KR20010018075A - Photosensitive resin composition - Google Patents

Abstract

PURPOSE: A photosensitive resin composition is provided to improve resolving power and a film characteristic and to reduce the entire exposure amount by decreasing the use amount of cross-linking type compound. CONSTITUTION: A binder resin is chemically combined with a cross-linking type compound at an exposed part during an exposure process. Herein, to chemically combine each binder resin chain upon the chemical combination, self-curing type binder resin is used among the elements of the photosensitive resin composition used in TFT(thin film transistor) or FPD(flat panel display). The chemical equation of the self-curing type binder resin is -A-B-C-. The difference of solubility between the exposed part and an unexposed part is maximized during a development process. Accordingly, the resolving power is improved and the entire exposure amount is reduced by decreasing the use amount of the cross-linking type compound.

Description

Photosensitive resin composition {PHOTOSENSITIVE RESIN COMPOSITION}

The present invention relates to a photosensitive resin composition that can be developed with an aqueous alkali solution, and more particularly, to a photosensitive resin composition useful as a color filter and a thin film transistor (TFT) circuit passivation in a liquid crystal display (LCD) manufacturing process. will be.

Recently, due to the development of so-called photolithography, which forms images using active light such as ultraviolet rays (UV), the demand for photosensitive resins that can be developed with an aqueous alkali solution is increasing in many fields requiring the formation of microscopic images. have.

Alkali-developable photosensitive resins have been used in dry film resists used in the manufacture of printed circuit boards, photoresists for the manufacture of semiconductor circuits, and in recent years, in the field of flat panel displays including semiconductors and LCDs, color filters and various Applications are also expanding as circuit protective films.

The photosensitive resin composition which can be developed with an aqueous alkali solution is generally a) a binder resin dissolved or swelled by an aqueous alkali solution; B) crosslinkable compounds having at least two ethylenically unsaturated bonds; C) a photopolymerization initiator; and d) a solvent capable of dissolving each of the components mentioned above, which may contain dyes, pigments, or other additives which, if necessary, improve the film forming performance or adhesion to the substrate.

The a) is a binder resin dissolved or swelled by an aqueous alkali solution, and generally has a structure containing carboxylic acid or carboxylic anhydride or a hydroxyl group, an amino group, and an amide group in a polymer chain, and a noblel phenolic resin or an acrylic resin homopolymer or air. Coalescing is widely used.

In particular, when the photosensitive resin composition is used as a color filter and a TFT circuit protective film in the field of FPD, an acrylic binder resin having excellent transparency in visible light is widely used.

As the acrylic binder resin soluble in the alkaline solution, a copolymer using acrylic acid or methacrylic acid and one or more compounds selected from the group consisting of alkyl esters thereof and substituted or unsubstituted aryl esters is mainly used.

U.S. Patent No. 4629680 and U.S. Patent No. 4139391 used a copolymer of benzyl acrylate / methacrylic acid, and Japanese Patent Publication No. 54-34327 discloses methyl methacrylate / 2-ethylhexyl methacrylate / methacrylic acid. Terpolymers are disclosed, and Japanese Patent Application Laid-open No. 55-6210 refers to terpolymers consisting of methyl methacrylate / ethyl acrylate / acrylic acid. In addition, Japanese Patent Laid-Open No. 9-23059 describes a copolymer using allyl acrylate, hydroxyalkyl acrylate, methacrylic acid, and the like.

The compound of b) is a crosslinkable compound having at least two ethylenically unsaturated bonds, and specific examples thereof include polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, and 1,3-butanediol di (meth) acryl. Latene, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (Meth) acrylate, pentaerythritol hexa (meth) acrylate, etc. are mentioned.

In the photosensitive resin composition according to the prior art, such a crosslinkable compound is simply distributed in the binder resin in the composition, and when exposed to active light such as UV, a crosslinking reaction is caused and an alkali-soluble resin is developed by forming a net structure. It prevents the solution from being dissolved by the developer during the process, and thus serves to leave an image on the substrate.

