KR20010006879A - Cleaning device and cleaning method of carrier for semiconductor - Google Patents

Abstract

PURPOSE: To clean and dry a carrier for a semiconductor efficiently in a short time in an apparatus for cleaning the carrier used, for example, for housing a semiconductor wafer. CONSTITUTION: An organic solvent 4 is supplied to a closed chamber 1 for housing the main body of a carrier for a semiconductor and a door 8 (Fig.(a)). After the main body 7 and the door 8 being cleaned, the solvent 4 is discharged (Fig.(b)). By passing an inactive gas 11 through the chamber 1. the solvent 4 adherent to the main body 7 and the door 8 is dried up (Fig.(c)).

Description

Cleaning device and cleaning method of carrier for semiconductor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus and a cleaning method for a semiconductor carrier, and more particularly, to a cleaning apparatus and a cleaning method for a semiconductor carrier used for storing, transporting, or storing a wafer during semiconductor manufacturing.

In recent years, semiconductor carriers for storing, transporting, or storing wafers due to large diameters of semiconductor wafers have also been enlarged and complicated. 5 is a configuration diagram of a known horizontal door opening and closing integrated wafer carrier (hereinafter referred to as "FOUP") as a conventional carrier for semiconductors. More specifically, Fig. 5 (a) shows the main body 7 which houses the wafer, and Fig. 5 (b) shows the door 8 for isolating the wafer housed in the main body from the clean room atmosphere. One drawing.

The wafer is accommodated in the horizontal direction in the wafer support 27 by the moving mounting mechanism of the semiconductor manufacturing apparatus. When the wafer is stored in the wafer support 27, SEMI Std. Front Opening Mechanical Interface Standard (FIMS) as defined in E62, and SEMI Std. The door 8 is pressed against the main body 7 by a pod opener having a BOLTS (Box Opener / Loader Too1 Standard) mechanism specified in E63. The FIMS mechanism operates the latch mechanism 30 of the door 8 in the direction of the arrow shown in Fig. 5B through the door gap 31. As a result, the latch mechanism 30 is fitted into the recess 29 of the main body 7, and the door 8 and the main body 7 are fixed.

When the door 8 and the main body 7 are fixed, the wafer accommodated in the main body 7 is isolated from the clean room atmosphere by the seal 32. When the wafer is conveyed in this state, a high ratio can be maintained even if the cleanliness of the clean room is low. For this reason, if the above-described FOUP is used, the cleanliness of the clean room can be lowered for the purpose of lowering the construction cost and operating cost of the clean room without lowering the device ratio.

When the FOUP having the above-mentioned function is repeatedly used in the actual process, particles or chemical contaminants may adhere to the inner surface of the door 8 or the main body 7. When these contaminants reattach to the wafer housed in the main body 7, the proportion of the device is deteriorated as a result. For this reason, if several uses are repeated, it is necessary to wash | clean a FOUP and return to a clean form.

Fig. 6 shows a diagram for explaining an example of the conventional FOUP cleaning method. More specifically, Fig. 6 (a) shows the flow of pure water according to the conventional FOUP cleaning, and Fig. 6 (b) shows the flow of air according to the cleaning. As shown in Fig. 6, in the conventional cleaning method, the FOUP main body 7 is placed on the rack 6 like the door 8. Rotating spray nozzles 17 are disposed above and below the rack 6. The main body 7 and the door 8 are cleaned by spraying the pure water 18 pumped by the pump 20 from the spray nozzle 17.

Pure water 18 is supplied in the state heated at 50-70 degreeC, in order to improve the washing | cleaning efficiency. In some cases, a surfactant is added to the pure water 18. In this case, pure water 18 is used to circulate inside the apparatus. After the washing step, pure water rinse is performed. At this time, the pure water 18 is circulated and supplied to the main body 7 and the door 8 while maintaining the cleanliness through the filter 19. When these processes are complete | finished, a drying process starts next.

The drying step is performed using the warm air 21 heated by the air heater 22 to about 50 ° C to 70 ° C, and the clean dry air 26 whose primary purpose is to remove locally remaining water droplets. 90% or more of the warm air 21 is rotated by the blower 24 by recirculation, and about 10% of the remaining air is discarded from the exhaust port 25. The air sent out from the blower 24 is reheated by the air heater 22, cleaned by the filter 23, and then provided again by drying of the FOUP.

