WO2001013175A3 - Photosensitive resin composition - Google Patents
Photosensitive resin composition Download PDFInfo
- Publication number
- WO2001013175A3 WO2001013175A3 PCT/KR2000/000883 KR0000883W WO0113175A3 WO 2001013175 A3 WO2001013175 A3 WO 2001013175A3 KR 0000883 W KR0000883 W KR 0000883W WO 0113175 A3 WO0113175 A3 WO 0113175A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photosensitive resin
- exposed area
- resin composition
- well
- chemical bond
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00952027A EP1410108A2 (en) | 1999-08-17 | 2000-08-10 | Photosensitive resin composition |
JP2001517215A JP2003507758A (en) | 1999-08-17 | 2000-08-10 | Photosensitive resin composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1999/33884 | 1999-08-17 | ||
KR10-1999-0033884A KR100493961B1 (en) | 1999-08-17 | 1999-08-17 | Photosensitive resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001013175A2 WO2001013175A2 (en) | 2001-02-22 |
WO2001013175A3 true WO2001013175A3 (en) | 2001-06-14 |
Family
ID=19607497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2000/000883 WO2001013175A2 (en) | 1999-08-17 | 2000-08-10 | Photosensitive resin composition |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1410108A2 (en) |
JP (1) | JP2003507758A (en) |
KR (1) | KR100493961B1 (en) |
TW (1) | TWI286666B (en) |
WO (1) | WO2001013175A2 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE412019T1 (en) | 2002-03-28 | 2008-11-15 | Huntsman Adv Mat Switzerland | POLYMERIZABLE COMPOSITION |
JP4583022B2 (en) * | 2002-12-13 | 2010-11-17 | 大日本印刷株式会社 | Method for producing regenerative photoreactive compound for color-splitting light transmission structure |
JP4704496B2 (en) * | 2002-12-13 | 2011-06-15 | 大日本印刷株式会社 | Photoreactive compound for color-splitting light transmission structure and color-splitting light transmission structure |
KR20050070619A (en) * | 2003-12-30 | 2005-07-07 | 제일모직주식회사 | Photosensitive resin composition for color filter |
JP4571417B2 (en) * | 2004-02-18 | 2010-10-27 | ユニチカ株式会社 | Laminated film with an easy adhesion layer |
KR100709891B1 (en) * | 2004-03-22 | 2007-04-20 | 주식회사 엘지화학 | Alkali-developable resins and photosensitive composition comprising the same |
CN1976961B (en) | 2005-01-25 | 2010-05-19 | Lg化学株式会社 | Thermally curable resin composition with extended storage stability and good adhesive property |
WO2008097065A1 (en) * | 2007-02-08 | 2008-08-14 | Lg Chem, Ltd. | Alkali-developable resins, method for preparing the same and photosensitive composition comprising the alkali-developable resins |
KR100835605B1 (en) * | 2007-06-19 | 2008-06-09 | 제일모직주식회사 | Thermosetting resin composition for color filter of cmos image sensor and color filter using the composition, and cmos image sensor using the color filter |
US7847013B2 (en) | 2007-06-19 | 2010-12-07 | Cheil Industries Inc. | Glycidyl-, OH-, COOH- and aryl-(meth)acrylate copolymer for color filter |
KR20110120124A (en) | 2010-04-28 | 2011-11-03 | 주식회사 엘지화학 | Alkali soluble polymer compounds and photoresist resin composition comprising the same |
WO2011138176A1 (en) | 2010-05-03 | 2011-11-10 | Basf Se | Color filter for low temperature applications |
KR20140003343A (en) | 2012-06-29 | 2014-01-09 | 주식회사 엘지화학 | Composition for manufacturing resin, resin manufactured by using the same, curable resin composition comprising resin, photosensitive material manufactured by using the photoresist resin composition, and display device comprising the same |
KR101603844B1 (en) | 2013-06-18 | 2016-03-15 | 주식회사 엘지화학 | Curable composition, cured film manufactured by using the curable composition and display device having the same |