However, in the conventional photosensitive resin composition, the solubility difference between the exposed portion and the unexposed portion is not large enough, so that the binder resin, which should actually remain in the developing process, is partially melted by the developing solution, resulting in the desired fine pattern. In most cases, it was difficult to obtain a shape.

On the other hand, when the crosslinking compound is excessively used in order to prevent such a phenomenon, the surface hardness after exposure is lowered, thereby lowering the processability and increasing the exposure amount for causing a sufficient crosslinking reaction, thereby lowering the process yield.

In addition, in this case, the solubility of the unexposed portion is also lowered, resulting in a decrease in resolution as a resist.

In order to solve the above problems, the present invention enables chemical bonding between the binder resin and the crosslinkable compound in the exposed portion during the exposure process and at the same time causes chemical bonding between the binder resin chains. By maximizing the difference in solubility, it is possible to provide a photosensitive resin having excellent resolution and excellent film properties by reducing the total exposure amount by reducing the amount of crosslinking compound used.

In order to achieve the above object, the present invention provides a photosensitive resin composition comprising a self-curing binder resin, a photopolymerization initiator, and a solvent, wherein the self-curing binder resin is represented by the following general formula (1).

Formula 1

-A-B-C-

Wherein A is a compound represented by the following Chemical Formula 1-A;

Formula 1-A

B is a compound represented by the following Chemical Formula 1-B;

Formula 1-B

C is a compound represented by Formula 1-C and / or 1-C ′:

Formula 1-C

Formula 1-C´

Wherein R ₁ is H or —CH ₃ , R ₂ is an alkyl group having 1 to 8 carbon atoms, an alkyl group substituted by a hydroxy group, or an aryl group having 1 to 12 carbon atoms substituted or unsubstituted , R ₃ is benzene or benzene having an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkyl substituent having 1 to 6 carbon atoms, and a benzene having an alkoxy substituent having 1 to 8 carbon atoms , Benzene with hydroxyl or halogen.

A portion of the binder resin of Formula 1 occupies 10 to 50 mol% of the total binder resin, 0 to 15 mol% of the portion B, 90 to 50 mol% portion of the portion C.

In the said photosensitive resin composition, the crosslinkable compound which has at least 2 or more unsaturated group can be further used as needed.

The self-curing binder resin of the general formula (1) is obtained by reacting a compound having a compound having at least one carboxylic acid group selected from the group consisting of the following general formulas (2) and (3) or (4) as a constituent with a compound of the following formula (5).

Formula 2

CH2 = C (R1) COOH

Formula 3

CH2 = C (R1) COOR2

Formula 4

CH2 = C (R1) -R3

Formula 5

Here, R1 is hydrogen or methyl group, R2 is an alkyl group having 1-8 carbon atoms, an alkyl group substituted with a hydroxy group, an aryl group or an arylalkyl group having 4-12 carbon atoms substituted or unsubstituted ( arylalkyl), R3 is benzene or an alkyl group having 1-8 carbon atoms, an alkoxy group having 1-8 carbon atoms, a benzene having an alkyl substituent having 1-6 carbon atoms, and a carbon atom number It is a compound selected from the group consisting of benzene, hydroxyl group or halogen substituted benzene having an alkoxy substituent of 1-8.

The self-curing binder resin of Chemical Formula 1 is a copolymer prepared by copolymerizing the compound of Chemical Formula 2 with one or both of Chemical Formula 3 or 4 in a constant molar ratio into a flask equipped with a stirrer and a nitrogen inlet, and methylethyl It is dissolved using a solvent such as ketone. The number average molecular weight of the copolymer used is 1000-30000, Preferably it is 2000-20000.

The temperature of the flask was raised to 120 ° C. and the compound of formula 5 was slowly added for 1 hour, and then further reacted until the epoxy group disappeared completely. Precipitate was formed using a mixture of n-hexane and methanol in a ratio of 1: 1 and dried under vacuum to prepare a self-curing binder resin.

By reaction, the epoxy group of the compound of formula 5 reacts with the carboxylic acid group present in the binder resin to form an ester bond, and as a result, a self-curable binder resin in which a reactive (meth) acryl group is introduced side by side into the linear binder resin is formed. do.

