KR20010105658A - The jig for printing cream solder of flexible PCB and their method - Google Patents

Abstract

An optical disk apparatus comprising an optical disk on which pits corresponding to data bits are arranged in a track tangential direction, a motor drive unit for rotating the optical disk, and a reproducing unit for reproducing the pits, wherein the length PL of each of the pits is set at such a value as to satisfy a condition of following equation 0.55 <= (fT.PL) /(n.Sr1) <= 1.50. where the scanning linear velocity at which the disk is rotated by the motor drive unit when the reproducing unit reproduces the pits recorded in a radius r1 of the disk is set to Srl [m/s], a preset channel bit rate in the radius r1 of the optical disk is set to fT[b/s], the pits correspond to data recorded in correspondence to the n-channel bit length, and the pit length in the track tangential direction is set to PL [m].

Description

Jig and soft array cream solder printing method for flexible array solder paste of flexible PCBs {The jig for printing cream solder of flexible PCB and their method}

The present invention relates to a jig for soft array cream solder printing and a soft array cream solder printing method of a flexible PCB.

As is well known, cellular phones are very small and have a flexible PC inside. In addition, a very fine circuit line is printed on the flexible PC, and the part is inserted and soldered. However, since the circuit line is finely printed, soldering is impossible after inserting the part using the conventional method. The cream-like solder is first applied precisely to the printed circuit line, and then the parts are inserted and soldered by applying hot heat instantly.

In this work, however, the flexible PCB used in the cellular phone is small, so that the productivity is high and the production cost is increased at the time of working one by one. There is a need for a way to work.

However, since the circuit lines are very finely printed on the flexible PC, the cream solder may not be accurately applied to the circuit lines even if the angle or direction automatically inserted into the soldering machine is slightly different. Therefore, it is of utmost importance to arrange the flexible PCs without error in the correct position on the substrate.

Accordingly, the present invention has developed a jig that can easily and flexibly arrange flexible PCs more quickly and accurately. The jig of the present invention is a jig which can arrange a flexible PC in an accurate position without any error and maintain the exact position without any distraction after the arrangement. The reference pins are installed at four corners and the center A pin base having a soft array reference pin installed therein, a back board having the same size as the pin base and having a reference pin insertion hole and a soft array reference pin insertion hole coincident with the position of the reference pin position and the position of the soft alignment reference pin. It consists of a printing base having the same size and the same reference pin as the reference pin.

The method of applying the cream solder using the present invention jig starts with the soft arrangement of the flexible PCB. In other words, the backboard fabricated on the pin base with the same pitch is piled up and bonded. Then, the heat-resistant double-sided adhesive tape is bonded lengthwise on the backboard. Next, fit the drill hole drilled in the flexible PC to the lead array pin that protrudes into the lead array pin insertion hole of the backboard. After the soft array operation is completed, remove the backboard from the pin base, attach it to the printing base, and apply the cream solder from the soldering machine.

1 is a perspective view of a pin base

2 is a perspective view of a backboard

3 is a perspective view of a printing base;

4 is a view for explaining a cream solder printing method

Figure 4A is a back board coupled to the pin base

Figure 4B is a state in which the heat-resistant double-sided adhesive tape bonded to the back board

4C is a state in which the flexible PC ratio

4D is a state in which the flexible PCB is continuously separated from the pin base by the rear board

4E is a state in which the backboard separated from the pin base is coupled to the printing base;

4F is a state in which the soldering machine

4G is a state to insert into the component inserter

4H is a view showing a state to be put into the heater.

<Description of the symbols for the main parts of the drawings>

1. Pin Base 2. Reference Pin

3. Reference pin 4. Back board

5. Insertion hole 6. Lead array pin

7. Printing base 8. Reference pin

10. Double Sided Tape 11. Flexible PCB

21. Component inserter 22. Heater

The soft array cream solder printing jig of the present invention is composed of three plates of the same size and generally rectangular, such as a pin base 1, a back board 4, and a printing base 7.

The pin base 1 is provided with reference pins 2 at four corners, the height of which is equal to or slightly longer than the thickness of the backboard described below. In the center of the pin base (1), a soft array reference pin (3) protrudes. The soft array reference pin has four working holes formed in the flexible PCB and four pins formed in the same size as one basic unit. The number of flexible PCs to be arranged is provided and the height is formed higher than the combined thickness of the back board 4 and the flexible PCs as described below.