In the main body 7 and the door 8 of the FOUP, the warm air used in the drying step hardly reaches a part sandwiched between the resin and the resin, for example. Specifically, in the main body 7, the part shown by attaching the code | symbol 28 is shown in (a) of FIG. 6, etc., and the code | symbol 33 is attached | subjected to (b) of FIG. Warm air is hard to reach parts to be made. When the FOUP is cleaned using the above-described conventional technique, water droplets tend to remain in these portions 8 and 33. For this reason, when cleaning a carrier for semiconductors, especially FOUP by the conventional method, it was necessary to make a warm air as high temperature as possible and to ensure a long drying time.

Since carriers for semiconductors are usually made of resin, considering the risk of deformation, the temperature limit of the warm air temperature of about 70 ° C is the upper limit. When the warm air temperature is about 70 ° C, a drying time of 1 to 2 hours is required, and the throughput is significantly lower. For this reason, the conventional method has a problem that it becomes difficult to fill the required number of carrier regenerations determined from the production plan in a mass production plant.

This invention is made | formed in order to solve the above subjects, and an object of this invention is to provide the cleaning apparatus and cleaning method of the carrier for semiconductors which can wash | clean and dry a carrier for semiconductors efficiently in a short time.

BRIEF DESCRIPTION OF THE DRAWINGS The figure for demonstrating the washing | cleaning method of Embodiment 1 of this invention.

2 is a diagram for explaining a cleaning method of Embodiment 2 of the present invention;

3 is a view for explaining a cleaning method of Embodiment 3 of the present invention;

4 is a diagram for explaining a cleaning method of Embodiment 5 of the present invention;

Fig. 5 shows the main body and the door of the carrier for semiconductors.

6 is a view for explaining a conventional cleaning method.

<Description of the code | symbol about the principal part of drawing>

1: vacuum chamber

2: solvent supply valve

3: waste liquid valve

4: organic solvent

5: cleaning liquid

7: body

8: door

9: inert gas supply valve

10: exhaust valve

12: vacuum exhaust valve

16, 17: cleaning process

18, 19: drying process

In order to achieve the said objective, invention of Claim 1 is a washing | cleaning apparatus of the carrier for semiconductors which accommodates a semiconductor wafer,

An airtight chamber for storing a carrier for semiconductors,

A solvent supply mechanism for supplying an organic solvent into the sealed chamber;

A waste liquid mechanism for discharging the organic solvent in the hermetically sealed chamber after washing the carrier for semiconductors;

An inert gas supply mechanism for supplying an inert gas into the closed chamber;

And an exhaust mechanism for discharging the inert gas in the hermetically closed chamber after drying the carrier for semiconductors.

Moreover, invention of Claim 2 is a washing | cleaning apparatus of the carrier for semiconductors which accommodates a semiconductor wafer,

An airtight chamber for storing a carrier for semiconductors,

A cleaning liquid supply mechanism for supplying a cleaning liquid into the closed chamber;

A waste liquid mechanism for discharging the washing liquid in the hermetically sealed chamber after washing the carrier for semiconductors;

A decompression mechanism for depressurizing the inside of the hermetic chamber is provided.

Moreover, invention of Claim 3 is a washing | cleaning apparatus of the carrier for semiconductors which accommodates a semiconductor wafer,

After the cleaning of the semiconductor carrier, a spin drying mechanism for rotating the carrier for semiconductor is provided so that the cleaning liquid attached to the carrier for semiconductor is removed by centrifugal force.

Moreover, the invention of Claim 4 is a washing | cleaning apparatus of the carrier for semiconductors provided with the main body which accommodates a semiconductor wafer, and the door which blocks the opening part of the said main body,

First cleaning means for cleaning and drying the main body separately from the door;

Second cleaning means for cleaning and drying the door separately from the main body,

The first cleaning means is a cleaning device according to claim 3,

The said 2nd washing | cleaning means is a washing | cleaning apparatus of the said Claim 1 or 2, It is characterized by the above-mentioned.