The self-curing binder resin thus obtained is a resin which is dissolved or at least swollen by an aqueous alkali solution and can cause a curing reaction by actinic light such as UV.

In addition, a photosensitive resin composition prepared by mixing all of them by using a copolymer, a photopolymerization initiator, and a solvent of the compound of Formula 2 and the compound of Formula 3 or 4 or both thereof is provided.

In the conventional photosensitive resin composition, chemical reactions occur only between the crosslinkable compounds by exposure, so that the binder resin is wrapped in a crosslinkable compound having a net structure, whereas in the case of the photosensitive resin composition of the present invention, the crosslinkable compound and the binder The chemical bond between the resin chains as well as the binder resin chains produces a high degree of inhibition of dissolution, and the solubility of the non-exposed sites in the aqueous alkali solution developer can be increased by not using a crosslinking compound or by reducing the amount of use. The resolution is superior to the prior art.

As the compound of Formula 2, acrylic acid or methacrylic acid may be used, and the amount thereof is 10 to 90 mol% based on the total moles of all monomers in the copolymer.

As the compound of Formula 3, benzyl (meth) acrylate, phenyl (meth) acrylate, hexyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate or 2-ethylhexyl (meth) acryl Preferred are the compounds selected from the group consisting of rate, more preferably benzyl (meth) acrylate or phenyl (meth) acrylate.

As the compound of Formula 4, a compound selected from the group consisting of styrene, 4-hydroxystyrene, 4-methylstyrene or vinyl acetate is preferable.

In addition, as the compound of Formula 5, glycidyl acrylate or glycidyl methacrylate is preferable. This compound uses 0.1 to 90 mol% with respect to the carboxylic acid containing monomer of formula (2).

Examples of the crosslinking compound having at least two unsaturated groups that may be used when necessary in the present invention include polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,3-butanediol di (meth) acrylate, Neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) Acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, trimethylolpropane tree Compounds selected from the group consisting of acrylates may be used alone or in combination, preferably dipentaerythritol penta (meth) acryl Byte, it is preferable to use a dipentaerythritol hexa (meth) acrylate.

When using the said crosslinkable compound, 0-200 weight%, Preferably 0-150 weight% is used with respect to the said self-curable binder resin.

Examples of photopolymerization initiators include benzophenones such as benzophenone and acetophenone, substituted benzophenones such as bis-4,4`-dimethylaminobenzophenone, and bis-4,4`-diethylaminobenzophenone, 2,4 Triazine-based photoinitiators such as, 6-tris (trichloromethyl) -triazine, and ketones such as N-methyl-2-benzoylmethylene-β-naphthoazole, 2,2-dimethoxy-1,2-diphenylethanone Compounds selected from the group consisting of system photopolymerization initiators can be used alone or in combination. The amount used is preferably 0.1 to 10% by weight.

As a solvent, it is a general thing mainly used for superposition | polymerization of an acryl polymer, methyl ethyl ketone, cyclohexanone, tetrahydrofuran, a methyl cellosol part, a methyl cellosolve acetate, a dimethylformamide, a propylene glycol methyl ether acetate, and 2-methol Compounds selected from the group consisting of oxyethyl ether are used alone or in combination.

On the other hand, in the photosensitive resin composition of this invention, in addition to the basic component as mentioned above, in order to improve a pigment, dye, or film forming performance, a small amount of antifoamer, surfactant, a thermal polymerization inhibitor, an adhesion promoter, etc. can be added and used as needed.

The finally obtained photosensitive resin composition solution is filtered using the membrane filter of 0.1-5 micrometers. This filtered resin composition is formed into a film using well-known methods, such as a spin coating method, a roll coating method, and a spray coating method. A glass plate or a silicon wafer can be used as a film forming substrate. At this time, the thickness of the film surface is determined by the film forming conditions such as the viscosity of the composition, the concentration of the solid content, the film forming speed and the like, when using the composition of the present invention can obtain a thin film of 0.1 to 500 ㎛ thickness.

The obtained thin film is pretreated while maintaining at a temperature of 50 to 150 ° C. for 10 seconds to 500 seconds using a heating plate or an oven.

The dried thin film is irradiated with ultraviolet rays through a positive test photomask (TOPPAN). In this case, the ultraviolet light source is irradiated with an illumination of about 30 to 500 mJ / ㎠ using a 1 KW high-pressure mercury lamp containing g, h, i line, and does not use a special optical filter.

The part irradiated with ultraviolet rays has a much lower solubility than the portion not irradiated with ultraviolet rays, thereby maximizing the difference in solubility between them.

The thin film irradiated with ultraviolet rays is developed at a temperature of 20 to 30 ° C. by a spray method or a dip method. In this case, as a developer, an aqueous KOH solution having a pH of 9 to 12 or an aqueous solution of tetramethylammonium hydride of 0.1 to 5% by weight can be used.

The following presents preferred synthesis examples and examples to aid in understanding the invention. However, the following Synthesis Examples and Examples are only to aid the understanding of the present invention, and the present invention is not limited to the following Synthesis Examples and Examples.

Synthesis Example 1

10 g of a copolymer having a benzyl methacrylate / methacrylic acid ratio of 60/40 and a number average molecular weight of 10000 was added to a flask equipped with a stirrer and a nitrogen inlet, and dissolved using 100 ml of methyl ethyl ketone. The temperature of the flask was raised to 120 ° C., and 0.3 g of glycidyl methacrylate was slowly added for 1 hour, followed by reaction until the epoxy group disappeared completely. The reaction product was precipitated using a mixture of n-hexane and methanol in a ratio of 1: 1 and dried under vacuum to obtain a binder resin.

Synthesis Example 2

Binder according to the method of Synthesis Example 1 except that 10 g of a copolymer having a molar ratio of benzyl methacrylate / methacrylic acid of 50/50 and a number average molecular weight of 15000 was used and 0.6 g of glycidyl acrylate was used. A resin was obtained.

Synthesis Example 3

Binder according to the method of Synthesis Example 1 except that 10 g of a copolymer having a molar ratio of benzyl methacrylate / methacrylic acid of 70/30 and a number average molecular weight of 15000 was used and 0.05 g of glycidyl acrylate was used. A resin was obtained.

Synthesis Example 4

Binder according to the method of Synthesis Example 1 except that 10 g of a copolymer having a molar ratio of benzyl methacrylate / methacrylic acid of 70/30 and a number average molecular weight of 10000 was used and 0.04 g of glycidyl acrylate was used. A resin was obtained.

Synthesis Example 5

Synthesis Example 1 except that 10 g of a terpolymer having a number average molecular weight of 14500 of ethyl methacrylate / methacrylic acid / styrene having a molar ratio of 50/40/10 and 0.3 g of glycidyl acrylate were used. The binder resin was obtained according to the method.

Synthesis Example 6

Synthesis Example 1 except that 10 g of a terpolymer having a number average molecular weight of 14500 of ethyl methacrylate / methacrylic acid / styrene having a molar ratio of 60/30/10 and 0.05 g of glycidyl acrylate were used. The binder resin was obtained according to the method.

The photosensitive resin composition of this invention was manufactured using the binder resin manufactured in the said synthesis examples 1-6.

Example 1

The photosensitive resin composition was manufactured with the composition as shown in the following table.

Binder Resin Prepared in Synthesis Example 1 5 g Bis-4,4`-diethylaminobenzophenone 2 g Propylene Glycol Methyl Ether Acetate 20 g

The composition solution prepared as above was filtered using a 0.2 μm Teflon membrane filter. The photosensitive resin composition was applied on a glass plate by spin coating, and then placed on a heating plate and maintained at a temperature of 80 ° C. for 3 minutes. Subsequently, a positive test photomask (TOPPAN) was placed on the thin film in a contact manner and irradiated with ultraviolet rays. At this time, the ultraviolet light source used a 1 KW high-pressure mercury lamp containing all g, h, i lines and irradiated with an illumination of 100 mJ / ㎠, no special optical filter was used. The thin film irradiated with ultraviolet rays was developed by immersing in a KOH aqueous solution developing solution of pH 10.5 for 2 minutes. The thin plate coated glass plate was washed with distilled water, dried by blowing nitrogen gas, and heated in a heating oven at 250 ° C. for 1 hour. The thickness of the obtained film was 3.5 μm, and a clear pattern having a line width and a line interval of 8 μm was obtained.