The back board 4 has a reference pin insertion hole 5 formed at four corners, and the position thereof is the same as that of the reference pin 2 of the pin base 1, and the inner diameter of the insertion hole 5 is the reference pin ( It is equal to or slightly larger than the outer diameter of 2). In addition, a soft array reference pin insertion hole 6 is drilled in the center, which is basically the same position as the position of the soft array reference pin 3 of the pin base 1, and the inner diameter is the outer diameter of the soft array reference pin 3. Equal to or slightly larger than, and perforated at regular intervals throughout the backboard.

The base 7 for printing has only the same reference pin 8 as the pin base 1 and the same position and size as the reference pin 2.

The method of printing the cream solder on the flexible PCB using the present invention jig configured as described above is as follows.

The printing method of the cream solder using the present invention jig starts with the soft array operation of the flexible PC 11 first. That is, as shown in FIG. 4A, the back board 4 made of the same standard is stacked on the pin base 1 and combined. Then, the four reference pins 2 of the pin base 1 are inserted into the reference pin insertion holes 5 of the back board 4, and the soft array reference pins 2 are the soft alignment reference pin insertion holes of the back board 4 ( 6) penetrates upwards.

Then, as shown in FIG. 4B, the double-sided tape 10 having a heat-resistant double-sided tape 10 on the back board 4 is longitudinally bonded to the position where the flexible PC 11 is to be arranged.

Next, as shown in (C) of FIG. 4, the hole 12 for drilling the flexible PC 11 into the soft array reference pin 3 protruding into the soft array reference pin insertion hole 6 of the back board 4 is formed. Fit in. Then, the flexible PC 11 is bonded to the double-sided tape 10 while holding the correct position so that the position of the flexible PC is not changed.

When the soft alignment operation is completed as described above, the backboard 4 is separated from the pin base 1 as shown in FIG. 4D and the flexible PCB 11 is softly arranged as shown in FIG. 4) is bonded to the printing base (7) to pass the soldering machine 20 as shown in Figure 4 (F) in this state to print the cream solder.

On the other hand, when the cream solder is printed on the flexible PCB, as shown in FIG. 4 (G), the parts are inserted through the component inserter 21 while the back board 4 is separated from the printing base 7. It inserts, passes through heaters 22 as shown in Fig. 4H, and heats up and down to complete the soldering operation.

The present invention as described above, in printing the cream solder on the flexible PCB used in the cellular phone, it is possible to quickly and precisely arrange a plurality of flexible PCB in order to improve the productivity significantly, the flexible PCB on the back board Can be arranged in the same position without error at all times in the process of arranging, so that the defect rate can be greatly reduced when printing the cream solder.

Claims (2)

As a flexible jig for solder array printing of flexible PCB consisting of a pin base 1, a back board 4 and a printing base 7 of the same size, The pin base 1 is provided with reference pins 2 at four corners, and four pins formed at the same intervals with four working holes formed in the flexible PCB are arranged as one basic unit. The number of flexible PCs to be arranged is formed at regular intervals, The back board 4 is perforated at four corners with a reference pin insertion hole 5 which is the same as the position of the reference pin 2 of the pin base 1 and whose inner diameter is the same as the outer diameter of the reference pin 2. As the lead array reference pin insertion hole (6) the same as the outer diameter of the lead array reference pin (3) is drilled, The base 7 for printing is a jig for flexible array cream solder printing of a flexible PCB, in which a standard pin 8 having the same size as the pin base 1 and having the same position and size is formed. A method of printing a cream solder on a flexible array of flexible PCBs using a jig composed of a pin base (1), a back board (4) and a printing base (7) of the same size, Combining the reference pin insertion hole (5) and the soft array reference pin insertion hole (6) to the back board (4) on which the reference pin (2) and the soft array reference pin (3) protrude; Wow, Adhering the heat resistant double-sided adhesive tape 10 to the back board 4 coupled to the pin base 1, Inserting the working holes 12 of the flexible array reference pin 3 and the flexible PC 11 protruding onto the back board 4 to fix the flexible PC to the double-sided adhesive tape 10 on the back board; The flexible PCB 11 is arranged on the printing base 7 having the reference board 8 formed at the same size and position as the reference pin 2 of the pin base 1 by separating the back board 4 having the flexible arrangement from the pin base 1. Combined, characterized in that the step consisting of supplying a cream soldering machine (20), flexible array of soft solder cream printing method.