AU3384199A - Dual arm apparatus with co-axial drive shafts - Google Patents

Dual arm apparatus with co-axial drive shafts

Info

Publication number
AU3384199A
AU3384199A AU33841/99A AU3384199A AU3384199A AU 3384199 A AU3384199 A AU 3384199A AU 33841/99 A AU33841/99 A AU 33841/99A AU 3384199 A AU3384199 A AU 3384199A AU 3384199 A AU3384199 A AU 3384199A
Authority
AU
Australia
Prior art keywords
drive shafts
axial drive
arm apparatus
dual arm
dual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU33841/99A
Other languages
English (en)
Inventor
David R. Beaulieu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of AU3384199A publication Critical patent/AU3384199A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/06—Marking or engraving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20323—Robotic arm including flaccid drive element

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU33841/99A 1998-05-04 1999-04-06 Dual arm apparatus with co-axial drive shafts Abandoned AU3384199A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09072097 1998-05-04
US09/072,097 US6547510B1 (en) 1998-05-04 1998-05-04 Substrate transport apparatus with coaxial drive shafts and dual independent scara arms
PCT/US1999/007526 WO1999056920A1 (en) 1998-05-04 1999-04-06 Dual arm apparatus with co-axial drive shafts

Publications (1)

Publication Number Publication Date
AU3384199A true AU3384199A (en) 1999-11-23

Family

ID=22105547

Family Applications (1)

Application Number Title Priority Date Filing Date
AU33841/99A Abandoned AU3384199A (en) 1998-05-04 1999-04-06 Dual arm apparatus with co-axial drive shafts

Country Status (6)

Country Link
US (1) US6547510B1 (https=)
EP (1) EP1107853A1 (https=)
JP (1) JP4620866B2 (https=)
KR (1) KR20010043252A (https=)
AU (1) AU3384199A (https=)
WO (1) WO1999056920A1 (https=)

Families Citing this family (38)

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US6450755B1 (en) * 1998-07-10 2002-09-17 Equipe Technologies Dual arm substrate handling robot with a batch loader
US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
US6663333B2 (en) * 2001-07-13 2003-12-16 Axcelis Technologies, Inc. Wafer transport apparatus
US20030202865A1 (en) * 2002-04-25 2003-10-30 Applied Materials, Inc. Substrate transfer apparatus
US7891935B2 (en) 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
US6789793B2 (en) * 2002-05-24 2004-09-14 Heidelberger Druckmaschinen Ag Rotary signature transport device
US7384907B2 (en) * 2002-12-13 2008-06-10 Duke University Method of treating infection with ABl tyrosine kinase inhibitors
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US20050255953A1 (en) * 2004-05-12 2005-11-17 Timothy Puckett Band Drive System for Telescopes, LIDAR and Other Instruments
CN101023429B (zh) * 2004-07-02 2010-09-01 斯特拉斯鲍公司 用于处理晶片的方法和系统
US8052030B2 (en) 2005-01-24 2011-11-08 The Boeing Company Apparatus for friction stir welding using spindle-in-spindle
US20100108709A1 (en) 2004-12-30 2010-05-06 Plas-Pak Industries Cartridge delivery system utilizing film bags
US9517488B2 (en) 2004-12-30 2016-12-13 Plas-Pak Industries, Inc. Component delivery system utilizing film bags
US8167522B2 (en) * 2005-03-30 2012-05-01 Brooks Automation, Inc. Substrate transport apparatus with active edge gripper
WO2007061603A2 (en) * 2005-11-21 2007-05-31 Applied Materials, Inc. Methods and apparatus for transferring substrates during electronic device manufacturing
US7946800B2 (en) * 2007-04-06 2011-05-24 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms
SG147353A1 (en) * 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
US9623555B2 (en) 2010-11-10 2017-04-18 Brooks Automation, Inc. Dual arm robot
US8918203B2 (en) * 2011-03-11 2014-12-23 Brooks Automation, Inc. Substrate processing apparatus
WO2014008009A1 (en) * 2012-07-05 2014-01-09 Applied Materials, Inc Boom drive apparatus, multi-arm robot apparatus, electronic device processing systems, and methods for transporting substrates in electronic device manufacturing systems
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
KR102465277B1 (ko) * 2013-01-18 2022-11-09 퍼시몬 테크놀로지스 코포레이션 로봇, 전자 장치 처리 시스템, 기판 이송 방법
ES2431263B1 (es) * 2013-04-23 2014-09-10 Barnizados Industriales, S.A. Placa para falso techo o pared, procedimiento de fabricación de dicha placa
TWI672191B (zh) * 2013-10-16 2019-09-21 Applied Materials, Inc. 帶有裝設樞紐手臂之化學機械拋光機的系統及方法
CN104795347B (zh) * 2014-01-22 2018-05-04 北京北方华创微电子装备有限公司 晶圆支撑装置和去气工艺腔室
US11691268B2 (en) * 2015-03-12 2023-07-04 Persimmon Technologies Corporation Robot having a variable transmission ratio
WO2016172003A1 (en) * 2015-04-20 2016-10-27 Applied Materials, Inc. Buffer chamber wafer heating mechanism and supporting robot
JP7196101B2 (ja) 2017-02-15 2022-12-26 パーシモン テクノロジーズ コーポレイション 複数のエンドエフェクタを備えた材料取り扱いロボット
US10629472B2 (en) 2017-08-17 2020-04-21 Persimmon Technologies Corporation Material handling robot
CN107717959B (zh) * 2017-11-07 2020-08-14 大连理工大学 一种部分解耦的scara高速并联机械手
CN110652357B (zh) * 2019-09-19 2020-06-12 中国科学院自动化研究所 双导丝或球囊的血管介入器械操控装置
US11679046B2 (en) 2019-11-04 2023-06-20 GE Precision Healthcare LLC Method and system for providing dual axes motions using a single drive
TWI851868B (zh) * 2020-01-23 2024-08-11 美商布魯克斯自動機械美國公司 基板運送設備
TWI767556B (zh) * 2021-02-08 2022-06-11 鴻勁精密股份有限公司 載具機構及其應用之作業設備

