KR20010043252A - 공축 구동축을 구비한 듀얼 아암 장치 - Google Patents

공축 구동축을 구비한 듀얼 아암 장치 Download PDF

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Publication number
KR20010043252A
KR20010043252A KR1020007012200A KR20007012200A KR20010043252A KR 20010043252 A KR20010043252 A KR 20010043252A KR 1020007012200 A KR1020007012200 A KR 1020007012200A KR 20007012200 A KR20007012200 A KR 20007012200A KR 20010043252 A KR20010043252 A KR 20010043252A
Authority
KR
South Korea
Prior art keywords
arm
assembly
drive shaft
drive
driven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020007012200A
Other languages
English (en)
Korean (ko)
Inventor
데이비드 알. 뷰루
Original Assignee
스탠리 디. 피에코스
브룩스 오토메이션 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스탠리 디. 피에코스, 브룩스 오토메이션 인코퍼레이티드 filed Critical 스탠리 디. 피에코스
Publication of KR20010043252A publication Critical patent/KR20010043252A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/06—Marking or engraving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20323—Robotic arm including flaccid drive element

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020007012200A 1998-05-04 1999-04-06 공축 구동축을 구비한 듀얼 아암 장치 Withdrawn KR20010043252A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/072,097 US6547510B1 (en) 1998-05-04 1998-05-04 Substrate transport apparatus with coaxial drive shafts and dual independent scara arms
US09/072,097 1998-05-04
PCT/US1999/007526 WO1999056920A1 (en) 1998-05-04 1999-04-06 Dual arm apparatus with co-axial drive shafts

Publications (1)

Publication Number Publication Date
KR20010043252A true KR20010043252A (ko) 2001-05-25

Family

ID=22105547

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007012200A Withdrawn KR20010043252A (ko) 1998-05-04 1999-04-06 공축 구동축을 구비한 듀얼 아암 장치

Country Status (6)

Country Link
US (1) US6547510B1 (https=)
EP (1) EP1107853A1 (https=)
JP (1) JP4620866B2 (https=)
KR (1) KR20010043252A (https=)
AU (1) AU3384199A (https=)
WO (1) WO1999056920A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2431263A1 (es) * 2013-04-23 2013-11-25 Barnizados Industriales, S.A. Placa para falso techo o pared, procedimiento de fabricación de dicha placa
KR20150038000A (ko) * 2012-07-05 2015-04-08 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들에서 기판들을 운송하기 위한 붐 구동 장치, 멀티-아암 로봇 장치, 전자 디바이스 프로세싱 시스템들, 및 방법들

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US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
US6663333B2 (en) * 2001-07-13 2003-12-16 Axcelis Technologies, Inc. Wafer transport apparatus
US20030202865A1 (en) * 2002-04-25 2003-10-30 Applied Materials, Inc. Substrate transfer apparatus
US7891935B2 (en) 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
US6789793B2 (en) * 2002-05-24 2004-09-14 Heidelberger Druckmaschinen Ag Rotary signature transport device
US7384907B2 (en) * 2002-12-13 2008-06-10 Duke University Method of treating infection with ABl tyrosine kinase inhibitors
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20050255953A1 (en) * 2004-05-12 2005-11-17 Timothy Puckett Band Drive System for Telescopes, LIDAR and Other Instruments
CN101023429B (zh) * 2004-07-02 2010-09-01 斯特拉斯鲍公司 用于处理晶片的方法和系统
US8052030B2 (en) 2005-01-24 2011-11-08 The Boeing Company Apparatus for friction stir welding using spindle-in-spindle
US20100108709A1 (en) 2004-12-30 2010-05-06 Plas-Pak Industries Cartridge delivery system utilizing film bags
US9517488B2 (en) 2004-12-30 2016-12-13 Plas-Pak Industries, Inc. Component delivery system utilizing film bags
US8167522B2 (en) * 2005-03-30 2012-05-01 Brooks Automation, Inc. Substrate transport apparatus with active edge gripper
WO2007061603A2 (en) * 2005-11-21 2007-05-31 Applied Materials, Inc. Methods and apparatus for transferring substrates during electronic device manufacturing
US7946800B2 (en) * 2007-04-06 2011-05-24 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms
SG147353A1 (en) * 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
US9623555B2 (en) 2010-11-10 2017-04-18 Brooks Automation, Inc. Dual arm robot
US8918203B2 (en) * 2011-03-11 2014-12-23 Brooks Automation, Inc. Substrate processing apparatus
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
KR102465277B1 (ko) * 2013-01-18 2022-11-09 퍼시몬 테크놀로지스 코포레이션 로봇, 전자 장치 처리 시스템, 기판 이송 방법
TWI672191B (zh) * 2013-10-16 2019-09-21 Applied Materials, Inc. 帶有裝設樞紐手臂之化學機械拋光機的系統及方法
CN104795347B (zh) * 2014-01-22 2018-05-04 北京北方华创微电子装备有限公司 晶圆支撑装置和去气工艺腔室
US11691268B2 (en) * 2015-03-12 2023-07-04 Persimmon Technologies Corporation Robot having a variable transmission ratio
WO2016172003A1 (en) * 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
JP7196101B2 (ja) 2017-02-15 2022-12-26 パーシモン テクノロジーズ コーポレイション 複数のエンドエフェクタを備えた材料取り扱いロボット
US10629472B2 (en) 2017-08-17 2020-04-21 Persimmon Technologies Corporation Material handling robot
CN107717959B (zh) * 2017-11-07 2020-08-14 大连理工大学 一种部分解耦的scara高速并联机械手
CN110652357B (zh) * 2019-09-19 2020-06-12 中国科学院自动化研究所 双导丝或球囊的血管介入器械操控装置
US11679046B2 (en) 2019-11-04 2023-06-20 GE Precision Healthcare LLC Method and system for providing dual axes motions using a single drive
TWI851868B (zh) * 2020-01-23 2024-08-11 美商布魯克斯自動機械美國公司 基板運送設備
TWI767556B (zh) * 2021-02-08 2022-06-11 鴻勁精密股份有限公司 載具機構及其應用之作業設備

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150038000A (ko) * 2012-07-05 2015-04-08 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들에서 기판들을 운송하기 위한 붐 구동 장치, 멀티-아암 로봇 장치, 전자 디바이스 프로세싱 시스템들, 및 방법들
ES2431263A1 (es) * 2013-04-23 2013-11-25 Barnizados Industriales, S.A. Placa para falso techo o pared, procedimiento de fabricación de dicha placa

Also Published As

Publication number Publication date
JP2002514001A (ja) 2002-05-14
EP1107853A1 (en) 2001-06-20
AU3384199A (en) 1999-11-23
WO1999056920A1 (en) 1999-11-11
US6547510B1 (en) 2003-04-15
JP4620866B2 (ja) 2011-01-26

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20001102

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid