KR20010002424A - Smd type piezoelectric device - Google Patents

Abstract

PURPOSE: Surface-mounting piezoelectric parts are provided to simplify a manufacturing process without forming an additional cavity for a vibrating space of the parts, and to improve reliability by preventing the board from being transformed in forming the cavity. CONSTITUTION: Surface-mounting piezoelectric parts comprise a wrapping material(10), a dielectric board(20), a piezoelectric board(30), a connecting material(40) and an electrode unit(50). The dielectric board embodies input/output terminals of the parts, located opposite to the wrapping material. The piezoelectric board is coupled between the wrapping material and the dielectric board, in which electrodes(32,34) are formed as one body on both sides to overlap each other. The connecting material is adhered among the wrapping material, the dielectric board and the piezoelectric board to form a vibrating space(S) for a vibrating operation of the piezoelectric board. The electrode unit is established outside the wrapping material and the dielectric board.

Description

Surface Mount Piezoelectric Parts {SMD TYPE PIEZOELECTRIC DEVICE}

The present invention relates to a piezoelectric component such as a ceramic vibrator used as a reference signal source of a processor, and more particularly, to a surface mount piezoelectric component for directly mounting a piezoelectric component on a printed circuit board (hereinafter, referred to as a PCB). Therefore, the piezoelectric component can be manufactured more easily while minimizing the size of the piezoelectric component by easily forming the vibration space S without the need for complicated machining to form a separate cavity for the vibration operation of the piezoelectric component. It relates to a surface-mount piezoelectric component that can be easily made.

In general, piezoelectric materials are made of PZT-based or PT-based ceramics, and can be divided into two types that generate vibration by applying mechanical force to the piezoelectric materials or by applying signals. Piezoelectric materials are widely used in ultrasonic devices, sound equipment, communication equipment and various sensors.

In particular, a specific frequency band is selected using the latter vibration, or used as a reference signal source of an electronic component, the piezoelectric filter or piezoelectric vibrator. The latter piezoelectric vibrators are currently used in communication devices, home appliances, It is widely used in automation parts, telephones, computers and toys, and the representative one is used as a reference signal source of a microprocessor.

Such a piezoelectric component is packaged and mounted not only with a piezoelectric plate but also with a dielectric block in order to achieve component miniaturization by integrating a condenser, which is an essential component in circuit construction.

Meanwhile, in order to mount a piezoelectric component on a PCB, a piezoelectric plate is connected to the PCB using a separate lead frame, and then the lead frame is connected to the PCB. The surface mount type method of forming terminal electrodes on piezoelectric parts and mounting them directly on the PCB without using them is mainly used. This is the miniaturization of parts and the miniaturization of electronic products using them. It is divided into a dielectric block constituting an insulator and a base and a piezoelectric plate that is connected to and vibrates therebetween.

In the conventional surface-mounted piezoelectric component related to the above technology, as shown in FIGS. 1 and 2, the central portions overlap both sides of the piezoelectric substrate 110 manufactured by processing and polarizing the piezoelectric material. Electrodes 112 and 114 are formed, respectively, and the exterior member 120 and the dielectric substrate 130 are connected to both sides of the piezoelectric substrate 110 by conductive resin or solder, and the electrodes 132 on both sides of the dielectric substrate 130 are formed. ) 134 and ground electrode 134c are connected to each circuit pattern 152a, 152b, 152c of the PCB 150 on which the component is mounted.

In this case, a capacitor forming an input and an output terminal of the piezoelectric component 100 is implemented between the electrodes 132 and 134 of the dielectric substrate 130, so that the lower electrode 134 of the dielectric substrate 130 is a piezoelectric component. Perform the terminal role of (100). The piezoelectric substrate 110 vibrates to generate a reference signal source of the microprocessor, and thus, the cavity 140a for the vibration space S between the piezoelectric substrate 110 and the exterior member 120 and the dielectric substrate 130. ) 140b is formed.

However, in the conventional surface-mounted piezoelectric component 100 as described above, as shown in FIGS. 1 and 2, the cavity 140a and 140b are essentially formed for vibrating operation of the piezoelectric plate 110. In the actual product) is very fine, for example, only 0.25㎛, and thus the cavity 140, such as the machining operation is extremely difficult, there was a disadvantage that the manufacturing process parts.

In addition, the actual cavity 140 processing operation forms a plurality of cavities 140 on the original plate of the exterior material or the dielectric block, so that the exterior material 120 or the dielectric substrate 130 is easily deformed, thereby greatly reducing the defects of the piezoelectric component. As a result, there have been various problems such as extremely low parts productivity and reliability.

