KR20010000906U - apparatus for turning a PCB on which is mounted semiconductor chips - Google Patents

Abstract

The present invention discloses a printed circuit board rotating device for a chip mount. In the disclosed subject matter, a base is disposed under a conveyor connecting two chip mounters arranged in a row. The lifting cylinder is mounted on the base, and the lifting plate is installed on the lifting cylinder. The lifting plate is mounted with a rotating cylinder, and a rotating plate which is rotated by 90 ° or 180 ° by placing a PCB on the rotating cylinder. On both sides of the conveyor are arranged alignment cylinders for pushing and aligning both sides of the rotated PCB. On the other hand, a sensor is disposed on the base to detect the PCB arriving on the base to stop the drive of the conveyor.

Description

Apparatus for turning a PCB on which is mounted semiconductor chips}

The present invention relates to a rotating device for a chip mount printed circuit board (hereinafter referred to as PCB), and more specifically, to two chip mounters arranged in one line only on one side, the chip is mounted on both sides or two adjacent sides of the PCB. In order to do so, the present invention relates to an apparatus for rotating a PCB by 180 ° or 90 ° between chip mounters.

In general, in the TFT-LCD manufacturing process, various semiconductor chips are mounted on a PCB disposed on the side of the liquid crystal panel and electrically connected to the pads of the liquid crystal panel.

The process of mounting a semiconductor chip on a PCB proceeds as follows. First, an adhesive is applied to a PCB by using a coating device called a dispenser, and then a chip is mounted on a printed circuit board using a chip mounter.

Looking at the configuration of the chip mounter for performing the above operation as follows. The PCB is placed on an import and export conveyor for transporting the PCB, and a stage is provided along each conveyor. The stage is supported by several support pins provided thereunder. The head of the chip mounter is located at the top of the stage, and several nozzles are installed on the head to suck the chip by vacuum and move up and down to mount the chip on the PCB. A vacuum means is connected to the nozzle to suck the chip. In addition, a drive means for rotating and vertically moving the head is provided, which is mainly a cam mechanism.

With the above configuration, the PCB to which the adhesive is applied by the dispenser is transported along the loading conveyor in a state of being placed on the stage and stopped at the bottom of the head. The nozzle then adsorbs the chip and descends to mount the chip on the PCB. The PCB on which the chip is mounted is taken out by a stage that is transported along the takeout conveyor.

However, the semiconductor chip is not only mounted on one side of the PCB, but is mounted on both sides or two adjacent sides of the PCB. Thus, in order to mount the semiconductor chips on both sides or two adjacent sides of the PCB transported along the conveyor, two chip mounters arranged in a row are required.

Here, the chip mounters are arranged in a row without being staggered due to restrictions on the location of the process line. Therefore, after the semiconductor chip is mounted on one side of the PCB by the preceding chip mounter, the PCB must be rotated 180 ° or 90 ° before the PCB is transferred to the subsequent chip mounter.

Conventionally, since the operator is located between the chip mounters on both sides, and the PCB to be transported is manually rotated by the worker by hand, one worker must be put in first, and when the worker repeatedly rotates the numerous PCBs, severe fatigue is felt. There is a problem that the work speed is gradually slowed down.

Particularly, if the PCB is passed without rotating the PCB inadvertently, another semiconductor chip is mounted on one side of the PCB on which the semiconductor chip is already mounted, and thus there is a problem in that the PCB is broken.

Therefore, the present invention allows the PCB to be automatically rotated 90 ° or 180 ° between two chip mounters arranged in a line, thereby improving work efficiency and preventing PCB damage due to inadvertent operator's care. It is an object to provide a rotating device.

1 to 3 is a front view and a plan view and a right side view showing a rotating device according to the present invention.

Description of symbols for the main parts of the drawings

One ; Conveyor 10; Base

11; Bottom plate 12; Platform

13; Top plate 14; Tumbler

15; Guide rod 20; Lifting cylinder

30; Rotary cylinder 41; Alignment cylinder

51; Sensor 60; buffer

In order to achieve the above object, the PCB rotation apparatus according to the present invention is made of the following configuration.

The base is disposed under the conveyor connecting two chip mounters arranged in a row. The lifting cylinder is mounted on the base, and the lifting plate is installed on the lifting cylinder. The lifting plate is mounted with a rotating cylinder, and a rotating plate which is rotated by 90 ° or 180 ° by placing a PCB on the rotating cylinder. On both sides of the conveyor are arranged alignment cylinders for pushing and aligning both sides of the rotated PCB. On the other hand, a sensor is disposed on the base to detect the PCB arriving on the base to stop the drive of the conveyor.