Example 2

The photosensitive resin composition was manufactured with the composition as shown in the following table.

Binder Resin Prepared in Synthesis Example 2 5 g Bis-4,4`-diethylaminobenzophenone 2 g Propylene Glycol Methyl Ether Acetate 20 g

After the photosensitive resin composition prepared as described above was formed in the same manner as in Example 1, the film was exposed to light at an intensity of 100 mJ / cm 2 and then developed.

The thickness of the obtained film was 3.5 µm, and a pattern having a line width and a line interval of 7 µm was clearly obtained.

Example 3

The photosensitive resin composition was manufactured with the composition as shown in the following table.

Binder Resin Prepared in Synthesis Example 3 5 g Bis-4,4`-diethylaminobenzophenone 2 g Propylene Glycol Methyl Ether Acetate 20 g

The photosensitive resin composition prepared as described above was formed after the film was formed in the same manner as in Example 1 and then exposed to an illuminance of 150 mJ / cm 2 and then developed.

The thickness of the obtained film was 4.0 micrometers, and the pattern of 9 micrometers of a line width and a line space | interval could be obtained clearly.

Example 4

The photosensitive resin composition was manufactured with the composition as shown in the following table.

Binder Resin Prepared in Synthesis Example 4 4 g Bis-4,4`-diethylaminobenzophenone 2 g Propylene Glycol Methyl Ether Acetate 30 g Pentaerythritol tetramethacrylate 4 g

The photosensitive resin composition prepared as described above was formed after the film was formed in the same manner as in Example 1 and then exposed to an illuminance of 150 mJ / cm 2 and then developed.

The thickness of the obtained film was 4.5 µm, and a pattern having a line width and a line interval of 8 µm was clearly obtained.

Example 5

The photosensitive resin composition was manufactured with the composition as shown in the following table.

Binder Resin Prepared in Synthesis Example 5 5 g Bis-4,4`-diethylaminobenzophenone 2 g Propylene Glycol Methyl Ether Acetate 20 g

The photosensitive resin composition prepared as described above was formed after the film was formed in the same manner as in Example 1 and then exposed to an illuminance of 150 mJ / cm 2 and then developed.

The thickness of the obtained film was 3.8 micrometers, and the pattern of 9 micrometers of line width and line space | interval was able to be obtained clearly.

Example 6

The photosensitive resin composition was manufactured with the composition as shown in the following table.

Binder Resin Prepared in Synthesis Example 6 5 g Bis-4,4`-diethylaminobenzophenone 3 g Propylene Glycol Methyl Ether Acetate 40 g Pentaerythritol tetraacrylate 2 g

After the photosensitive resin composition prepared as described above was formed in the same manner as in Example 1, the film was exposed to light at an intensity of 100 mJ / cm 2 and then developed.

The thickness of the obtained film was 3.1 micrometers, and the pattern with a line width and a line space of 7 micrometers was able to be obtained clearly.

Example 7

The photosensitive resin composition was manufactured with the composition as shown in the following table. In Example 7, unlike the above examples, the photosensitive resin composition was prepared by injecting the binder resin together with the components forming the photosensitive resin composition without first synthesizing the binder resin.

Benzyl methacrylate / methacrylic acid copolymer (molar ratio = 60/40, number average molecular weight = 10000) 5 g Glycidyl methacrylate 0.15 g Bis-4,4`-diethylaminobenzophenone 2 g Propylene Glycol Methyl Ether Acetate 20 g

The photosensitive resin composition prepared as described above was formed after the film was formed in the same manner as in Example 1 and then exposed to an illuminance of 150 mJ / cm 2 and then developed.

