JP2002043272A - Substrate cleaning apparatus and substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a safe substrate cleaning apparatus which can supply sufficiently the clean air owing to down-flow even when cleaning by chemicals and spin-drying are conducted within a tank, prevent diffusion of atmosphere of chemicals and re-deposition of mist during the drying process in an adequate closed construction, and also maintain the closed construction for a certain period even if an exhaust system is failed and thereby prevent diffusion of the chemicals. SOLUTION: The substrate cleaning apparatus is provided with a suction port 12 at an upper part of a cleaning tank 11, and a exhaust port 17 at the bottom portion to form down-flow within the cleaning tank 11. The apparatus rotates a substrate Wf to be cleaned within the cleaning tank 11 to realize cleaning and drying processes of the substrate to be cleaned within the same cleaning tank 11. Moreover, a door 14 is also provided to close and open the suction port 12. When the pressure in the cleaning tank 11 is defined as PIN, while an outside pressure of the cleaning tank is defined as POUT, the suction port 12 is opened for the condition of PIN<POUT and the suction port 12 is closed for the condition of PIN>=POUT.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus capable of cleaning a substrate such as a semiconductor wafer with a chemical solution and spin drying in the same cleaning tank, and a substrate processing apparatus using the substrate cleaning apparatus. It is.

[0002]

2. Description of the Related Art In a single-wafer cleaning apparatus for cleaning a substrate such as a semiconductor wafer while rotating the substrate, when cleaning is performed using a chemical as a cleaning liquid, the cleaning tank is evacuated in consideration of diffusion of a chemical liquid atmosphere, and the inside of the tank is exhausted. It was necessary to make the washing tank closed (closed structure) in order to make a small negative pressure. When so-called spin drying is performed in which the substrate is rotated at high speed in such a cleaning tank having a closed structure to remove the liquid droplets of the cleaning liquid by centrifugal force and dried, a clean flow is obtained from the top of the cleaning tank by a down flow due to the closed structure. Air could not be sufficiently introduced, the substrate was dried in a chemical solution atmosphere, and it was difficult to clean the substrate due to mist reattachment.

Therefore, in order to eliminate the re-adhesion of the mist and the like, it is necessary to separately provide a cleaning tank for performing chemical cleaning and a drying tank for performing spin drying. However, when the washing tank and the drying tank are separately provided, the size becomes large, the installation space is required widely, and the cost increases.

[0004]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above points. Even when a chemical solution is washed and spin-dried in a single tank, a sufficient amount of clean air can be supplied by a down flow, and a moderate closed Safe substrate cleaning device that can prevent diffusion of chemical solution atmosphere and prevent mist re-adhesion during drying, and maintain a closed structure even when the exhaust system fails, preventing diffusion of chemical solution atmosphere. And a substrate processing apparatus using the substrate cleaning apparatus.

[0005]

According to a first aspect of the present invention, there is provided a cleaning tank provided with a cleaning tank, an intake port provided at an upper portion of the cleaning tank, and an exhaust port provided at a bottom portion. A substrate cleaning apparatus that forms a down flow inside, rotates a substrate to be cleaned in the cleaning tank, and enables cleaning and drying of the substrate to be cleaned in the same cleaning tank. An opening / closing means for closing and opening is provided, and the pressure in the cleaning tank is set to P _IN , and the pressure outside the cleaning tank is set to P _OUT . When P _IN <P _OUT , the opening and closing means opens the intake port, and P _IN ≧ P _OUT In this case, the intake port is closed.

As described above, when P _IN <P _OUT , the opening / closing means opens the intake port, and when P _IN ≧ P _OUT , the intake port is closed. If the diameter is smaller than the above, a downflow due to clean air is formed in the cleaning tank, and the substrate to be cleaned can be cleaned and dried while preventing the diffusion of the atmosphere of the cleaning liquid (chemical solution or the like). If the pressure inside the cleaning tank becomes higher than the pressure outside the cleaning tank due to a failure of the exhaust system (P _IN ≧ P _OUT ), the suction port at the top of the cleaning tank is closed by the opening / closing means. It is possible to prevent the atmosphere of (3) from diffusing out of the cleaning tank.

