KR100398321B1 - Method for loading/unloading single array module printed circuit board - Google Patents

Abstract

PURPOSE: A method for loading/unloading a single array module printed circuit board is provided to reduce the manufacturing cost by mounting the single array module printed circuit board on a jig in a multiple array form. CONSTITUTION: A tray(86) loading vertically a single module printed circuit board(85) is mounted on a first mounting unit. A jig is loaded on a jig loading unit(15). The jig is carried from the jig loading unit(15) to an assembling unit(40). The tray(86) is carried to a tray loading unit(26). The single module printed circuit board(85) is horizontally changed by a rotation unit(60) to be mounted on the jig of the assembling unit(40). The position of the single module printed circuit board(85) on the jig is arranged. The jig mounted with the single module printed circuit board(85) is carried to a working region.

Description

Single Array Module PCB Loading / Unloading Method

The present invention relates to a method for loading / unloading a module printed circuit board, and more particularly, to mount a module printed circuit board of a single array as well as a module array in a jig in a soft array form. The present invention relates to a method of loading / unloading a single array module printed circuit board which can be automatically loaded into and unloaded from a work area.

Module printed circuit boards are manufactured in soft and single arrays. Currently, about 80% of the module printed circuit boards used in the module assembly process have a soft arrangement. Such a soft array module printed circuit board is manufactured to have a soft array shape by processing a material plate having a predetermined size.

The assembling process of a memory module using a module array type printed circuit board is generally performed in a state in which a jig, which is a fixing means for fixing a module printed circuit board, is mounted. Loading into the screen printing work area during the memory module assembly process will be described by way of example.

1 is a plan view showing an embodiment of a memory module printed circuit board in a soft array form, and FIG. 2 is a perspective view showing an embodiment of a conventional jig. 1 and 2, a module array printed circuit board 90 having a soft array type has a structure in which edge portions of a plurality of unit module printed circuit boards 91 are connected to each other by side rails 92 and are integrally formed. Have In the side rail 92, a through hole 93 is formed in a predetermined shape. The screen printing process for forming circuit patterns on the soft array module printed circuit board 90 proceeds with the module printed circuit board 90 mounted on the jig 80. The jig 180 has a positioning pin 181 that can be inserted into the through hole 93 of the soft array module printed circuit board 90. The continuous array module printed circuit board 90 may be fixed by inserting the positioning pin 181 into the through hole 93. The jig 180 on which the sequence array module printed circuit board 90 is mounted is loaded into the work area of screen printing by the transfer means.

By the way, the soft array printed circuit board may be formed by working on a material plate of a certain size, but rather than manufacturing a module array circuit board having a soft array type per unit size of material. Manufacturing module printed circuit boards is much more cost-effective. In other words, the number of module printed circuit boards that can be fabricated from a unit sized material plate varies greatly. After all, in the module assembly process, the memory module substrates in the soft array form are separated in a single array form. Therefore, unnecessary parts, such as side rails of a module array module in the form of soft arrays, increase the cost.

In addition, if any unit module printed circuit board is defective in a certain number of soft-array module printed circuit boards, the module assembly process readjusts various assembly devices for performing work due to the defective unit module printed circuit board. You should. However, the occurrence of defects is usually irregular in soft array form. For example, when five module printed circuit boards are arranged in series, the first module printed circuit board may be defective, the other may be defective, and one or more may be generated. Therefore, the memory module assembly process including the defective unit module printed circuit board greatly affects the productivity. Modular printed circuit boards in which assembly devices have different locations of defects cause problems such as increased time spent in production by adjusting the assembly device for work, interruption of the assembly process, and fatigue of workers. .

These problems can be solved if the process proceeds with only a module printed circuit board in a good state mounted on the jig by using a module array circuit board having a single array type. At present, the module assembly process of the module array printed circuit board of the single array type is performed by manually fixing the module array printed circuit board of the single array type to the jig by hand. Then, a tape is attached to fix the single array module printed circuit board mounted on the jig during the process. However, the progress of the process increases the production cost by complicating the process, there is a problem caused by the tape during the process is required to replace the technology.

Accordingly, an object of the present invention is to provide a method of loading / unloading a single array module printed circuit board to automatically load / unload a single array module printed circuit board in a module assembly process.

1 is a plan view showing an embodiment of a memory module printed circuit board in a continuous array form.

Figure 2 is a perspective view showing an embodiment of a conventional jig.