Moreover, invention of Claim 5 is a washing | cleaning apparatus of the carrier for semiconductors in any one of Claims 1-4,

After cleaning the said carrier for semiconductors with pure water as a washing | cleaning liquid, it characterized by including the substitution means which substitutes the organic solvent for the pure water adhering to the said carrier for semiconductors.

Moreover, the invention of Claim 6 is a washing | cleaning method of the carrier for semiconductors which accommodates a semiconductor wafer,

Storing the carrier for the semiconductor in a sealed chamber,

Supplying an organic solvent into the closed chamber;

Discharging the organic solvent in the closed chamber after cleaning the carrier for semiconductors;

Supplying an inert gas into the closed chamber;

And drying the inert gas in the hermetic chamber after drying the carrier for semiconductors.

Moreover, the invention of Claim 7 is a washing | cleaning method of the carrier for semiconductors which accommodates a semiconductor wafer,

Storing the carrier for the semiconductor in a sealed chamber,

Supplying a cleaning liquid into the closed chamber;

Discharging the cleaning liquid in the hermetically sealed chamber after cleaning the carrier for semiconductors;

And depressurizing the inside of the hermetic chamber to dry the carrier for the semiconductor.

Moreover, the invention of Claim 8 is a washing | cleaning method of the carrier for semiconductors which accommodates a semiconductor wafer,

Washing the carrier for the semiconductor,

And after the cleaning, rotating the carrier for the semiconductor so that the cleaning liquid attached to the carrier for the semiconductor is removed by centrifugal force.

Moreover, the invention of Claim 9 is a cleaning method of the carrier for semiconductors provided with the main body which accommodates a semiconductor wafer, and the door which blocks the opening part of the said main body,

Washing the body separately from the door;

Drying the main body separately from the door, washing the door separately from the main body,

And drying the door separately from the main body,

The washing and drying of the main body are performed by the washing method according to claim 8,

The cleaning and drying of the door are performed by the cleaning method according to claim 6 or 7.

Moreover, invention of Claim 10 is a washing | cleaning method of the carrier for semiconductors in any one of Claims 6-9,

Washing the semiconductor carrier with pure water,

After the said washing | cleaning, the process of substituting the organic solvent for the pure water adhering to the said carrier for semiconductors is characterized by the above-mentioned.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. In addition, the same code | symbol is attached | subjected to the element which is common in each figure, and overlapping description is abbreviate | omitted.

Embodiment 1.

1 is a conceptual diagram for explaining the cleaning method of Embodiment 1 of the present invention. In the cleaning method of the present embodiment, the main body 7 and the door 8 of the FOUP are cleaned inside the sealed chamber 1 shown in FIG. In the closed chamber 1, a solvent supply valve 2, a waste liquid valve 3, an inert gas supply valve 9, and an exhaust valve 10 are provided.

In the present embodiment, the main body 7 and the door 8 of the FOUP are placed on the rack 6 in the sealed chamber 1. When the cleaning process starts, first, the solvent supply valve 2 is opened so that the cleaning organic solvent 4 (for example, IPA, etc.) is supplied into the sealed chamber 1 (Fig. 1 (a)). . When the organic solvent 4 is supplied until the main body 7 and the door 8 are sufficiently immersed, the valve of the waste liquid valve 3 is opened with the solvent supply valve 2 open. Thereafter, the body 7 and the door 8 are washed while the organic solvent 4 is passed through.

When the above-mentioned washing | cleaning process is complete | finished, the valve of the solvent supply valve 2 is closed. The waste liquid valve 3 is maintained in the form of an open valve until the organic solvent 4 in the sealed chamber 1 is discharged. When the organic solvent 4 is discharged, after the waste liquid valve 3 is closed, the valve of the inert gas supply valve 9 opens and the valve of the exhaust valve 10 opens. As a result, the atmosphere in the closed chamber 1 is replaced with nitrogen.