[0007] The invention described in claim 2 is the first invention.
Wherein the opening and closing means is P _IN ≧ P
_At the time of _OUT , the suction port is closed using gravity and the pressure difference between the inside and outside of the washing tank, and when P _IN <P _OUT , the door is opened by the pressure difference between inside and outside of the washing tank. I do.

[0008] The invention described in claim 3 is the first invention.
Wherein the opening and closing means includes a door that opens and closes an intake port, a tank pressure sensor that detects a pressure P _IN in the cleaning tank, and a tank pressure sensor that detects a pressure P _OUT outside the cleaning tank. , P _IN <P _OUT open the intake port and
_{When IN} ≧ _POUT , door drive control means for controlling the drive of the door so as to close the intake port is provided.

According to a fourth aspect of the present invention, there is provided a load / unload section for loading / unloading a substrate to be processed, a substrate processing section for processing a substrate to be processed, a substrate cleaning section for cleaning and drying the substrate to be processed, and various parts. A substrate transport mechanism for transporting the substrate to the substrate processing mechanism. The substrate transport mechanism takes out an unprocessed substrate from the loading / unloading unit, transports the substrate to the substrate processing unit, and processes the substrate processed by the substrate processing unit. Transported to the substrate cleaning section,
The substrate to be processed, which has been cleaned and dried in the substrate cleaning section, is loaded and
In the substrate processing apparatus that is transported and stored in the unloading section,
The substrate cleaning unit is provided with at least one cleaning device, and at least one of the cleaning devices uses the substrate cleaning device according to any one of claims 1 to 3.

[0010] Since the substrate cleaning section uses the substrate cleaning apparatus according to any one of claims 1 to 3, the pressure in the cleaning tank becomes higher than the pressure outside the cleaning tank due to a failure of the exhaust system of the substrate cleaning apparatus. In this case, since the intake port at the top of the cleaning tank is closed by the opening / closing means, the substrate processing apparatus does not diffuse the atmosphere of the cleaning liquid (chemical solution or the like) outside the cleaning tank. In particular, by using the substrate cleaning apparatus according to any one of claims 1 to 3 for cleaning and drying in the final stage, contamination or the like due to re-adhesion of the chemical mist can be prevented.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a schematic configuration of a substrate cleaning apparatus according to the present invention. In the figure, reference numeral 11 denotes a cleaning tank of the substrate cleaning apparatus 10, and an inlet 12 for introducing clean air is provided at the top of the cleaning tank 11. The upper part of the air inlet 12 is covered with an air introduction chamber 13,
An opening 16 is provided in a side wall of the air introduction chamber 13, and an opening / closing door 14 for opening and closing is provided in the opening 16 so as to be rotatable by a hinge mechanism 15. A weight 14 a is provided at the tip of the door 14.

Exhaust ports 17, 17 are provided at the bottom of the cleaning tank 11, and the exhaust ports 17, 17 are connected to an exhaust system (not shown). A substrate holding / rotating mechanism 18 that holds and rotates a substrate to be cleaned Wf such as a semiconductor wafer is disposed inside the cleaning tank 11. A plurality of substrate holding / rotating mechanisms 18 (4 in FIG.
) Of the plurality of holding members 19.
Is mounted on a base 20, which is supported by a rotating shaft 21 and is rotatable in the direction of arrow A by a rotary drive mechanism (not shown) arranged outside the washing tank 11. Note that a seal mechanism 22 is provided at a portion where the rotating shaft 21 passes through the bottom of the cleaning tank 11. In addition, 25 is a drain hole.