Figure 3 is a schematic diagram of an automatic module printed circuit board loading / unloading apparatus according to the present invention.

4 is a perspective view showing a jig used in the present invention.

<Description of Symbols for Main Parts of Drawings>

10: loading / unloading device 15: jig loading unit

20: first mounting portion 26: tray loading portion

30: second mounting portion 40: assembly portion

50: alignment unit 60: rotation unit

70 picker 72 gripper

74,76: Conveyor Belt 80: Jig

81: holder 82: spring

84: jig body 85: single array module printed circuit board

86 tray 90 lead array module printed circuit board

91: module module printed circuit board 92: side rail

93: through hole

In order to achieve the above object, a single array module printed circuit board loading method includes mounting a tray in which a single array module printed circuit board is stacked vertically in a first mounting unit, and loading a jig into a jig stacking unit. ; A tray transfer step of transferring the jig from the jig loading part to the assembly part and transferring the tray to the tray loading part; An assembling step of mounting the single-array module printed circuit board on the jig located in the assembling unit by changing the state from the vertical to the horizontal by the rotation unit; An alignment step of aligning positions of the single array module printed circuit boards located in the jig; A transfer step of transferring the jig in which the single-array module printed circuit board is mounted to a work area; Characterized in having a.

In addition, the single-array module printed circuit board unloading method for achieving the above object comprises a transfer step of transferring the jig in which the single-array module printed circuit board is completed in a horizontal state to the assembly unit; A stacking step of separating the single-array module printed circuit board from the jig, changing the horizontal alignment from the horizontal state to the vertical state, and stacking the printed circuit board in the tray loading unit; A jig transfer step of transferring the jig to a jig loading unit; Characterized in that it comprises a. Hereinafter, a module printed circuit board loading / unloading method according to the present invention will be described in detail with reference to the accompanying drawings.

Figure 3 is a schematic configuration diagram of an automatic module printed circuit board loading / unloading apparatus according to the present invention, Figure 4 is a perspective view showing a jig used in the present invention. An apparatus to which the module printed circuit board automatic loading / unloading method according to the present invention is applicable includes a first mounting part, a tray loading part, a jig loading part, a second mounting part, a rotation part, an assembly part, and an alignment part. The first mounting part 20 is mounted with a tray having a structure in which a single array module printed circuit board can be held in a vertical direction. The tray loading unit 26 is a portion in which the tray on which the single array module printed circuit board transferred from the first mounting unit 20 is mounted is placed in the air. The jig loading part 15 is a part loaded in the vertical direction so as to maintain a horizontal state of the jig in which the module printed circuit board is assembled. The second mounting portion 30 is mounted with a tray that can accommodate the PCB array module in the horizontal direction. The rotation unit 60 makes the single array module printed circuit board of the first mounting unit horizontal. The assembly unit 40 mounts the module printed circuit board of the rotation unit or the soft array module printed circuit board of the second mounting unit on the jig. The alignment unit 50 aligns the module printed circuit board mounted on the jig.

First, a method of loading a single array module printed circuit board. In a first step, a tray 86 in which a single array module printed circuit board 85 is vertically stacked is mounted on the first mounting portion 20, and the jig 80 is prepared to be loaded on the jig stacking portion 15. Carry out the steps. The short array module printed circuit board 85 to be transferred to the work area may be any of a bare module printed circuit board and a module printed circuit board on which surface mounting elements or circuit patterns are formed on one surface thereof. On the first mounting portion 20, a tray 86 on which a bare module printed circuit board or a single array module printed circuit board 85 on which a surface-mounted device is mounted on one surface is mounted in a vertical state is mounted. The jig 80, which can be mounted and fixed, is loaded on the jig stacking unit 15. The jig 80 may be fixed to the jig body 84 by applying a force 81 to the jig body 84 by an inward direction. The jig 80 may have a module array of multiple arrays or a plurality of single array module printed circuit boards. It is a structure in which 85 can be mounted. This jig 80 is vertically mounted on the jig mounting part 15.

In the second step, the jig 80 is transferred from the jig loading unit 15 to the assembly unit 40, and the tray 86 is transferred to the tray loading unit 26. At this time, the transfer of the jig 80 and the tray 86 may be transferred by a transfer means such as conveyor belts (76, 74). From the bottom of the jig 80, which is vertically stacked on the jig loading unit 15, the conveyor belt 76 is sequentially transferred to the assembly unit 40 one by one. The tray is also conveyed to the tray loading section 26 by the conveyor belt 74.

