven through a ball spline. By using a two-stage belt, the number of components increases and the structure becomes complicated, while the overall size of the device increases, requiring a large space.

In addition, the pick and place transfer device of the conventional handler system for testing a semiconductor device as described above has a problem in that, due to the complexity of the structure, disassembly and assembly for replacement and repair of the timing belt is difficult and the maintenance cost is increased.

Therefore, the object of the present invention is a simple structure, easy disassembly and assembly, low maintenance cost, easy replacement of the timing belt, miniaturization, and a small space for installation, the handler system for testing a semiconductor device To provide a pick and place transfer device.

1A is a schematic perspective view of a handler system for testing a conventional semiconductor device.

FIG. 1B is a perspective view showing the relationship between the magazine and the lifter of the handler system shown in FIG. 1A. FIG.

2 is a perspective view schematically showing a pick and place transfer device of a handler system for testing a semiconductor device according to the present invention;

Explanation of symbols on the main parts of the drawings

1: feed table 2: Y-axis drive motor

3: motor timing pulley 4: Y-axis timing belt

5: X axis timing pulley 6: X axis guide rail

7,8: intermediate timing pulley 9: bracket

10: middle timing belt 11: timing pulley

12: connection portion 13: support

14: Pick and place 15: Y-axis guide rail

The above object is, in the pick-and-place transfer device of the handler system for testing semiconductor devices for pick-and-place transfer to the XY axis, the X-axis timing belt that supports the pick-and-place and is driven by the X-axis drive motor A transfer table reciprocated in the X-axis direction between the trays; A Y-axis drive motor installed on one side of the transfer table to drive the pick and place to the Y-axis; Y-axis timing is installed under the Y-axis drive motor, one pulley receives the driving force of the Y-axis drive motor by an intermediate timing belt connected to the Y-axis drive motor, the other pulley is connected to the pick and place A pair of intermediate timing pulleys connected via a belt to timing pulleys located on the other side of the transfer table are achieved by a pick and place transfer device of a handler system for testing semiconductor devices according to the present invention. do.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

2 is a perspective view schematically showing a pick and place transfer device of a handler system for testing a semiconductor device according to the present invention.

The pick and place transfer device of the handler system for testing a semiconductor device according to the present invention transfers pick and place between trays for picking up a plurality of semiconductor devices from a tray (not shown), like a conventional pick and place transfer device. Let's do it. By this transfer operation, the pick and place is transported in the Y-axis direction, for example, to accommodate the X-axis transfer between the customer tray and the test tray and to accommodate the semiconductor device in the semiconductor device accommodation groove required in the tray.

The pick and place transfer device of the handler system for testing semiconductor devices for pick and place transfer to the XY axis is an X axis timing belt 5 driven by an X axis drive motor (not shown) as shown in FIG. X-axis guide rail 6 extending along the X-axis between the customer tray and the test tray (both not shown) by driving the X-axis timing belt 5 by driving the X-axis drive motor. It thus comprises a transfer table 1 to be transferred.

At the front lower portion of the transfer table 1, a pick and place 14 for picking up a semiconductor device is installed to guide along the Y-axis guide rail 15, and the pick and place 14 is mounted on the transfer table 1 of the transfer table 1; It is driven by the Y-axis by the drive of the Y-axis drive motor 2 provided in one side part.

Referring to the driving of the pick and place 14 in the Y-axis direction, the motor timing pulley 3 is provided on the axis of the Y-axis drive motor 2, and the motor timing pulley 3 is the Y-axis drive motor ( It is connected via the intermediate timing belt 10 to one pulley 7 of a pair of intermediate timing pulleys 7 and 8 provided on the transfer table 1 at the lower part of 2). The pair of intermediate timing pulleys 7, 8 are connected to each other by an axis (not shown) that is rotatably supported on the bracket 9, so that one intermediate timing pulley 7 is rotated by the other. Side intermediate timing pulley 8 is rotated.

The timing pulley 8 is connected to the timing pulley 11 located on the other side of the transfer table 1 via the Y-axis timing belt 4 to which the support 13 of the pick and place 14 is connected. The pick and place 14 provided in the Y-axis timing belt 4 is moved in accordance with the drive of the Y-axis timing belt 4.

The Y-axis movement of the pick and place 14 is the amount of rotation of the Y-axis drive motor 2 because the connecting portion 12 located on the upper portion of the support 13 is fixedly connected to the Y-axis timing belt 4. It is precisely controlled according to the drive amount of the Y-axis timing belt 4 which is driven by.

Therefore, the pick and place 14 can be controlled by a central control device that controls the drive of the Y-axis drive motor 2.

According to the pick-and-place transfer device of the handler system for testing a semiconductor device according to the present invention, a Y-axis drive motor for driving the pick-and-place to the Y-axis is provided on a transfer table that supports the pick-and-place, and the Y-axis drive motor Since the driving force transmission structure for transmitting the driving force to the pick and place is simple and easy to disassemble and assemble, the maintenance cost can be reduced.

In addition, since a plurality of timing pulleys in which the timing belts are installed are provided in the transfer table as a simple structure, when the timing belt is damaged or worn out, not only the timing belt is easily replaced, but also the Y-axis drive motor and the plurality of timings. Since the belt is installed on the transfer table, the overall size of the apparatus can be miniaturized, and the space for installing the apparatus can be reduced.

Claims (1)

A pick-and-place transfer device of a handler system for testing semiconductor devices for pick-and-place transfer in the X-Y axis, A transfer table for supporting pick and place and connected to an X-axis timing belt driven by an X-axis driving motor, the transfer table reciprocating in the X-axis direction between the trays; A Y-axis drive motor installed on one side of the transfer table to drive the pick and place to the Y-axis; It is installed under the Y-axis drive motor, one pulley receives the driving force of the Y-axis drive motor by an intermediate timing belt connected to the Y-axis drive motor, the other pulley is a timing belt connected to the pick and place And a pair of intermediate timing pulleys connected to the Y-axis timing pulleys located on the other side of the transfer table via the pick-and-place transfer device of the handler system for testing a semiconductor device.