In addition, in order to process the catty 140, expensive processing equipment such as laser processing is required, and thus, a problem that causes an increase in manufacturing cost is additionally generated.

On the other hand, in the piezoelectric component 100 of the related art, since the input, output, and ground electrodes 134a, 134b, and 134c are formed only on the rear surface of the capacitor element 130, the PCB 150 of the piezoelectric component 100 is formed. ) There are various problems such as delay in the manufacturing process because it is necessary to always connect to a certain position during mounting work.

SUMMARY OF THE INVENTION The present invention has been made to improve the above-described problems, and its object is that it is not necessary to form a separate cavity for the vibration space (S) for the vibration operation during the manufacturing process of the surface-mount piezoelectric component. The manufacturing process of a piezoelectric component is simplified, and it is providing the surface mount piezoelectric component which improves the productivity of a piezoelectric component.

In addition, another object of the present invention, there is no need for the machining process for the cavity processing to prevent deformation of the outer material and the dielectric substrate, which improves the mounting efficiency of the piezoelectric component, and at the same time it is easier to miniaturize the component when forming the cavity In addition, it is to provide a surface-mount piezoelectric component that does not require expensive processing equipment and the manufacturing cost is reduced.

1 is an exploded perspective view showing a conventional surface mount piezoelectric vibrator

2 is a structural diagram showing a conventional piezoelectric component

3 is a structural diagram showing a surface mount piezoelectric component according to the present invention;

Explanation of symbols on the main parts of the drawings

Piezoelectric parts

20 .... Dielectric substrate 30 .... Piezoelectric substrate

40 .... Connecting member 50 .... Electrode means

60 .... Printed Circuit Board (PCB) 62 .... Board Electrode

As a technical configuration for achieving the above object, the present invention provides an exterior material,

A dielectric substrate facing the exterior material and implementing the input and output terminals of the component;

A piezoelectric plate disposed between the exterior material and the dielectric substrate and having electrodes integrally formed at both sides thereof so that a central portion thereof overlaps;

A connecting member connected between the exterior member, the dielectric substrate, and the piezoelectric plate to form a vibration space S for vibrating operation of the piezoelectric plate;

It is to provide a surface-mount piezoelectric component consisting of a configuration including an electrode means formed to the outside of the packaging material and the dielectric substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a structural diagram showing a surface-mount piezoelectric component according to the present invention.

Currently, it is widely used in communication devices, home appliances, automation parts, telephones, computers, toys, etc., and is typically used as a reference signal source of a microprocessor, and is a surface mount piezoelectric part (1), that is, a vibration space of a vibrator. The surface mounted piezoelectric component 1 which does not need to process a separate cavity for S) is as follows.

First, the piezoelectric component 1 according to the present invention is provided between the exterior member 10 which forms a cover for protecting the component largely and the dielectric substrate 20 connected to the opposite side, and between the exterior member 10 and the dielectric substrate 20. It is divided into a large piezoelectric plate 30 that performs the resonant operation of the piezoelectric component (1) substantially.

At this time, the outer packaging material 10 is usually made of an insulator of MgTiO ₃ or Al ₂ O ₃ , and is usually formed in a thin plate shape in the case of a surface mounting type, such a packaging material 10 is directed to the upper side when mounting components The piezoelectric plate 30 is to be protected.

On the other hand, the dielectric substrate 20 is usually formed of BaTiO ₃ is connected to the opposite side of the packaging material 10, and as will be described in detail below, a capacitor between the two electrodes 52, 50 of the dielectric substrate 20 Therefore, the input and output terminals of the piezoelectric component 1 are formed, and the dielectric substrate 20 is integrally formed with the piezoelectric substrate 30. As described above, an essential component in the circuit configuration is a capacitor. Packaged to simplify circuit configuration and minimize component space.

At this time, the piezoelectric substrate 30 is positioned between the exterior material 10 and the dielectric substrate 20. The piezoelectric substrate 30 is a polarization process and a processing process so that the ceramic block of the PZT or PT series is usually piezoelectric. If the electrodes 32 and 34 are formed on both sides of the piezoelectric plate 30 so as to overlap each other at the center, the vibration between the electrodes 32 and 34 when voltage is applied. This piezoelectric part 1 is usually called a ceramic vibrator.

In addition, in order to generate vibration between the electrodes 32 and 34 of the piezoelectric substrate 30, a predetermined space is required between the exterior member 10 and the dielectric substrate 20 positioned at both sides thereof, as shown in FIG. As shown in FIG. 3, without forming a separate cavity 140 on the conventional exterior member 120 and the dielectric substrate 130, in the present invention, the exterior member is formed to form such a vibration space S. FIG. 10, the dielectric substrate 20 and the piezoelectric substrate 30 to form a predetermined step to bond the connecting member 40 to form a vibration space (S).

In other words, when the connection member 40 made of silicon (SiO ₂ ) is integrally bonded to both ends of the exterior material 10 and the dielectric substrate 20 and the piezoelectric substrate 30 therebetween, the exterior material 10 and the dielectric substrate are bonded to each other. As the space is formed between the 20 and the piezoelectric plate 30 as much as the connection member 40, the vibration space S is simply formed in the vibration generating portion where the electrodes 32 and 34 overlap. .

Accordingly, the manufacturing process of the piezoelectric component 1 is simplified by simply forming the vibration space S as the connecting member 40 without the need for the cavity 140 processing operation for forming the conventional vibration space S, In addition to component productivity, various defects such as substrate deformation generated during cavity processing can be prevented.

On the other hand, the electrode means 50 for implementing the internal electrode 52 and the input and output capacitors to the outside of the dielectric substrate 20 is integrally formed to be wrapped around the outside of the component 1, the piezoelectric substrate 30 And the electrodes 32, 34, 42 and 50 of the dielectric substrate 20 are connected to each other so that the electrode means 50 can be input and output at the time of mounting the PCB 60 on the piezoelectric part 1. The electrodes 50a), 50b) and the ground electrode 50c are connected to the input / output and ground patterns 62a, 62b and 62c of the PCB 60 while performing terminal functions.

Therefore, the electrode means 50 which performs the role of the terminal to be audited to the outside of the component 1 is formed, so that the mounting operation of the piezoelectric component 1 can be performed more easily, and in particular, the soldering work or the like can be easily connected. It can be done.

Accordingly, it is not necessary to form a separate cavity for the vibration space S of the piezoelectric component 1, thereby facilitating the manufacturing work of the piezoelectric component 1, and preventing deformation of parts, and the like, by the electrode means 50. PCB (50) mounting is also to perform smoothly.

As described above, according to the surface-mount piezoelectric component of the present invention, there is no need to form a separate cavity for the vibration space of the component, thereby simplifying the manufacturing process of the piezoelectric component, thereby improving component productivity.

In addition, by preventing deformation of the substrate that may occur in the cavity processing process in advance, the piezoelectric component reliability is improved, component miniaturization, and cost is also reduced.

In addition, due to the electrode means surrounding the component, there is an excellent effect that the PCB mounting operation of the piezoelectric component is made easier.

While the invention has been shown and described with respect to particular embodiments, it will be appreciated that various changes and modifications can be made therein without departing from the spirit or scope of the invention as set forth in the claims below.

Claims (5)

In the surface mount piezoelectric component 1, Exterior material 10, A dielectric substrate 20 positioned to face the exterior member 10 and implementing an input / output terminal of the component; A piezoelectric plate 30 connected between the exterior member 10 and the dielectric substrate 20 and having electrodes 32 and 34 integrally formed at both sides thereof so that a central portion thereof overlaps with each other; A connection member 40 bonded to form the vibration space S for vibrating operation of the piezoelectric plate 30 between the exterior material 10, the dielectric substrate 20, and the piezoelectric substrate 30; Surface-mount piezoelectric component, characterized in that it comprises an electrode means (50) formed to the outside of the exterior material 10 and the dielectric substrate (20) The method of claim 1, wherein the electrode means 50 is connected to the electrodes 32, 34 of the piezoelectric substrate 20, the inner electrode 52 of the dielectric substrate 20, and implements a capacitor PCB A piezoelectric component comprising an input and output electrode 50a, 50b and a ground electrode 50c connected to the input, output, and ground patterns 62a, 62b, and 62c of 60. The method of claim 2, wherein the input, output and ground electrodes (50a, 50b, 50c) is formed so as to be wrapped around the outside of the component to facilitate the mounting of the PCB 60 of the component at any position. Piezoelectric Parts The piezoelectric component of claim 1, wherein the connection member 40 is integrally formed at both ends of the exterior member 10, the piezoelectric substrate 30, and the dielectric substrate 20. The piezoelectric component as claimed in claim 4, wherein the connection member (40) is made of silicon.