In the third step, the single-array module printed circuit board 85 is changed from vertical to horizontal by the rotation unit 60 and mounted on the jig 80 located in the assembly unit 40. When the vertical array module printed circuit board 85 mounted vertically on the tray 86 is picked up by a gripper 72 in the form of a tong and moved to the rotation unit 60, the rotation unit 60 is vertically aligned. The array module printed circuit board 85 is rotated by 90 degrees to maintain a horizontal state, and the vacuum picker picker 70 is transferred to the workable area. A picker 70 operated by a vacuum is mounted on the jig 80 located in the assembly unit 40. At this time, the jig 80 is a state in which the spare portion required for mounting is secured by the assembly portion 40 moving the fixing base 81 of the jig 80 to the outside direction. When the single array module printed circuit board 85 is mounted on the jig 80, the fixing unit 81 of the assembly unit 40 pushes the single array module printed circuit board 85 with force by the spring 82 to fix the unit array module printed circuit board 85. Let's do it.

In a fourth step, the positions of the single array module printed circuit boards 85 located on the jig 80 are aligned. When conveyed by the conveyor belt 76 to the position alignment unit 50, the position alignment unit 50 moves the module printed circuit board in the reference direction to align the position.

In a fifth step, the jig 80 in which the single array module printed circuit board 85 is mounted is transferred to the work area. The single array module printed circuit board 85 placed at the correct position in the alignment unit 50 is formed by the conveyor belt 76 connected from the jig loading unit 15 to the work area.

The method of unloading the single-array module substrate on which one surface is mounted or the single-array module substrate on which both surfaces are mounted may be performed in the reverse order of the loading method. That is, in the first step, the jig in which the single-array module printed circuit board, which has been completed, is mounted in a horizontal state is transferred to the assembly unit. It is conveyed from the work area to the assembly by means of conveying means such as a conveyor belt. In the second step, the jig transfers the single array module printed circuit board to the rotation unit. The single array module printed circuit board placed on the rotation part by the picker and the rotation part mounted horizontally on the jig is rotated by 90 degrees to be converted to the vertical state, and transferred to the area where the gripper can operate. In a fourth step, a vertical array module printed circuit board in a vertical state is picked up by a gripper and mounted on a tray tray waiting in advance. Then, the empty jig from which all the products are removed is transferred back to the jig loading part.

In the above-described manner, a module printed circuit board has various advantages by automatically arranging a module array of short array module printed circuit boards in a jig form during loading into and unloading from the work area. First, when manufacturing a module printed circuit board, manufacturing in a single array rather than manufacturing a soft array may greatly increase the yield in the unit material plate. In addition, work can be carried out only with a good module printed circuit board. Therefore, there is no need for an additional sorting process for working with a conventionally arranged module printed circuit board, and the machine can be operated without interruption of the process, thereby achieving significant time and cost savings. By eliminating unnecessary effort, work efficiency can be improved.

Therefore, according to the structure of the present invention, it is possible to load and unload a single array module printed circuit board in a good state, there is an advantage that can simplify the process to reduce the production cost.

Claims (3)

A preparatory step of mounting the tray on which the module array circuit boards of the single arrangement are vertically mounted on the first mounting portion, and loading the jig on the jig loading portion; A tray transfer step of transferring the jig from the jig loading part to the assembly part and transferring the tray to the tray loading part; An assembling step of mounting the single-array module printed circuit board on the jig located in the assembling unit by changing the state from the vertical to the horizontal by the rotation unit; An alignment step of aligning positions of the single array module printed circuit boards located in the jig; A transfer step of transferring the jig in which the single-array module printed circuit board is mounted to a work area; Single array module printed circuit board loading method comprising a. The method of claim 1, wherein the rotation unit includes a gripper mounted on the rotation means and a picker transferred from the rotation means to the assembly unit. A transfer step of transferring the jig in which the single-array module printed circuit board on which the operation is completed is mounted in a horizontal state to the assembly unit; A stacking step of separating the single-array module printed circuit board from the jig, changing the horizontal alignment from the horizontal state to the vertical state, and stacking the printed circuit board in the tray loading unit; A jig transfer step of transferring the jig to a jig loading unit; Single-row module printed circuit board unloading method comprising a.