Chemical solution nozzles 23, 23 for spraying a chemical solution as a cleaning liquid on the upper and lower surfaces of the substrate Wf to be cleaned held by the substrate holding and rotating mechanism 18 are provided in the vertical direction of the substrate Wf to be cleaned. A pure water nozzle 24 for injecting ultrapure water as a cleaning liquid onto the upper and lower surfaces of the substrate Wf to be cleaned;
24 are provided in the up-down direction. Although not shown, the substrate holding and rotating mechanism 18 includes a plurality of holding members 1.
An opening / closing mechanism for opening and closing the cleaning substrate 9 is provided so that the substrate to be cleaned Wf carried in by the transport robot can be held therebetween, and the substrate to be cleaned Wf that has been washed and dried can be carried out by the transport robot.

[0014] In the substrate cleaning apparatus having the above structure, the pressure in the cleaning tank 11 P _IN, the pressure outside the cleaning tank 11 and P _OUT, the P _IN = For P _OUT door 14 that mass 14a, FIG. As shown in FIG. 2, the opening 16 on the side wall of the air introduction chamber 13 is closed. In this state, the inside of the cleaning tank 11 is exhausted through the exhaust ports 17, 17, and when P _IN <P _OUT , the pressure difference causes the opening / closing door 14 to rotate in the direction of arrow B in FIG. . As a result, clean air is introduced into the cleaning tank 11 through the opening 16 and the intake port 12, forms a downflow in the tank, and is discharged from the exhaust ports 17, 17.

In this down-flow atmosphere, a diluted hydrofluoric acid (DHF) solution or the like is ejected from the solution nozzles 23, 23 as a solution onto the upper and lower surfaces of the substrate Wf to be cleaned which is held and rotated by the substrate holding and rotating mechanism 18. Then, the substrate Wf to be cleaned is cleaned with a chemical solution. Subsequently, ultrapure water is sprayed from the pure water nozzles 24 onto the upper and lower surfaces of the substrate Wf to be cleaned, and the substrate Wf to be cleaned is cleaned with pure water. Subsequently, the substrate to be cleaned Wf is rotated at a high speed by the high-speed rotation of the substrate holding / rotating mechanism 18, and the centrifugal force removes droplets adhering to the surface to spin dry the substrate to be cleaned Wf. Through this chemical cleaning, pure water cleaning and spin drying, a clean air downflow is formed in the cleaning tank 11, so that the chemical and pure water mist are exhausted without scattering to the outside, and the mist is re-attached. To be cleaned W
f is not contaminated.

If P _IN ≧ P _OUT due to a failure of the exhaust system, the opening / closing door 14 closes the opening 16 of the air introduction chamber 13 by the weight 14a as shown in FIG.
Since the inside is sealed, the cleaning atmosphere such as a diluted hydrofluoric acid (DHF) solution does not diffuse into the cleaning tank 11 and can be kept safe for a certain time.

FIG. 3 is a sectional view showing a schematic configuration of a substrate cleaning apparatus according to the present invention. In FIG. 3, portions denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding portions. This substrate cleaning apparatus is provided with a rotating door 26 for opening and closing the air inlet 12 provided on the top of the cleaning tank 11, and the rotating door 26 is driven to rotate by a driving mechanism 27. The rotation drive mechanism 27 is controlled by a control unit 28. The output of the internal pressure sensor 29 for detecting the internal pressure P _IN of the cleaning tank 11 and the output of the external pressure sensor 29 ′ for detecting the external pressure P _OUT of the cleaning tank 11 are input to the control unit 28.

The control unit 28 controls the internal pressure P _IN and the external pressure P
_OUT is compared, and if P _IN <P _OUT , the revolving door 26 is rotated in the direction of arrow C to open the air inlet 12. Conversely, P _IN ≧ P _OUT
In the case of, the revolving door 26 is rotated in the direction opposite to the arrow C,
The intake port 12 is closed as shown in FIG.

In the substrate cleaning apparatus having the above structure, P _IN =
In the case of P _OUT , as described above, the revolving door 26 closes the intake port 12 as shown in FIG. In this state, the exhaust port 1
The inside of the washing tank 11 is evacuated through 7 and 17, and P _IN <P _OUT
Then, the control unit 28 rotates the revolving door 26 in the direction of arrow C by the rotation driving mechanism 27 to open the air inlet 12.
As a result, clean air is introduced into the cleaning tank 11 through the intake port 12 and forms a downflow in the tank to form the exhaust port 17.
It is discharged from 17.

