JP2006041926A - Package for housing piezoelectric resonator, and piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing a piezoelectric resonator which can be miniaturized even if the piezoelectric resonator is housed together with the other electronic component such as a semiconductor element, is excellent in characteristics such as oscillation frequency characteristics of the piezoelectric resonator, and is excellent in the reliability of electric connection to an external electric circuit etc, and to provide a piezoelectric device. <P>SOLUTION: The apparatus is provided with an insulating base 1 having a recess 5 formed on its top surface, a frame 10 formed around the entire periphery of the recess 5 on the top surface of the insulating base 1, a wiring conductor 6 formed from the inside of the frame 10 toward the external surface of the insulating base 1, and a lid 7 attached on the top surface of the insulating base 1 so as to close the recess 5. Piezoelectric resonators 2, 3 and an electronic component 4 are housed in the recess 5, and a semiconductor element 8 is mounted on the top surface of the lid 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a piezoelectric vibrator housing package and a piezoelectric device that house a piezoelectric vibrator such as a crystal vibrator inside an insulating base, and in particular, the piezoelectric vibrator together with other electronic components such as a semiconductor element. The present invention relates to a piezoelectric vibrator housing package for hermetically housing and a piezoelectric device using the piezoelectric vibrator housing package.

  In an electronic device such as a communication device such as a mobile phone or a car phone, or an information device such as a computer or an IC card, a piezoelectric vibrator such as a crystal vibrator is used as a reference for frequency and time. Hereinafter, piezoelectric devices that are hermetically housed in a package) are also widely used.

  As such a piezoelectric device, in recent years, an AT-cut crystal resonator and a tuning-fork crystal resonator are housed in a single package as a piezoelectric resonator, and the package is used for controlling a semiconductor element having an oscillation circuit. There has been proposed a piezoelectric device having a plurality of oscillation sources, that is, a so-called dual clock module type piezoelectric device having a structure in which the electronic components are mounted and housed.

  Note that the AT-cut crystal resonator functions as an oscillation source for a main clock in, for example, the MHz band, and the tuning fork crystal resonator functions as a sub-clock (for example, for standby operation) in, for example, the kHz band.

  FIG. 3A is a plan view schematically showing the configuration of a conventional piezoelectric device, and FIG. 3B is a cross-sectional view thereof. In the figure, 51 is a substrate, 52 is a semiconductor element having an oscillation circuit for controlling the oscillation frequency of the crystal oscillator, 53 is an AT-cut crystal oscillator as a piezoelectric oscillator, and 54 is a tuning fork as a piezoelectric oscillator. Type crystal resonator. The semiconductor element 52 having the oscillation circuit is fixed on the substrate 51 with a conductive adhesive, and is further connected to the connection pad 57 by an electrical connection means such as a bonding wire 56 and disposed on the lower surface of the outer peripheral portion of the substrate 51. It is electrically connected to the input / output terminal 60.

  Further, the AT-cut crystal resonator 53 and the tuning-fork crystal resonator 54 that oscillate at a predetermined frequency are respectively joined to the mounting portion in the recess 55 formed on the upper surface of the substrate 51, and the recess 55 is formed on the upper surface of the base 51. The AT-cut crystal unit 53 and the tuning-fork type crystal unit 54 are hermetically sealed by bonding the lid 62 and the like to the sealing metallization layer 58 formed so as to be surrounded by a brazing material such as solder. The device is configured.

  Such a piezoelectric device is mounted, for example, by connecting an input / output terminal 60 to a predetermined position of an external circuit board 61 that constitutes an electronic device such as a mobile phone via solder or the like, and an oscillation source for a main clock. A reference signal such as a communication frequency is transmitted from the AT-cut crystal unit 53 to the electric circuit of the electronic device. In addition, when the main power supply of the electronic device is turned off, the tuning fork type crystal resonator for the sub clock (for standby operation) continues to operate, and functions such as, for example, keeping time and timer.