In the washing | cleaning method of this embodiment, after the atmosphere in the airtight chamber 1 is completely substituted by nitrogen, nitrogen flow is continued until predetermined time passes. Since the organic solvent 4 has higher volatility than pure water, the organic solvent 4 remaining on the surface of the FOUP can be evaporated relatively easily even without the force of warm air. Moreover, when the inside of the airtight chamber 1 is substituted by nitrogen atmosphere, the density | concentration of the organic solvent 4 in atmosphere will fall, and the evaporation will be accelerated further.

For this reason, as the washing | cleaning method of this embodiment, the part which is hard to dry of FOUP on the conditions of nitrogen flow volume 30m <^3> / min, nitrogen temperature room temperature, drying time 10 minutes, ie, the main body (shown in FIG. 7) and the organic solvent of the parts 28 and 33 of the door 8 can be removed completely. Thus, according to the washing | cleaning method of this embodiment, FOUP which has a complicated structure can be completely dried in a short time, without using a high temperature warm air.

By the way, in said embodiment, although the atmosphere in the airtight chamber 1 is substituted by nitrogen gas in a drying process, this invention is not limited to this, The gas used in a drying process should just be an inert gas.

In the above embodiment, the mechanism for supplying the organic solvent via the solvent supply valve 2 to the "solvent supply mechanism" according to claim 1 is a mechanism for discharging the organic solvent from the waste liquid valve 3. A mechanism for supplying nitrogen gas to the "waste liquid mechanism" according to claim 1 via an inert gas supply valve 9 causes the "inert gas supply mechanism" according to claim 1 to discharge nitrogen gas from the exhaust valve 10. The mechanism corresponds to the "exhaust mechanism" described in claim 1, respectively.

Embodiment 2.

Next, Embodiment 2 of this invention is described with reference to FIG.

2 is a conceptual diagram for explaining the cleaning method of Embodiment 2 of the present invention. As shown in FIG. 2, in the present embodiment, the solvent supply valve 2, the waste liquid valve 3, and the vacuum exhaust valve 12 are provided in the vacuum chamber 1. As the washing method of the present embodiment, washing (Fig. 2 (a)) and waste liquid (Fig. 2 (b)) are performed in the same order as in the first embodiment, but the organic solvent (4) is used as the washing liquid (5). It is also possible to use pure water instead.

The characteristic of the washing | cleaning method of this embodiment is that a drying process (FIG. 2 (c)) differs from the case of Embodiment 1, and is performed in a vacuum atmosphere. That is, in the cleaning method of the present embodiment, when the drying process starts, the valve of the vacuum exhaust valve 12 is opened, and the exhaust is performed until the inside of the sealed chamber 1 becomes about tens of torr, for example, by a vacuum pump or the like. Lose.

Compared with the case where the drying step is performed at ordinary pressure, evaporation of water is promoted when the drying atmosphere is vacuum. For this reason, as the washing | cleaning method of this embodiment, the part which is hard to dry of FOUP on the conditions of the drying temperature of room temperature, the pressure in a chamber of 10 torr, and the drying time of 10 minutes, ie, the main body 7 shown in FIG. ) And the water droplets of the parts 28 and 33 of the door 8 can be completely removed. Thus, according to the washing | cleaning method of this embodiment, FOUP which has a complicated structure can be completely dried in a short time, without using a high temperature warm air.

Moreover, in said embodiment, the mechanism which supplies a cleaning liquid to a "cleaning liquid" of Claim 2 through the solvent supply valve 2 in the "cleaning liquid supply mechanism" of Claim 2, The mechanism for depressurizing the inside of the sealing chamber 1 via the vacuum exhaust valve 12 by the mechanism for discharging the cleaning liquid from the waste liquid valve 3 via the vacuum exhaust valve 12 is described in It is equivalent to the mechanism, "respectively.

Embodiment 3.

Next, Embodiment 2 of this invention is described with reference to FIG.

3 is a conceptual diagram for explaining the cleaning method of Embodiment 3 of the present invention. More specifically, Fig. 3A is a view (top view) showing the main body 7 of the FOUP from the top, and Fig. 3B is a view (front view) showing the door 8 from the front.