The thickness of the obtained film was 3.6 µm, and a pattern having a line width and a line interval of 8 µm was clearly obtained.

Comparative Examples 1 to 3

To the photosensitive resin composition was prepared as shown in the following table.

Benzyl methacrylate / methacrylic acid copolymer (molar ratio = 70/30, number average molecular weight = 10000) 5 g Pentaerythritol tetra (meth) acrylate 5 g Bis-4,4`-diethylaminobenzophenone 2 g Propylene Glycol Methyl Ether Acetate 40 g

After forming a film by the method similar to Example 1 using the photosensitive resin composition obtained as mentioned above, the pattern was formed, changing an exposure amount, and the following result was obtained.

Comparative Example 1 Comparative Example 2 Comparative Example 3 Exposure 100 mJ / ㎠ 150 mJ / ㎠ 200 mJ / ㎠ Film thickness - 3.0 μm 3.8 μm Resolution Pattern loss 20 μm 10 μm

According to the results obtained in Examples 1 to 7 in the case of the photosensitive resin composition using the self-curable binder resin prepared according to the present invention, when the thin film is formed using the prepared photosensitive resin composition, the exposure dose is 100 to 150 mJ / cm 2. When irradiated, the thickness of the thin film was 3 to 5 µm, and the line width and the line spacing were 7 to 9 µm, and a clear pattern was obtained.

On the other hand, in the case of the photosensitive resin compositions of Comparative Examples 1 to 3 that did not use self-curing binder resin, the pattern itself was lost when the exposure amount was 100 mJ / cm 2 depending on the exposure amount, and the exposure amount was 150 to 200 mJ / cm 2. The thickness of the thin film was increased from 3.0 to 3.8 μm, and the line width and line spacing also decreased from 20 μm to 10 μm. Therefore, in the case of the photosensitive resin composition which does not use the self-curing binder resin, it can be seen that a clear pattern can be obtained as the exposure amount increases, and the increase in the exposure amount means that the process time should be long. In addition, even when the exposure dose is 200 mJ / ㎠, the pattern of the thin film is 3.8 ㎛ thick, the line width and the line spacing is shown to 10 ㎛ it can be seen that a clearer and finer pattern than the results of the embodiment according to the present invention can not be obtained there was.

Therefore, in the case of the photosensitive resin composition using the self-curing binder resin, even if the exposure amount is small, a fine pattern can be obtained compared to the conventional one, and thus the exposure process time can be shortened, and thus the present invention has excellent resolution, process advantages, and film characteristics. An excellent photosensitive resin composition can be provided.

Claims (16)