Reference numeral 59 denotes an electronic component such as a capacitive element or an inductor element that forms an oscillation circuit together with the piezoelectric vibrators 53 and 54 and the semiconductor element 52.
Japanese Patent Laid-Open No. 6-232631

  However, when a plurality of piezoelectric vibrators 53 and 54 and another electronic component 59 such as the semiconductor element 52 are mounted and housed in one package as described above, the mounting area increases, so that the outer shape of the package is increased. However, there is a problem that it is difficult to reduce the size of the information communication device.

  In particular, when the AT cut type crystal resonator 53 and the tuning fork type crystal resonator 54 are simultaneously mounted on the substrate 51 as in the dual clock module type piezoelectric device, the piezoelectric device becomes very large.

  Further, when the semiconductor element 52, the AT-cut type crystal unit 53, the piezoelectric unit such as the tuning fork type crystal unit 54, and the electronic component 59 are simultaneously mounted and accommodated on the substrate 51, the electric circuit is generated. There is a problem that the oscillation frequency characteristics of the piezoelectric vibrators 53 and 54 are adversely affected by electromagnetic waves.

  Further, the external circuit board 61 to which the input / output terminal 60 disposed on the lower surface of the outer peripheral portion of the substrate 51 of the piezoelectric device is connected is generally made of a resin made of glass epoxy or the like. Since the coefficient of thermal expansion is different from that of frequently used ceramics (alumina ceramics, etc.), the input / output terminal 60 disposed on the lower surface of the outer peripheral portion of the substrate 51 and the main surface of the external circuit substrate 61 by the temperature cycle after connection. There is a problem that a thermal stress is generated between the connection pad and the connection pad formed on the, and a defect such as a solder crack or disconnection occurs in the connection portion of the input / output terminal 60 due to the thermal stress.

  The present invention has been devised in view of the problems of the prior art, and the object thereof is to enable downsizing even if the piezoelectric vibrator is housed together with other electronic components such as a semiconductor element, and An object of the present invention is to provide a piezoelectric vibrator housing package and a piezoelectric device that are excellent in characteristics such as an oscillation frequency characteristic of a piezoelectric vibrator and that are excellent in reliability of electrical connection to an external electric circuit or the like.

  The piezoelectric vibrator housing package of the present invention includes an insulating base having a recess formed on the upper surface, a frame formed around the recess on the upper surface of the insulating base, and the inside from the inside of the frame. A wiring conductor formed over the outer surface of the insulating base; and a lid attached to the upper surface of the insulating base so as to close the concave portion, and the piezoelectric vibrator and the electronic component are accommodated in the concave portion. A semiconductor element is mounted on the upper surface of the lid.

  In the piezoelectric vibrator housing package of the present invention, it is preferable that the piezoelectric vibrator includes an AT-cut crystal vibrator and a tuning fork crystal vibrator.

  In the piezoelectric vibrator housing package according to the present invention, preferably, the piezoelectric vibrator is composed of a long thin AT-cut crystal vibrator and a long thin tuning fork crystal vibrator, and the longitudinal directions thereof are orthogonal to each other. And is housed in the recess.

  The piezoelectric device of the present invention includes the above-described piezoelectric vibrator housing package of the present invention, the piezoelectric vibrator housed in the recess and having an electrode electrically connected to the wiring conductor, and housed in the recess. The electronic component having an electrode electrically connected to the wiring conductor, and the semiconductor element mounted on the upper surface of the lid and having the electrode electrically connected to the wiring conductor. It is characterized by being.