The washing method of the present embodiment can be applied regardless of the type of washing apparatus, and can be applied to the conventional washing apparatus shown in FIG. 6, for example. The characteristic of the washing | cleaning method of this embodiment is that spin drying which rotates the main body 7 and the door 8 of a FOUP in a drying process is performed.

In Fig. 3, arrows indicated by reference numerals 13 denote rotation directions of the main body 7, and arrows denoted by reference numerals 14 denote rotation directions of the doors 8, respectively. Reference numeral 15 in Fig. 3B shows a jig for fixing the door 8 during spin drying. The door 8 was spin-dried in the rotational direction of the arrow 14 in order to discharge the water droplets remaining therein from the latch gap 31.

According to the spin drying, water droplets remaining in the parts 28 and 33 that are difficult to dry can be removed by centrifugal force. For this reason, according to the washing | cleaning method of this embodiment, the main body 7 is carried out by the drying time of 10 minutes by spin-drying at the rotation speed of 1000 rpm, for example, circulating 70 degreeC warm air at the flow volume of 30 m <^3> / min. The door 8 can be completely dried. Thus, according to the washing | cleaning method of this embodiment, FOUP which has a complicated structure can be completely dried in a short time, suppressing warm air temperature about 70 degreeC.

In addition, in said embodiment, in the drying process, the mechanism which rotates the main body 7 and the door 8 in the said direction, respectively is corresponded to the "spin drying mechanism" of the said Claim 3.

Embodiment 4.

Next, Embodiment 4 of this invention is described. As the washing | cleaning method of Embodiments 1-3, the organic solvent can be used as a washing | cleaning liquid. When an organic solvent is used in these washing methods, (1) washing with an organic solvent, (2) waste liquid of an organic solvent, and (3) drying for removing an organic solvent are performed in order.

In contrast, in the washing method of the present embodiment, pure water is used as the washing liquid, and then all of the pure water used for washing is disposed of, and then the organic solvent is flown to replace the pure water attached to the FOUP with the organic solvent, and then the drying step is carried out. I'm talking about going. According to the above-described procedure, the drying time can be shortened to the same extent as when the organic solvent is used as the cleaning liquid while greatly reducing the amount of the organic solvent used. For this reason, according to the washing | cleaning method of this embodiment, compared with the case where the organic solvent is used independently in embodiment 1-3, the throughput of such a case can be implement | achieved while reducing cost significantly.

In addition, in said embodiment, after the FOUP is wash | cleaned with pure water, the mechanism which replaces the water droplet adhering to the main body 7 or the door 8 with the organic solvent is equivalent to the substitution means of Claim 5, have.

Embodiment 5.

Next, Embodiment 5 of this invention is described with reference to FIG.

4 shows a conceptual diagram for explaining the cleaning method of this embodiment. As the cleaning method of Embodiments 1 to 4, the main body 7 and the door 8 of the FOUP are treated in the same cleaning process and the same drying process. In contrast, in the cleaning method of the present embodiment, as illustrated in FIG. 4, the main body 7 and the door 8 are each cleaned by separate cleaning steps 16 and 17, and further drying steps ( 18, 19), it is said that they are carried out in a washing | cleaning apparatus combining them together.

In this embodiment, as the washing | cleaning process 16 of the main body 7, the main body 7 is wash | cleaned by methods, such as brush washing and ultrasonic washing, using an organic solvent as a washing | cleaning liquid. On the other hand, as the washing | cleaning process 17 of the door 8, washing is performed by the method of immersing the door 8 in the washing | cleaning liquid like the case of Embodiment 1 or 2 as an organic solvent as a washing | cleaning liquid. Although dirt of the main body 7 is difficult to remove compared with the dirt of the door 8, according to the cleaning process 16 mentioned above, the main body 7 can be fully cleaned in a short time. Moreover, since the door 8 has a complicated structure compared with the main body 7, the breakage tends to occur, but according to the cleaning process 17 described above, the door 8 can be sufficiently cleaned without causing breakage.