In the photosensitive resin composition which consists of self-curing binder resin, a photoinitiator, and a solvent, The photosensitive resin composition whose self-curing binder resin is a compound represented by following formula (1): Formula 1 -A-B-C- From here, A is a compound represented by the following Chemical Formula 1-A; Formula 1-A B is a compound represented by the following Chemical Formula 1-B; Formula 1-B C is a compound represented by the following Chemical Formulas 1-C and / or 1-C ', Formula 1-C Formula 1-C´ Wherein R ₁ is H or —CH ₃ , R ₂ is an alkyl group having 1 to 8 carbon atoms, an alkyl group substituted by a hydroxy group, or an aryl group having 1 to 12 carbon atoms substituted or unsubstituted , R ₃ is benzene or benzene having an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkyl substituent having 1 to 6 carbon atoms, and a benzene having an alkoxy substituent having 1 to 8 carbon atoms , Benzene with hydroxyl or halogen. The method of claim 1, A portion of the binder resin of Formula 1 occupies 10 to 50 mol%, B portion occupies 0 to 15 mol%, and portion C occupies 90 to 50 mol% based on the total binder resin. Photosensitive resin composition. The method of claim 1, The self-curable binder resin is a photosensitive resin composition which is a self-curable binder resin obtained by reacting a copolymer obtained by reacting a copolymer obtained by reacting a copolymer obtained by reacting a copolymer of one or both of the following Chemical Formula 2 with the following Chemical Formula 3 or 4: Formula 2 CH2 = C (R1) COOH Formula 3 CH2 = C (R1) COOR2 Formula 4 CH2 = C (R1) -R3 Formula 5 Here, R1 is hydrogen or methyl group, R2 is an alkyl group having 1-8 carbon atoms, an alkyl group substituted with a hydroxy group, an aryl group or an arylalkyl group having 4-12 carbon atoms substituted or unsubstituted ( arylalkyl), R3 is benzene or an alkyl group having 1-8 carbon atoms, an alkoxy group having 1-8 carbon atoms, a benzene having an alkyl substituent having 1-6 carbon atoms, and a carbon atom number It is a compound selected from the group consisting of benzene, hydroxyl group or halogen substituted benzene having an alkoxy substituent of 1-8. The method of claim 3, wherein The compound of Formula 2 constituting the copolymer is acrylic acid or methacrylic acid, and the compound of Formula 3 is benzyl (meth) acrylate, phenyl (meth) acrylate, hexyl (meth) acrylate, methyl (meth) acrylate , Ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate is a compound selected from the group consisting of, the compound of Formula 4 is a group consisting of styrene, 4-hydroxy styrene, 4-methyl styrene, vinyl acetate The photosensitive resin composition which is a compound chosen from. The method of claim 3, wherein The compound of Formula 5 is glycidyl acrylate or glycidyl methacrylate. The method of claim 3, wherein The number average molecular weight of the said copolymer is 1000-30000 photosensitive resin composition. The method of claim 3, wherein The amount of the compound of Formula 5 is 0.1 to 90 mol% based on the carboxylic acid-containing monomer of Formula 2 in the binder resin of Formula (1). The method of claim 3, wherein The amount of the compound of Formula 2 is 10 to 90 mol% based on the molar sum of the formulas (2), (3) and (4). The method of claim 1, The photosensitive resin composition which further contains the crosslinkable compound which has at least 2 or more unsaturated group in the said photosensitive composition. The method of claim 9, The crosslinkable compound is polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,3-butanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane Diol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipenta Compounds selected from the group consisting of erythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate and trimethylolpropane triacrylate are used alone or in combination. The photosensitive resin composition. The method of claim 9, The amount of the crosslinkable compound is from 0 to 200% by weight based on the self-curable binder resin of the formula (1). A photosensitive resin composition prepared by mixing a copolymer of the compound of Formula 2 with one or both of the compounds of Formula 3 or 4 with a compound of Formula 5, a photoinitiator, and a solvent: Formula 2 CH2 = C (R1) COOH Formula 3 CH2 = C (R1) COOR2 Formula 4 CH2 = C (R1) -R3 Formula 5 Here, R1 is hydrogen or methyl group, R2 is an alkyl group having 1-8 carbon atoms, an alkyl group substituted with a hydroxy group, an aryl group or an arylalkyl group having 4-12 carbon atoms substituted or unsubstituted ( arylalkyl), R3 is benzene or an alkyl group having 1-8 carbon atoms, an alkoxy group having 1-8 carbon atoms, a benzene having an alkyl substituent having 1-6 carbon atoms, and a carbon atom number It is a compound selected from the group consisting of benzene, hydroxyl group or halogen substituted benzene having an alkoxy substituent of 1-8. The method of claim 12, The compound of Formula 2 constituting the copolymer is acrylic acid or methacrylic acid, and the compound of Formula 3 is benzyl (meth) acrylate, phenyl (meth) acrylate, hexyl (meth) acrylate, methyl (meth) acrylate , Ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate is a compound selected from the group consisting of, the compound of Formula 4 is a group consisting of styrene, 4-hydroxy styrene, 4-methyl styrene, vinyl acetate The photosensitive resin composition which is a compound chosen from. The method of claim 12, The compound of Formula 5 is glycidyl acrylate or glycidyl methacrylate. The method of claim 12, The number average molecular weight of the said copolymer is 1000-30000 photosensitive resin composition. The method of claim 12, The amount of the compound of Formula 2 is 10 to 90 mol% based on the molar sum of the formulas (2), (3) and (4).