In this down-flow atmosphere, a diluted hydrofluoric acid (DHF) solution or the like is ejected from the solution nozzles 23, 23 as the solution onto the upper and lower surfaces of the substrate Wf to be cleaned, which is held and rotated by the substrate holding and rotating mechanism 18. Then, the substrate Wf to be cleaned is cleaned with a chemical solution. Subsequently, ultrapure water is sprayed from the pure water nozzles 24 onto the upper and lower surfaces of the substrate Wf to be cleaned, and the substrate Wf to be cleaned is cleaned with pure water. Subsequently, the substrate to be cleaned Wf is rotated at a high speed by the high-speed rotation of the substrate holding / rotating mechanism 18, and the centrifugal force removes droplets adhering to the surface to spin dry the substrate to be cleaned Wf. Through the chemical cleaning, the pure water cleaning and the spin drying, a clean air downflow is formed in the cleaning tank 11, so that the chemical or pure water mist does not scatter to the outside and the mist is re-adhered to the mist. The cleaning substrate Wf is not contaminated.

In the above example, the cleaning mechanism of the substrate cleaning apparatus uses the substrate Wf to be cleaned which is rotated and held by the substrate holding and rotating mechanism.
A cleaning mechanism for jetting a chemical solution from the chemical solution nozzles 23 and 23 and ultrapure water from the pure water nozzles 24 and 24 for cleaning is shown on the upper and lower surfaces, but is not limited thereto. For example, as shown in FIG. Has a swing arm 111 supported by a swing rotation shaft 110, and a rotation shaft 112 is attached below the tip of the swing arm 111, and the tip of the rotation shaft 112 is made of a porous material such as a sponge material. A configuration in which a pencil-type cleaning tool 113 having a cleaning member 113a is attached may be used.

In this cleaning mechanism, the cleaning member 113a of the cleaning tool 113 is brought into contact with the upper surface of the substrate to be cleaned Wf which is rotated and held by the substrate holding and rotating mechanism 18, and is omitted in FIG. 5, but as shown in FIG. Then, chemical solution cleaning and pure water cleaning are performed while jetting a chemical solution from the chemical solution nozzles 23 and 23 and ultrapure water from the pure water nozzles 24 and 24 onto the upper and lower surfaces of the substrate Wf to be cleaned. Thereafter, the swing arm 111 is moved, and the substrate to be cleaned Wf is spin-dried.

FIGS. 6 and 7 show the structure of a substrate polishing apparatus using the substrate cleaning apparatus according to the present invention. FIG. 6 is a plan view and FIG. 7 is a sectional view. The substrate polishing apparatus is entirely surrounded by a partition 100, and includes a polishing section 30, a cleaning section 5
0, a load / unload unit 70.
A partition 101 is provided between the polishing unit 30 and the cleaning unit 50, and a partition 102 is provided between the cleaning unit 50 and the load / unload unit 70. The transfer of the substrate to be polished between the adjacent parts is performed through openings provided in the partition walls 101 and 102.

Load / unload section 70 of substrate polishing apparatus
Is connected to the clean room CR, and the other parts are separated from the maintenance room M by partitions.
It is installed at R. The polishing section 30 is a turntable 31
And a top ring unit 33 having a top ring 32 that presses against the turntable 31 while holding the substrate to be polished. The turntable 31 is a driving unit 3
8 enables rotation about the axis center. A polishing cloth 34 is attached to the upper surface of the turntable 31.

The top ring unit 33 is swingable, and is disposed at a polishing position on the turntable 31 between a transfer position above the pusher 37 for transferring the substrate to be polished and a standby position. It has become. The top ring 32 is connected to a motor and a cylinder (not shown). Thus, the top ring 32 can move up and down and rotate around its axis, so that the substrate to be polished can be pressed against the polishing cloth 34 with an arbitrary pressure. The substrate to be polished is attracted to the lower end surface of the top ring 32 by vacuum or the like. A polishing liquid supply nozzle (not shown) is provided above the turntable 31 so that the polishing liquid is supplied to the polishing cloth 34 on the turntable 31 by the polishing liquid supply nozzle. The dressing unit further includes a dresser unit 36 having a dresser 35 for conditioning the polishing cloth 34.