KR101603845B1 (en) | 2013-06-18 | 2016-03-15 | 주식회사 엘지화학 | Copolymer, photosensitive resin composition comprising the same, photosensitive material manufactured by using the photosensitive resin composition and display device having the photosensitive material |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4239849A (en) * | 1978-06-19 | 1980-12-16 | Dynachem Corporation | Polymers for aqueous processed photoresists |
US4495271A (en) * | 1981-05-20 | 1985-01-22 | Hoechst Aktiengesellschaft | Radiation polymerizable mixture and copying material produced therefrom |
US4629680A (en) * | 1984-01-30 | 1986-12-16 | Fuji Photo Film Co., Ltd. | Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution |
US4692396A (en) * | 1984-04-10 | 1987-09-08 | Hiroyuki Uchida | Photopolymerizable resin composition for producing aqueous-development type dry film resists |
US5356754A (en) * | 1992-09-25 | 1994-10-18 | Mitsubishi Rayon Co., Ltd. | Crosslinking curable resin composition |
US5419998A (en) * | 1991-08-30 | 1995-05-30 | Hercules Incorporated | Photopolymerizable composition for use in an alkaline-etch resistant dry film photoresist |
EP0770923A1 (en) * | 1995-10-27 | 1997-05-02 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive resin composition and photosensitive resin laminated film containing the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2818768B2 (en) * | 1989-02-09 | 1998-10-30 | 三菱レイヨン株式会社 | Crosslinkable curable resin composition |
JP3254572B2 (en) * | 1996-06-28 | 2002-02-12 | バンティコ株式会社 | Photopolymerizable thermosetting resin composition |
JP3805438B2 (en) * | 1996-08-30 | 2006-08-02 | 太陽インキ製造株式会社 | Alkali-developable photo-curable glass paste composition and method for manufacturing plasma display panel partition using the same |
JP3920449B2 (en) * | 1998-03-13 | 2007-05-30 | 太陽インキ製造株式会社 | Alkali-developable photocurable composition and fired product pattern obtained using the same |
-
1999
- 1999-08-17 KR KR10-1999-0033884A patent/KR100493961B1/en not_active IP Right Cessation
-
2000
- 2000-08-10 EP EP00952027A patent/EP1410108A2/en not_active Withdrawn
- 2000-08-10 WO PCT/KR2000/000883 patent/WO2001013175A2/en active Application Filing
- 2000-08-10 JP JP2001517215A patent/JP2003507758A/en active Pending
- 2000-08-15 TW TW089116588A patent/TWI286666B/en not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4239849A (en) * | 1978-06-19 | 1980-12-16 | Dynachem Corporation | Polymers for aqueous processed photoresists |
US4495271A (en) * | 1981-05-20 | 1985-01-22 | Hoechst Aktiengesellschaft | Radiation polymerizable mixture and copying material produced therefrom |
US4629680A (en) * | 1984-01-30 | 1986-12-16 | Fuji Photo Film Co., Ltd. | Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution |
US4692396A (en) * | 1984-04-10 | 1987-09-08 | Hiroyuki Uchida | Photopolymerizable resin composition for producing aqueous-development type dry film resists |
US5419998A (en) * | 1991-08-30 | 1995-05-30 | Hercules Incorporated | Photopolymerizable composition for use in an alkaline-etch resistant dry film photoresist |
US5356754A (en) * | 1992-09-25 | 1994-10-18 | Mitsubishi Rayon Co., Ltd. | Crosslinking curable resin composition |
EP0770923A1 (en) * | 1995-10-27 | 1997-05-02 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive resin composition and photosensitive resin laminated film containing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2003507758A (en) | 2003-02-25 |
EP1410108A2 (en) | 2004-04-21 |
KR20010018075A (en) | 2001-03-05 |
KR100493961B1 (en) | 2005-06-10 |
TWI286666B (en) | 2007-09-11 |
WO2001013175A2 (en) | 2001-02-22 |
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