According to the configuration of the present invention described above, the PCB transported along the conveyor is sensed by the sensor, the conveyor is stopped, and is raised higher than the conveyor while being placed on the rotating plate raised by the lifting cylinder. By rotating the rotating plate by 90 ° or 180 ° by the rotating cylinder, the PCB is also rotated. The rotated PCB is lowered to the conveyor height by the lifting cylinder, then aligned by the alignment cylinder, and transferred by the conveyor to the subsequent chip mount.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 to 3 is a front view and a plan view and a right side view showing the PCB rotating apparatus according to the present invention.

The rotating device according to the present invention is disposed between two chip mounters arranged in a row and connected by the conveyor 1, thereby rotating a PCB mounted with a semiconductor chip on one side of the preceding chip mounter by 90 ° or 180 °. Subsequent chip mounters allow the semiconductor chip to be mounted on the other side of the PCB.

As shown, the base 10 is arranged at the bottom of the conveyor 1. On one side of the base 10, a sensor 51 for detecting the PCB to stop the conveyor 1 is arranged, and the sensor 51 is installed on the bracket 50 installed on the base 10.

The lifting cylinder 20 is mounted at the bottom center of the base 10. The elevating plate 12 is installed on the elevating cylinder 20 via the universal joint 21. A rotating cylinder 30, which is a driving source for rotating the PCB by 90 degrees or 180 degrees, is provided on the elevating plate 12.

The upper plate 13 is disposed above the elevating plate 12, and the lower plate 11 is provided on the base 10. The upper and lower plates 13 and 11 are connected by the guide rod 15, and the lifting plate 12 is fitted to the guide rod 15 so as to be liftable. That is, the upper and lower plates 13 and 11 do not move in the correct positions, and only the lifting plate 12 is lifted while being guided by the guide rod 15.

The rotating plate 14 on which the PCB is placed is installed on the rotating cylinder 30 via the spacer 31. On the other hand, a pair of shock absorber 60 is provided on one side of the rotating cylinder 30, thereby preventing the PCB rotated by the rotating cylinder 30 to slide on the rotating plate (14).

In order to ensure that the rotated PCB is correctly placed on the conveyor 1, the support stands 40 are installed on both sides of the conveyor 1. A total of four alignment cylinders 41 for pushing and aligning both sides of the rotated PCB are installed in each of the rests 40.

Hereinafter, the operation of the rotary device according to the present embodiment configured as described above will be described in detail.

In the preceding chip mounter, a semiconductor chip is mounted on one side of the PCB. When the PCB is transported on the conveyor and contacts the sensor 51, the conveyor is stopped so that the PCB is positioned above the rotating plate 14.

In this state, the elevating cylinder 20 is driven so that the elevating plate 12, the rotating cylinder 30, and the rotating plate 14 are raised together, so that the PCB is placed on the rotating plate 14 and the conveyor 1 It will rise to a slightly higher height. The rotary cylinder 30 is driven to rotate the rotary plate 14 by 90 degrees or 180 degrees. Thus, the PCB is also rotated by 90 ° or 180 °, so that either side on which the semiconductor chip is not mounted faces the subsequent mounter chip. At this time, the fluctuation generated when the rotating cylinder 30 is rotated is absorbed by the pair of shock absorbers 60, thereby preventing the PCB from sliding on the rotating plate 14.

The rotated PCB is lowered to the conveyor 1 height by the lifting cylinder 20. Subsequently, each alignment cylinder 41 is advanced to push both sides of the PCB so that the rotated PCB is aligned so as to be accurately placed on the conveyor 1.

The lifting cylinder 20 is lowered further, so that the aligned PCB is placed on the conveyor 1 and then transferred to the subsequent mounter chip.

As described above, according to the present invention, since the PCB is automatically rotated 90 ° or 180 ° between two chip mounters arranged in a line, the operator does not have to rotate the PCB manually by being located between the chip mounters. Therefore, the work efficiency is improved, and the situation where the PCB is broken due to not rotating the PCB in particular due to carelessness is prevented.

In the above has been shown and described with respect to the preferred embodiment of the present invention, the present invention is not limited to the embodiment described above, it is common in the field to which the subject innovation belongs without departing from the gist of the subject innovation claimed in the claims below. Anyone with knowledge will be able to make various changes.

Claims (1)

A device which is arranged between two chip mounters arranged in a row and connected by a conveyor to rotate a printed circuit board carried by the conveyor by 90 ° or 180 °, A base disposed under the conveyor; A sensor disposed on one side of the base to sense a printed circuit board transported on the conveyor to stop the conveyor; A lifting cylinder mounted to the base; A lifting plate provided on the lifting cylinder; A rotating cylinder mounted to the lifting plate; A rotating plate installed on the rotating cylinder and being raised higher than the conveyor by the lifting cylinder in a state where the printed circuit board is settled and rotated by 90 ° or 180 ° by the rotating cylinder at its height; And And a sorting cylinder disposed at both sides of the conveyor and configured to push and align both sides of the printed circuit board rotated by 90 ° or 180 ° while being placed on the rotating plate.