The cleaning unit 50 is installed at the center,
Two transfer robots 51 and 52 that can move in the directions shown in FIG.
, A primary cleaning machine 53, a secondary cleaning machine 54, a tertiary cleaning machine 55, and reversing machines 56 and 57 for reversing a substrate to be polished. A cassette 71 for accommodating a substrate to be polished is placed on the loading / unloading section 70 installed adjacent to the cleaning section 50. The substrate to be polished in the cassette 71 is received by the transfer robot 52 and transferred to the reversing device 56, where it is turned over, and then transferred to the pusher 37 of the polishing section 30 by the transfer robot 51.

The substrate to be polished by the polishing section 30 is transferred by a transfer robot 51 to a reversing machine 57, where the substrate is reversed, and then a primary cleaning machine 53, a secondary cleaning machine 54,
It is sequentially sent to the tertiary washing machine 55. After being washed by the tertiary washing machine 55 and spin-dried, the transfer robot 52 returns the cassette to the loading / unloading unit 70. As shown in FIG. 6, an exhaust duct 58 for discharging the air in the cleaning unit 50 to the outside is provided on the partition wall of the cleaning unit 50. The exhaust duct 58 communicates with the outside. In FIG. 7, the tertiary washing machine 55 is omitted to show the exhaust duct 58.

The polishing liquid mist and generated gas generated in the polishing section 30 during polishing of the substrate to be polished are exhausted from the exhaust duct 39 together with dust on the drive belt of the drive section 38 of the turntable 31. Also, a primary cleaning machine 53 and a secondary cleaning machine 54
Then, the mist of the washing water generated in the tertiary washing machine 55 is exhausted from the exhaust duct 58 '. As for the air corresponding to these exhausts, the clean air in the clean room CR flows into the cleaning section 50 from the cassette transfer port 72, and the air flowing from the suction port 90 of the filter block 80 blows out into the cleaning section 50, and the partition wall. The substrate is supplied into the polishing section 30 through a substrate-to-be-polished delivery port 101 a provided in the substrate 101.

The filter block 80 has a built-in fan 81. The outlet of the fan 81 has a filtration accuracy of 0.1 μm.
The HEPA filter 82 is attached, and a chemical filter 83 for adsorbing and removing harmful gas is attached to the inlet side of the fan 81. The clean air from the HEPA filter 82 is transferred to the moving range of the transfer robots 51 and 52 and the primary cleaning machine 5.
3, a range including the secondary cleaning machine 54 and the tertiary cleaning machine 55,
In other words, the air is blown down into the moving range of the substrate to be polished, and a part of the air blown down flows to the polishing section 30 described above, and most of the air descends to the floor of the apparatus.

A duct header 59, which is a flat box-shaped tube, is mounted on the floor surface. The duct header 59 is provided with a large number of holes 60, and the holes 60 have blades (FIG. (Not shown). Duct header 59
Are connected to a filter block 80 by a duct 61. The air that has descended to the floor of the apparatus is sucked through the hole 60, collected in the duct header 59, and drawn into the chemical filter 83 through the duct 61.

A substrate cleaning apparatus 10 having the structure shown in FIG. 1 or FIG. 3 is used for at least one of the primary cleaning machine 53, the secondary cleaning machine 54, and the tertiary cleaning machine 55 (in FIG. 1, FIG. (Substrate cleaning apparatus shown), the exhaust from the exhaust ports 17 and 17 flows to an exhaust duct 58 '. As a result, the pressure P _IN in the cleaning tank 11 becomes outside the cleaning tank 11 (the cleaning section 5).
If the pressure P _{OUT is} smaller than the pressure P _OUT , that is, if P _IN <P _OUT , the pressure difference causes the opening / closing door 14 to rotate in the direction of arrow B in FIG. As a result, the opening 16
Then, clean air is introduced into the cleaning tank 11 through the suction port 12, forms a downflow in the tank, is discharged from the exhaust ports 17, 17, and is discharged to the exhaust duct 58 '.