By the way, the washing | cleaning of the main body 7 requires a large amount of washing | cleaning liquid compared with the washing | cleaning of the door 8. For this reason, as the washing | cleaning process 16 of the main body 7, compared with the washing | cleaning process of the door 8, a long time is required for the filling and discharge of a washing | cleaning liquid. In addition, since the cleaning of the main body 7 is more difficult than the cleaning of the door 8 as described above, the time required for the cleaning of the main body 7 also requires the cleaning of the door 8. It is a long time compared to time. For this reason, as the washing | cleaning process 16 of the main body 7, long time is needed compared with the washing | cleaning process 17 of the door 8. As shown in FIG.

On the other hand, since the structure of the main body 7 is simpler than the structure of the door 8, the time required for the drying step 18 of the main body 7 is required for the drying step 19 of the door 8. It is a short time compared to the time. Therefore, according to the washing | cleaning method of this embodiment, the time difference which the washing | cleaning process 16 and 17 requires can be shortened to the drying process 18 and 19. FIG.

By the way, the drying process used in Embodiment 1 or 2 mentioned above, ie, the process of making the inside of the sealed chamber 1 into a nitrogen atmosphere, or the process making it inside into a vacuum, the drying process used in Embodiment 3, That is, it is a process suitable for drying the door 8 in a short time compared with the process using spin drying. In addition, the drying process of Embodiment 3 is a process suitable for drying the main body 7 in a short time compared with the drying process of Embodiment 1 or 2.

In this embodiment, as the drying process 18 of the main body 7, the drying process (spin drying) of Embodiment 3 is used, and as the drying process 19 of the door 8, the drying process of Embodiment 1 or 2 is carried out. Each of these is used. By drying the main body 7 and the door 8 in a separate process as mentioned above, the main body 7 and the door 8 can be dried efficiently in a short time, respectively. Therefore, according to the washing | cleaning method of this embodiment, drying time can be shortened compared with the case where the main body 7 and the door 8 are dried in the same process.

According to the combination of the cleaning process 16 and 17 and the drying process 18 and 19 mentioned above, the contact time required for the washing | cleaning and drying of the main body 7, and the door 8 of the door 8 are offset by offsetting the time difference of each process. The contact time required for washing and drying can be set. For this reason, according to the washing | cleaning method of this embodiment, both the main body 7 and the door 8 can be cleaned efficiently in a short time without bias.

In the above embodiment, the main body 7 and the door 8 are cleaned with an organic solvent. However, the door 8 may be cleaned with pure water. In addition, when the method of Embodiment 2 is used in the drying process 18 of the main body 7, you may perform the washing | cleaning of the main body 7 also in pure water. In addition, after the main body 7 and the door 8 are cleaned with pure water, the water droplets adhering to them in front of the drying steps 18 and 19 may be replaced with an organic solvent.

In addition, in said embodiment, the mechanism which implements the washing | cleaning process 16 and the drying process 18 is carried out to the "first washing | cleaning means" of Claim 4, and also the washing | cleaning process 17 and the drying process (19). The mechanism for realizing () corresponds to the "second cleaning means" described in claim 4, respectively.

According to invention of Claim 1 or 6, since the organic solvent is used as a washing | cleaning liquid, the carrier for a semiconductor can be dried efficiently in a short time, without using a high temperature warm air, by replacing the atmosphere in a closed chamber with inert gas. have.

According to the invention according to claim 2 or 7, the evaporation of the cleaning liquid (pure or organic solvent) can be promoted by depressurizing the inside of the closed chamber after cleaning the semiconductor carrier. For this reason, according to this invention, a carrier for a semiconductor can be dried efficiently in a short time, without using a high temperature warm air.

According to the invention according to claim 3 or 8, after the semiconductor carrier is washed, spin drying is performed to remove the cleaning liquid attached to the carrier for the semiconductor by centrifugal force. For this reason, according to this invention, a carrier for a semiconductor can be dried efficiently in a short time, without using a high temperature warm air.

According to invention of Claim 4 or 9, the main body and the door which comprise the carrier for semiconductors can be wash | cleaned separately, and it can dry. Cleaning the body requires a longer time than cleaning the door. On the other hand, the main body can be dried in a shorter drying time than in the door. Therefore, according to the present invention, the total time required for washing and drying of the main body and the total time required for washing and drying of the door can be matched without causing excessive processing time. Moreover, in this invention, the method suitable for drying each in a short time is used in the drying process of a main body and the drying process of a door. For this reason, according to this invention, the main body and the door can be efficiently and efficiently cleaned in a short time without bias.