  According to the piezoelectric vibrator housing package of the present invention, the insulating base having a recess formed on the upper surface, the frame formed around the recess on the upper surface of the insulating base, and the insulating base from the inside of the frame A wiring conductor formed over the outer surface of the substrate, and a lid attached to the upper surface of the insulating base so as to close the concave portion. The concave portion accommodates the piezoelectric vibrator and the electronic component, and the upper surface of the lid body. Since the semiconductor element is mounted on the piezoelectric element, it is possible to accommodate the piezoelectric vibrator and the semiconductor element side by side with a certain distance therebetween. For example, an insulating base that is minimally necessary for mounting the semiconductor element With this planar area, not only semiconductor elements but also piezoelectric vibrators and electronic components can be housed, and the piezoelectric vibrator housing package can be miniaturized.

  In addition, since the planar area of the insulating base is reduced, even when a thermal stress is generated between the external circuit board and the insulating base when the piezoelectric vibrator housing package is connected to the external circuit board, the mounting area is small. Because it is small, it can reduce the stress due to the dimensional change of the external circuit board, effectively preventing the occurrence of defects such as solder cracks and disconnection at the connection part between the piezoelectric vibrator housing package and the external circuit board. The connection to the circuit board can be maintained well over a long period of time.

  Furthermore, the space for housing the piezoelectric vibrator and the space in which the semiconductor element is mounted can be effectively electromagnetically blocked by the lid, and the adverse effect of electromagnetic waves generated by the semiconductor element etc. on the piezoelectric vibrator is effective. Thus, the characteristics of the piezoelectric vibrator (for example, the oscillation frequency characteristics of the piezoelectric vibrator) can be maintained well.

  In the piezoelectric vibrator housing package of the present invention, it is preferable that the piezoelectric vibrator is composed of an AT cut type crystal vibrator and a tuning fork type crystal vibrator, so that a so-called dual clock module type piezoelectric device can be made compact. Therefore, it is possible to effectively reduce the size of an electronic device such as a mobile phone in which such a piezoelectric device is used as a component. Further, since the wiring path can be shortened by downsizing, the power consumption can be reduced, and the power consumption of the electronic device can be effectively reduced.

  In the piezoelectric vibrator housing package of the present invention, it is preferable that the piezoelectric vibrator is composed of a long and thin AT cut type crystal vibrator and a long and thin tuning fork type crystal vibrator, and these longitudinal directions are orthogonal to each other. Between the portion with the largest vibration of the AT-cut type quartz resonator whose free end vibrates in the vertical direction and the portion with the largest vibration of the tuning fork type quartz resonator that vibrates in the left and right direction. By widening the gap and shifting the direction of vibration, it is possible to effectively prevent a change in oscillation frequency (oscillation noise) from occurring due to resonance action, and to provide a piezoelectric device with even better oscillation frequency accuracy can do.

  According to the piezoelectric device of the present invention, the piezoelectric vibrator housing package having the above-described configuration, the piezoelectric vibrator housed in the recess and the electrode electrically connected to the wiring conductor, and housed in the recess. And an electronic component in which the electrode is electrically connected to the wiring conductor and a semiconductor element mounted on the upper surface of the lid and the electrode is electrically connected to the wiring conductor. In addition, the piezoelectric vibrator can be excellent in characteristics such as the oscillation frequency characteristics, and can be excellent in reliability of electrical connection to an external electric circuit or the like.

  Next, a multi-piece wiring board according to the present invention will be described with reference to the accompanying drawings. FIG. 1A is a plan view showing an example of an embodiment of a piezoelectric vibrator housing package and a piezoelectric device according to the present invention, and FIG. 1B is a cross-sectional view thereof.

  1 (a) and 1 (b), 1 is an insulating substrate, 2 is an AT-cut crystal resonator as a piezoelectric resonator, 3 is a tuning fork crystal resonator as a piezoelectric resonator, 4 is an electronic component, A frame part, 6 is a wiring conductor formed from the inside of the frame part to the outer surface of the insulating substrate 1, 7 is a lid, and 8 is a semiconductor element.