In this down-flow atmosphere, a diluted hydrofluoric acid (DHF) solution or the like is injected as a chemical from the chemical nozzles 23 onto the upper and lower surfaces of the rotating substrate Wf held and rotated by the substrate holding / rotating mechanism 18. Then, the substrate Wf to be cleaned is cleaned with a chemical solution. Subsequently, ultrapure water is sprayed from the pure water nozzles 24 onto the upper and lower surfaces of the substrate Wf to be cleaned, and the substrate Wf to be cleaned is cleaned with pure water. Subsequently, the substrate to be cleaned Wf is rotated at a high speed by the high-speed rotation of the substrate holding / rotating mechanism 18, and the centrifugal force removes droplets adhering to the surface to spin dry the substrate to be cleaned Wf.

When P _IN ≧ P _OUT due to a failure of the exhaust system connected to the exhaust duct 58 ′, as shown in FIG.
Since the opening 16 of the cleaning tank 11 is closed, the cleaning atmosphere such as dilute hydrofluoric acid (DHF) is not diffused into the cleaning tank 11 and the cleaning tank 11 can be kept safe for a certain time.

When a substrate cleaning apparatus having the structure shown in FIG. 3 is used as the cleaning section 50 of the substrate polishing apparatus, the control section 28 compares the internal pressure P _IN with the external pressure P _OUT and determines that P _IN <P _OUT . In this case, the revolving door 26 is rotated in the direction of arrow C to open the air inlet 12. Conversely, when P _IN ≧ P _OUT , the revolving door 26 is rotated in the direction opposite to the arrow C to close the intake port 12 as shown in FIG.

In the above example, a substrate polishing apparatus for polishing a substrate has been described as an example of a substrate processing apparatus according to the present invention. However, after performing some processing on the substrate, the processed substrate is cleaned. It is a matter of course that the substrate cleaning apparatus according to the present invention can be used as long as the substrate processing apparatus has a cleaning unit.

[0036]

As described above, according to the first to third aspects of the present invention, the following excellent effects can be expected.

(1) When the pressure P _IN in the cleaning tank is smaller than the pressure P _OUT outside the cleaning tank, that is, when P _IN <P _OUT , the opening / closing means opens the intake port, and clean air is supplied from the intake port. Since it is introduced and discharged from the exhaust port at the bottom of the cleaning tank, a downflow is formed by clean air in the cleaning tank, and the substrate to be cleaned can be cleaned and dried while preventing the diffusion of the atmosphere of the cleaning liquid (chemical solution, etc.). Therefore, even if the chemical solution is washed and spin-dried in one tank, it is possible to provide a substrate cleaning apparatus capable of preventing the diffusion of the chemical solution atmosphere and preventing the mist from reattaching during drying. In addition, since the chemical cleaning and spin drying can be performed in one tank, the size of the apparatus can be reduced.

(2) Further, when the pressure inside the cleaning tank becomes higher than the pressure outside the cleaning tank due to a failure of the exhaust system or the like (P _IN ≧ P
_OUT ), since the intake port at the top of the cleaning tank is closed by the opening / closing means, a sealed structure can be maintained for a certain time, and a safe substrate cleaning apparatus capable of preventing diffusion of the chemical solution atmosphere can be provided.

According to the fourth aspect of the present invention, since the substrate cleaning apparatus according to any one of the first to third aspects is used in the substrate cleaning section, the diffusion of the chemical solution atmosphere from the cleaning section is prevented and the cleaning section is used. It is possible to provide a substrate processing apparatus capable of preventing mist from re-adhering when the substrate is dried. Further, when the pressure in the cleaning tank becomes higher than the pressure outside the cleaning tank due to a failure of the exhaust system of the substrate cleaning apparatus or the like, the intake port at the top of the cleaning tank is closed by the opening / closing means, so that the atmosphere of the cleaning liquid (chemical solution, etc.) A substrate processing apparatus can be provided that does not diffuse out of the cleaning tank.