According to invention of Claim 5 or 10, after wash | cleaning a semiconductor carrier with pure water, a drying process can be started after replacing the water droplet adhering to the semiconductor carrier with the organic solvent. For this reason, according to this invention, an efficient drying process can be implement | achieved, suppressing the usage-amount of an organic solvent.

Claims (10)

A cleaning device for a semiconductor carrier for storing a semiconductor wafer, An airtight chamber for storing a carrier for semiconductors, A solvent supply mechanism for supplying an organic solvent into the closed chamber; A waste liquid mechanism for discharging the organic solvent in the hermetically sealed chamber after washing the carrier for semiconductors; An inert gas supply mechanism for supplying an inert gas into the closed chamber; And an exhaust mechanism for discharging the inert gas in the hermetically closed chamber after drying of the carrier for semiconductor. A cleaning device for a semiconductor carrier for storing a semiconductor wafer, An airtight chamber for storing a carrier for semiconductors, A cleaning liquid supply mechanism for supplying a cleaning liquid into the closed chamber; A waste liquid mechanism for discharging the washing liquid in the hermetically sealed chamber after washing the carrier for semiconductors; A decompression device for a semiconductor carrier, comprising a decompression mechanism for depressurizing the inside of the hermetic chamber. A cleaning device for a semiconductor carrier for storing a semiconductor wafer, And a spin drying mechanism for rotating the carrier for the semiconductor so that the cleaning liquid attached to the carrier for the semiconductor is removed by centrifugal force after cleaning the carrier for the semiconductor. A cleaning device for a semiconductor carrier comprising a main body that houses a semiconductor wafer and a door that closes an opening of the main body, First cleaning means for cleaning and drying the main body separately from the door; Second cleaning means for cleaning and drying the door separately from the main body, The said 1st washing | cleaning means is a washing | cleaning apparatus of Claim 3, The said 2nd washing | cleaning means is the washing | cleaning apparatus of Claim 1 or 2, The cleaning apparatus of the carrier for semiconductors characterized by the above-mentioned. The cleaning device according to any one of claims 1 to 4, further comprising: a substitution means for replacing pure water adhered to the semiconductor carrier with an organic solvent after washing the carrier for semiconductor with pure water as a cleaning liquid. Cleaning apparatus for carriers for semiconductors. As a cleaning method for a semiconductor carrier for storing a semiconductor wafer, Storing the carrier for the semiconductor in a sealed chamber, Supplying an organic solvent into the closed chamber; Discharging the organic solvent in the closed chamber after cleaning the carrier for semiconductors; Supplying an inert gas into the closed chamber; And a step of discharging the inert gas in the hermetically sealed chamber after drying the carrier for semiconductors. As a cleaning method for a semiconductor carrier for storing a semiconductor wafer, Storing the carrier for the semiconductor in a sealed chamber, Supplying a cleaning liquid into the closed chamber; Discharging the cleaning liquid in the hermetically sealed chamber after cleaning the carrier for semiconductors; And drying the carrier for the semiconductor by depressurizing the inside of the hermetic chamber. As a cleaning method for a semiconductor carrier for storing a semiconductor wafer, Washing the carrier for the semiconductor, And after the cleaning, rotating the carrier for the semiconductor so that the cleaning liquid attached to the carrier for the semiconductor is removed by centrifugal force. A cleaning method of a carrier for a semiconductor comprising a main body accommodating a semiconductor wafer and a door closing the opening of the main body, Washing the body separately from the door; Drying the main body separately from the door; Washing the door separately from the main body, And drying the door separately from the main body, The washing and drying of the main body are performed by the washing method according to claim 8, Cleaning of said door and drying are performed by the washing | cleaning method of Claim 6 or 7, The cleaning method of the carrier for semiconductors characterized by the above-mentioned. The method according to any one of claims 6 to 9, wherein the step of washing the semiconductor carrier with pure water, And a step of replacing the pure water adhering to the carrier for the semiconductor with the organic solvent after the cleaning.