  The insulating substrate 1, the wiring conductor 6, the frame portion 10, and the lid body 7 mainly constitute a package for housing a piezoelectric element of the present invention, and an AT that is a piezoelectric vibrator in a recess 5 formed on the upper surface of the insulating substrate 1. The insulating crystal substrate 1 and the lid are mounted by housing the cut crystal resonator 2, the tuning fork crystal resonator 3, and the electronic component 4 and attaching the lid body 7 so as to close the concave portion 5 on the upper surface of the insulating substrate 1. An AT-cut crystal resonator 2, a tuning fork crystal resonator 3, and an electronic component 4 are hermetically housed inside a container formed by the body 7, and a semiconductor element 8 is mounted on the upper surface of the lid 7. Thus, the piezoelectric device of the present invention is basically formed. This piezoelectric device is used by being mounted on an external circuit board (not shown) constituting an electronic device such as a mobile phone.

  The insulating base 1 has a concave portion 5 for accommodating the piezoelectric vibrators 2 and 3 on the upper surface, and the concave portion 5 and the lid body 7 together with the piezoelectric vibrator (AT-cut crystal vibrator 2, tuning fork type crystal vibrator). 3) and the electronic component 4 can be hermetically sealed.

  Here, the insulating substrate 1 is made of an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin-based material such as glass epoxy resin. It is made of an insulating material and has, for example, a rectangular parallelepiped shape having a side length of about 5 to 20 mm and a thickness of about 1 to 5 mm.

  If the insulating base 1 is made of, for example, an aluminum oxide sintered body, it is manufactured as follows. First, an appropriate organic vanida, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. to form a mud, which is a well-known doctor blade method or calendar roll method. Etc. to form a plurality of ceramic green sheets. Thereafter, the ceramic green sheet is appropriately punched to form a square plate and a square frame, and the square plate is located in the lower layer and the square frame is located in the upper layer. Thus, it is produced by forming a laminated body having recesses 5 on the upper surface by laminating up and down, and firing the laminated body at a high temperature (about 1600 ° C.).

  A lid 7 is attached to the upper surface of the insulating base 1 so as to close the recess 5. The lid 7 functions to seal the piezoelectric vibrators 2 and 3 and the electronic component 4 in an airtight manner by closing the recess 5. The lid 7 also functions as a mounting portion on which the semiconductor element 8 is mounted on the upper surface, and also functions as a heat radiating plate for releasing the heat generated from the semiconductor element 8 to the outside.

  The lid body 7 is formed of a metal such as an iron-nickel-cobalt alloy or an iron-nickel alloy, a ceramic material such as an aluminum oxide sintered body or glass ceramic, an organic resin containing metal powder, or the like. For example, if the lid 7 is made of an iron-nickel-cobalt alloy, the lid 7 is formed by subjecting a plate material of the iron-nickel-cobalt alloy to predetermined metal processing such as cutting or etching.

  Attachment to the upper surface of the recessed part 5 of the cover body 7 can be performed by joining via joining materials, such as a brazing material, solder, glass, an organic resin adhesive, etc., for example.

  A semiconductor element 8 is mounted on the upper surface of the lid body 7. The semiconductor element 8 is, for example, a control element having an oscillation circuit for controlling the oscillation frequency of a crystal oscillator for a real-time clock, and is attached to the upper surface of the lid body 7 with solder, an adhesive, or the like. . In particular, when the metal lid 7 is bonded and fixed with an adhesive having excellent conductivity and heat conductivity such as solder and silver paste, the heat generated in the semiconductor element 8 can be dissipated well, and the semiconductor element 8 It is possible to effectively prevent malfunction due to temperature rise.

  On the upper surface of the insulating base 1, a frame portion 10 is formed around the recess 5 over the entire circumference. The frame portion 10 may be bonded to the upper surface of the insulating base 1 with an adhesive or the like, or may be formed integrally with the insulating base 1. In addition, the frame part 10 is formed outside the part to which the lid body 7 is attached.

  The frame portion 10 functions as a dam member that prevents the sealing resin 9 from flowing out to the side surface or the like of the insulating base 1 when the semiconductor element 8 is covered with the sealing resin 9. It functions as an insulator or the like for drawing the wiring conductor 6 to be formed. By sealing the semiconductor element 8 with the sealing resin 9, durability against external temperature and humidity can be improved, and a structure with further excellent long-term reliability can be obtained.

  The semiconductor element 8 may be hermetically sealed by attaching a lid made of metal, ceramic material, resin, or the like to the upper surface of the frame portion 10.

  A wiring conductor 6 is formed from the inner side of the frame portion 10 to the outer surface such as the lower surface and the side surface of the insulating base 1. The wiring conductor 6 electrically connects the semiconductor element 8 mounted on the upper surface of the lid 7, the piezoelectric vibrators 2 and 3 and the electronic component 4 accommodated in the recess 5, or connects them to the insulating base 1. It functions as a conductive path that leads to the outer surface and is electrically connected to the external circuit board.

  A portion of the wiring conductor 6 led out to the outer surface of the insulating base 1 (a portion exposed in the outer peripheral portion of the lower surface of the insulating base 1 in the example of FIG. 1) is soldered or electrically conductive to an electric circuit of the external circuit board. By bonding through a conductive bonding material such as an adhesive, the piezoelectric device is electrically and mechanically connected to the external circuit board, and the wiring conductor 6 is electrically connected to the electric circuit of the external circuit board.

  Then, the piezoelectric vibrators 2 and 3 and the electronic component 4 are accommodated in the recess 5 of the insulating base 1, and the respective electrodes are connected to the wiring conductor 6 via a conductive connecting material (not shown) such as solder or bonding wire. After electrically connecting, the recess 5 is closed with the lid 7, and then the semiconductor element 8 is mounted on the upper surface of the lid 7, and the electrode of the semiconductor element 8 is connected to the exposed portion of the wiring conductor 6 via a bonding wire or the like. The piezoelectric device is manufactured by connecting and sealing the semiconductor element 8 with a sealing resin 9 as necessary. In this case, a resonance circuit is formed between the piezoelectric vibrators 2 and 3, the electronic component 4, the semiconductor element 8, and the like.

  The wiring conductor 6 may be formed on the upper surface of the insulating base 1 inside the recess 5, and as shown in FIG. 1, a step is formed on the inner peripheral surface of the frame portion 10, and the upper surface of the step is formed. It may be formed.

  With the above configuration, in the piezoelectric vibrator housing package and the piezoelectric device according to the present invention, the piezoelectric vibrators 2 and 3, the electronic component 4, and the semiconductor element 8 are housed side by side at regular intervals. Therefore, for example, not only the semiconductor element 8 but also the piezoelectric vibrators 2 and 3 and the electronic component 4 can be accommodated in the plane area of the insulating base 1 which is the minimum necessary for mounting the semiconductor element 8. The vibrator housing package can be reduced in size.

  Further, since the planar area of the insulating base 1 is reduced, even if a thermal stress is generated between the external circuit board and the insulating base 1 when the piezoelectric vibrator housing package is connected to the external circuit board, the mounting region Since the area is small, stress due to dimensional changes of the external circuit board can be reduced, and it is possible to effectively prevent defects such as solder cracks and disconnections at the connection between the piezoelectric vibrator housing package and the external circuit board. Thus, the connection to the external circuit board can be maintained well over a long period of time.

  Furthermore, the space that accommodates the piezoelectric vibrators 2 and 3 and the space in which the semiconductor element 8 is mounted can be effectively electromagnetically blocked by the lid 7, and the electromagnetic waves generated in the semiconductor element 8 and the like are piezoelectrically vibrated. Effectively prevents adverse effects on the elements 2 and 3, and maintains the characteristics of the piezoelectric vibrators 2 and 3 (for example, the oscillation frequency characteristics of piezoelectric vibrators such as AT-cut crystal vibrators and tuning-fork crystal vibrators). can do. In the case where such electromagnetic shielding is further improved, the lid body 7 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy in order to make the above-described electromagnetic shielding effective. Or it is preferable to form with the material in which the metallized layer was formed in the whole surface of the ceramic board, or the material formed by containing and dispersing metal powder in resin.

  The piezoelectric vibrator is, for example, the AT-cut type crystal vibrator 2 or the tuning fork type crystal vibrator 3 as described above, and oscillates at a predetermined frequency to oscillate a reference signal such as a frequency for time or communication. Function. This reference signal is supplied to an external electric circuit via the wiring conductor 6. In addition, a current required for operating the crystal resonators 2 and 3 and the semiconductor element 8 is supplied from the external electric circuit into the piezoelectric device. The connection between the piezoelectric vibrators 2 and 3 and the wiring conductor 6 is performed by bonding with a conductive adhesive or the like.

  The electronic component 4 is, for example, a surface-mounted passive element such as a capacitive element (a known ceramic capacitor or the like) or an inductor element, and forms an oscillation circuit together with the piezoelectric vibrators 2 and 3 and the semiconductor element 8. The electronic component 4 is mounted in the recess 5 by, for example, electrically and mechanically connecting the electrode to the exposed portion of the wiring conductor 6 via solder or the like.

  In the piezoelectric vibrator housing package and the piezoelectric device according to the present invention, the piezoelectric vibrator is preferably composed of an AT-cut crystal vibrator 2 and a tuning fork crystal vibrator 3. In this case, a resonance circuit is formed between the AT-cut crystal resonator 2, the tuning fork crystal resonator 3, the electronic component 4, and the semiconductor element 8, and a so-called dual clock module type piezoelectric device is formed.

  The AT-cut crystal resonator 2 functions as a main clock oscillation source in the MHz band, for example, and the tuning fork crystal resonator 3 functions as a sub-clock (for example, standby operation) in the KHz band, for example.

  When the piezoelectric device of the present invention is a dual clock module type in which the AT cut type crystal resonator 2 and the tuning fork type crystal resonator 3 are mounted, the semiconductor element 8 and the AT cut type crystal resonator are included in the same piezoelectric device. 2. The tuning fork crystal unit 3 and peripheral electronic parts 4 can be arranged with high density along with the wiring conductor 6 and the wiring path can be shortened, so that power consumption during standby is extremely small. If it uses, the thing excellent in the usability which can be used without charging over a long term can be provided. In addition, it is possible to effectively reduce the size and power consumption of electronic devices such as mobile phones in which such piezoelectric devices are used as components.

  Further, as described above, the lid 7 is formed of a metal material, a material in which a metallized layer is formed on the entire surface of a ceramic plate, or a material formed by containing and dispersing metal powder in a resin, thereby forming a semiconductor element. 8 is effectively prevented from leaking to the AT-cut quartz crystal resonator 2 and the tuning-fork crystal resonator 3 side due to the high-frequency current that flows during operation, so that the AT-cut crystal resonator 2 and the tuning-fork crystal It is possible to prevent oscillation from becoming unstable due to mutual interference in the recess 5 of the insulating base 1 in which the vibrator 3 is accommodated.

  Further, in the piezoelectric vibrator housing package and the piezoelectric device of the present invention, the arrangement of the piezoelectric vibrators 2 and 3 and the electronic component 4 is not particularly limited, but one of the piezoelectric vibrators 2 and 3 is a tuning fork crystal. In the case of the vibrator 3, it is preferable to suppress the interference with other parts by arranging the tuning fork type crystal vibrator 3 that generates a vibration having a large amplitude in the outermost part.

  Further, in the present invention, as shown in the plan layout view of the piezoelectric vibrators 2 and 3 in FIG. 2C, the piezoelectric vibrators 2 and 3 are composed of a long thin AT-cut crystal vibrator 2 and a long thin tuning fork type crystal vibration. When it consists of the child 3, it is preferable to accommodate in the recessed part 5 so that these longitudinal directions may mutually orthogonally cross.

  As a result, the distance between the most vibrated portion of the AT-cut crystal resonator 2 whose free end vibrates in the vertical direction and the most vibrated portion of the tuning fork type crystal resonator 3 that vibrates in the left-right direction is widened. In addition, by shifting the direction of vibration, it is possible to effectively prevent a change in oscillation frequency (oscillation noise) from occurring due to the resonance action, and it is possible to provide a piezoelectric device that is further excellent in oscillation frequency accuracy. .

  2A and 2B, the AT-cut crystal resonator 2, the tuning-fork crystal resonator 3, and the electronic component 4 accommodated in the recess 5 have a sufficient area. , 3, in order to more effectively prevent mutual interference due to vibration between the components, the tuning-fork type crystal resonator 3 and the AT-cut type crystal 2 are the parts with the largest vibration. It is desirable to dispose the free ends (ends not fixed by the conductive bonding material) so as to be separated from each other.

  Further, as shown in the cross-sectional view of the piezoelectric device in FIG. 2D, it is preferable that a step is provided on the bottom surface of the recess 5 and the piezoelectric vibrators 2 and 3 are mounted so as to have different heights. Thereby, the heights of the vibration surfaces of the piezoelectric vibrators 2 and 3 can be made different from each other, and the oscillation frequency characteristics of the piezoelectric vibrators 2 and 3 are further improved by effectively suppressing mutual interference. Can be.

  The step on the bottom surface of the recess 5 is obtained by cutting, for example, a ceramic green sheet, which is the same as that for forming the insulating substrate 1, into a portion that will be the bottom surface of the recess 5 in the ceramic green sheet that is to be the insulating substrate 1. It can be formed by laminating.

  Further, a recess may be provided on the upper surface of the step 5, and either one of the piezoelectric vibrators 2 and 3 may be accommodated and mounted in the recess. In this case, interference between the piezoelectric vibrators 2 and 3 can be more effectively prevented, and a piezoelectric device having further excellent oscillation frequency characteristics can be provided.

  Further, the electronic component 4 may be mounted between the piezoelectric vibrators 2 and 3. As a result, the distance between the piezoelectric vibrators 2 and 3 can be increased, and the propagation of vibration waves of the piezoelectric vibrators 2 and 3 can be suppressed by the electronic component 4 disposed between the piezoelectric vibrators 2 and 3. Interference between the vibrators 2 and 3 can be more effectively suppressed.

  Further, when two or more piezoelectric vibrators having different vibration frequencies (for example, the AT-cut crystal vibrator 2 and the tuning-fork crystal vibrator 3) are accommodated in the recess 5, one piezoelectric vibrator 2, 3 and the other In order to effectively prevent the resonance of the vibration wave due to the difference in vibration frequency with the piezoelectric vibrators 2 and 3, the gap between the piezoelectric vibrators 2 and 3 is provided between the bottom surface of the recess 5 and the bottom surface of the lid body 7. You may form a protrusion so that it may partition.

  Furthermore, in order to effectively prevent the vibration wave of one of the piezoelectric vibrators 2 and 3 from being reflected by the inner surface of the recess 5 or the lid 7 and affecting the other piezoelectric vibrator 2 or 3, Suppressing vibration wave resonance by forming irregularities on the inner surface and the upper surface of the lid body 7, or by applying a low elastic modulus material or a porous body on the inner surface of the concave portion 5 and the lower surface of the lid body 7. May be. Examples of such a low elastic modulus material include a resin material containing a rubber component, and examples of the porous body include porous glass such as porous ceramics and sol-gel glass, and resin containing porous powder such as silica gel. Materials and the like.

  Similarly, in order to suppress vibration wave resonance, a cavity is formed inside the lid body 7, and a gel-like substance such as polymer gel or grease is filled in the cavity so as to absorb the vibration wave. Also good. Furthermore, particles such as spherical ceramics and spherical resins may be dispersed in this gel substance. Thereby, a vibration wave can be absorbed more effectively.

  Further, in order to prevent electromagnetic waves from the semiconductor element 8 from affecting the piezoelectric vibrators 2 and 3, irregularities are formed on the upper surface of the lid 7 and the inner surface of the frame portion 10, or metallized layers, plated layers, thin films A metal layer such as a metal layer or a conductive resin layer may be formed and shielded.

  Further, in order to prevent reflection of vibration waves of the piezoelectric vibrators 2 and 3 and to prevent electromagnetic waves from the semiconductor element 8 from affecting the piezoelectric vibrators 2 and 3, the lid 7 is made of metal powder and porous powder. It may be formed of a resin that contains the resin, whereby the lid body 7 can effectively absorb vibration waves and electromagnetic waves.

  Further, in the recess 5, a protrusion made of a metal or a ceramic material with a metal film deposited between the region in which the piezoelectric vibrators 2 and 3 are accommodated and the region in which the electronic component 4 is accommodated ( (Not shown), the electromagnetic wave emitted by the electronic component 4 is blocked by the protruding portion, and the piezoelectric vibrators 2 and 3 are more reliably prevented from being affected, and the oscillation frequency characteristics are more reliably improved. You may do it.

  It should be noted that the present invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the present invention. For example, FIG. 1 shows an example in which the connection between the electrode of the semiconductor element 8 and the wiring conductor 6 is made by a bonding wire, but it goes without saying that it may be a flip chip connection through a solder bump or the like.

(A) is a top view which shows an example of embodiment of the piezoelectric vibrator accommodation package and piezoelectric device of this invention, (b) is sectional drawing of the piezoelectric vibrator accommodation package and piezoelectric device of (a). (A)-(c) is an enlarged plan view which shows the various examples of the arrangement | positioning form of the piezoelectric vibrator in the piezoelectric vibrator accommodation package and piezoelectric device of this invention, (d) is the piezoelectric vibrator accommodation package of this invention, and It is sectional drawing which shows the other example of embodiment of a piezoelectric device. (A) is a plan view of a conventional piezoelectric vibrator housing package and piezoelectric device, and (b) is a cross-sectional view of the piezoelectric vibrator housing package and piezoelectric device of (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 2 ... Piezoelectric vibrator (AT cut type crystal vibrator)
3 ... Piezoelectric vibrator (tuning fork type crystal vibrator)
5... Recessed portion 6... Wiring conductor 7 .. lid body 8... Semiconductor element 10.

Claims (4)

An insulating base having a recess formed on the upper surface, a frame formed around the recess on the upper surface of the insulating base, and a wiring conductor formed from the inside of the frame to the outer surface of the insulating base And a lid that is attached to the upper surface of the insulating base so as to close the recess, the piezoelectric vibrator and the electronic component are accommodated in the recess, and a semiconductor element is mounted on the upper surface of the lid A package for housing a piezoelectric vibrator. 2. The piezoelectric vibrator housing package according to claim 1, wherein the piezoelectric vibrator comprises an AT cut type crystal vibrator and a tuning fork type crystal vibrator. The piezoelectric vibrator includes a long and thin AT-cut type crystal vibrator and a long and thin tuning fork type crystal vibrator, and is housed in the recess so that the longitudinal directions thereof are orthogonal to each other. The package for storing a piezoelectric vibrator according to 2. The piezoelectric vibrator housing package according to any one of claims 1 to 3, the piezoelectric vibrator housed in the recess and having an electrode electrically connected to the wiring conductor, and the recess And the electronic component having an electrode electrically connected to the wiring conductor and the semiconductor element mounted on the upper surface of the lid and having the electrode electrically connected to the wiring conductor. A piezoelectric device characterized by that.

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