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration example of a substrate cleaning apparatus according to the present invention.

FIG. 2 is a diagram illustrating an operation example of an opening / closing door of an air introduction chamber of the substrate cleaning apparatus of FIG. 1;

FIG. 3 is a diagram showing a schematic configuration example of a substrate cleaning apparatus according to the present invention.

FIG. 4 is a diagram illustrating an operation example of an opening / closing door of an intake port of the substrate cleaning apparatus of FIG. 3;

FIG. 5 is a diagram illustrating a configuration example of a cleaning mechanism of the substrate cleaning apparatus according to the present invention.

FIG. 6 is a plan view showing a schematic configuration example of a substrate polishing apparatus according to the present invention.

FIG. 7 is a cross-sectional view illustrating a schematic configuration example of a substrate polishing apparatus according to the present invention.

DESCRIPTION OF SYMBOLS 10 Substrate cleaning device 11 Cleaning tank 12 Intake port 13 Air introduction chamber 14 Opening / closing door 15 Hinge mechanism 16 Opening 17 Exhaust port 18 Substrate holding and rotating mechanism 19 Nipping member 20 Base 21 Rotating shaft 22 Sealing mechanism 23 Chemical liquid nozzle 24 Pure water nozzle 25 Drain hole 26 Rotating door 27 Rotation drive mechanism 28 Control unit 29 Internal pressure sensor 29 'External pressure sensor 30 Polishing unit 50 Cleaning unit 70 Load / unload unit 80 Filter block

Claims (4)

[Claims] 1. A cleaning tank is provided, an intake port is provided at an upper part of the cleaning tank, an exhaust port is provided at a bottom part, a down flow is formed in the cleaning tank, and a substrate to be cleaned is rotated in the cleaning tank. A substrate cleaning apparatus capable of cleaning and drying the substrate to be cleaned in the same cleaning tank, provided with opening / closing means for closing and opening the suction port, and setting the pressure in the cleaning tank to _PIN. , The pressure outside the washing tank
_The substrate cleaning apparatus is characterized in that the opening is opened by the opening / closing means when P _IN <P _{OUT and} the intake port is closed when P _IN ≧ P _OUT . In the substrate cleaning apparatus according to the claim 1, wherein the switching means when the P _IN ≧ P _OUT, by utilizing a pressure difference of gravity and the cleaning tank and out to close the air inlet, P _IN <P
A substrate cleaning apparatus characterized in that the substrate cleaning apparatus is a door that opens the intake port by a pressure difference between the inside and outside of the cleaning tank at the time of _OUT . 3. The substrate cleaning apparatus according to claim 1, wherein the opening / closing means includes a door that opens and closes the intake port, a tank pressure sensor that detects a pressure P _IN in the cleaning tank, and a pressure outside the cleaning tank. ; and a Sogaiatsu sensor for detecting a P _OUT, P _IN <
Substrate cleaning apparatus characterized by comprising a door driving control means for controlling driving the door so as to close the case of the P _IN ≧ P _OUT the intake port while opening the case of P _OUT the intake port. 4. A load / unload section for loading and unloading a substrate to be processed, a substrate processing section for processing a substrate to be processed, a substrate cleaning section for cleaning and drying the substrate to be processed, and a substrate transport mechanism for transporting the substrate to each section. Comprising, by the substrate transfer mechanism,
Take out the unprocessed substrate from the loading / unloading unit, transport the substrate to the substrate processing unit, transport the substrate to be processed in the substrate processing unit to the substrate cleaning unit, and clean the substrate in the substrate cleaning unit. In a substrate processing apparatus that transports and stores a dried substrate to be loaded and unloaded in the loading / unloading section, at least one cleaning apparatus is installed in the substrate cleaning section, and at least one of the cleaning apparatuses is charged. A substrate processing apparatus using the substrate cleaning apparatus according to any one of Items 1 to 3.