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4666366A (en) 1983-02-14 1987-05-19 Canon Kabushiki Kaisha Articulated arm transfer device
JPS61164786A (ja) * 1985-01-16 1986-07-25 フアナツク株式会社 産業用ロボツトの回転直動機構
US4836733A (en) 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
JPS63288677A (ja) * 1987-05-22 1988-11-25 株式会社東芝 ウエハ搬送装置
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
US5102280A (en) 1989-03-07 1992-04-07 Ade Corporation Robot prealigner
US5447409A (en) 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
JP2808826B2 (ja) 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
JP2831820B2 (ja) * 1990-07-30 1998-12-02 株式会社プラズマシステム 基板搬送装置
US5180276A (en) 1991-04-18 1993-01-19 Brooks Automation, Inc. Articulated arm transfer device
DE69206872T2 (de) 1991-05-08 1996-07-25 Koyo Seiko Co Magnetische Antriebsvorrichtung
JP3030667B2 (ja) 1991-07-29 2000-04-10 東京エレクトロン株式会社 搬送装置
US5404894A (en) 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
US5431529A (en) 1992-12-28 1995-07-11 Brooks Automation, Inc. Articulated arm transfer device
WO1994023911A1 (en) 1993-04-16 1994-10-27 Brooks Automation, Inc. Articulated arm transfer device
JPH0871965A (ja) * 1994-08-31 1996-03-19 Sony Corp 移載装置
JPH08112795A (ja) * 1994-10-14 1996-05-07 Fanuc Ltd 産業用ロボットの駆動モータ取付け方法と装置
JPH08195427A (ja) * 1995-01-18 1996-07-30 Jeol Ltd 搬送機構
JPH098096A (ja) * 1995-06-26 1997-01-10 Jeol Ltd 物品搬送装置
US5647724A (en) 1995-10-27 1997-07-15 Brooks Automation Inc. Substrate transport apparatus with dual substrate holders
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler
JP3726978B2 (ja) * 1996-10-28 2005-12-14 株式会社安川電機 多関節ロボット

Also Published As

Publication number Publication date
JP2002514001A (ja) 2002-05-14
EP1107853A1 (en) 2001-06-20
WO1999056920A1 (en) 1999-11-11
US6547510B1 (en) 2003-04-15
KR20010043252A (ko) 2001-05-25
JP4620866B2 (ja) 2011-01-26

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase