KR20000048439A - 활성 화소 센서 및 그 제조 방법 - Google Patents
활성 화소 센서 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20000048439A KR20000048439A KR1019990063213A KR19990063213A KR20000048439A KR 20000048439 A KR20000048439 A KR 20000048439A KR 1019990063213 A KR1019990063213 A KR 1019990063213A KR 19990063213 A KR19990063213 A KR 19990063213A KR 20000048439 A KR20000048439 A KR 20000048439A
- Authority
- KR
- South Korea
- Prior art keywords
- row
- read
- reset
- amplifier
- pixel
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000005070 sampling Methods 0.000 abstract description 9
- 230000002596 correlated effect Effects 0.000 abstract description 5
- 230000002123 temporal effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 241000086550 Dinosauria Species 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (12)
- 행과 열로 배열되는 다수의 화소를 구비하는 활성 화소 센서(an active pixel sensor)에 있어서, 다수의 화소는 행의 순차적인 순서로 활성 화소 센서로부터 판독되고, 적어도 하나의 화소는,현재 판독 중인 행 내에 있으면서 전하에서 전압으로의 변환 노드(a charge to voltage conversion node)에 기능적으로(operatively) 접속되는 포토다이오드 광감지기(a photodiode photodetector)와,상기 전하에서 전압으로의 변환 노드에 접속되는 소스를 구비하는 포토다이오드 광감지기와 동일한 화소에 연관되는 리세트 트랜지스터와,현재 리세트 제어 버스에 접속되는 상기 리세트 트랜지스터 상의 리세트 게이트 및 이전에 판독된 행의 이전 리세트 제어 버스에 접속되는 상기 리세트 트랜지스터 상의 드레인과,상기 전하에서 전압으로의 변환 노드에 기능적으로 접속되는 증폭기를 포함하는 활성 화소 센서.
- 제 1 항에 있어서,상기 리세트 트랜지스터의 소스는 전압 변환 노드인 활성 화소 센서.
- 제 1 항에 있어서,상기 전하에서 전압으로의 변환 노드는 부동 확산부(a floating diffusion)인 활성 화소 센서.
- 제 1 항에 있어서,상기 증폭기는 소스 팔로워 증폭기(a source follower amplifier)인 활성 화소 센서.
- 제 1 항에 있어서,상기 현재 리세트 드레인에 접속되는 상기 이전 리세트 제어버스에 사전결정된 제 1 신호를 인가하고 상기 현재 리세트 제어 버스에 사전결정된 제 2 신호를 인가하여, 현재 판독 중인 상기 전하에서 전압으로의 변환 노드를 리세트하는 활성 화소 센서.
- 제 5 항에 있어서,상기 전하에서 전압으로의 변환 노드를 리세트하는 과정도 상기 현재 판독 중인 행을 선택하는 활성 화소 센서.
- 제 5 항에 있어서,각각의 열에 대해 그 열 내의 광감지기를 위한 증폭기에 기능적으로 접속되는 출력 신호 열 버스와,현재 판독 중인 행의 증폭기를 출력 신호 열 버스에 접속시키는 상기 사전결정된 제 1 및 제 2 신호의 인가를 더 포함하는 활성 화소 센서.
- 제 1 항에 있어서,상기 현재 리세트 드레인에 접속되는 상기 이전 리세트 제어 버스에 사전결정된 제 1 신호를 인가하고 상기 현재 리세트 제어 버스에 사전결정된 제 2 신호를 인가하여, 상기 이전에 판독된 행의 상기 증폭기를 디스에이블(disable)시키는 사전결정된 전위로 상기 전하에서 전압으로의 변환 노드를 세팅하는 활성 화소 센서.
- 제 8 항에 있어서,상기 이전에 판독된 행을 디스에이블시키는 과정은 상기 이전에 판독된 행을 선택해제(deselect)하는 활성 화소 센서.
- 제 8 항에 있어서,각각의 열에 대해 그 열 내의 광감지기를 위한 증폭기에 기능적으로 접속되는 출력 신호 열 버스와,상기 이전에 판독된 행의 상기 증폭기를 상기 출력 신호 열 버스로부터 접속해제시키는 상기 사전결정된 제 1 및 제 2 신호의 인가를 더 포함하는 활성 화소 센서.
- 행이 순차적으로 판독되도록 행과 열로 배열되는 다수의 화소를 구비하는 반도체 기판을 마련하는 단계와,화소의 적어도 한 부분을 생성하되, 상기 한 부분 내의 적어도 하나의 지정된 행과 연관되고, 상기 지정된 행 내의 화소를 리세트하여 상기 지정된 행이 판독되도록 선택하는 제 1 조합(a first combination)에 따라 동작하며, 상기 판독 중인 지정된 행에 후속하는 상기 지정된 행 내의 상기 화소를 선택해제하는 제 2 조합(a second combination)에 따라 동작하는 현재 리세트 버스와 이전 리세트 버스가 존재하도록 하는 단계를 포함하는 활성 화소 센서 제조 방법.
- 제 11 항에 있어서,상기 생성 단계는,상기 지정된 행 내의 각 화소가 증폭기를 구비하되, 상기 증폭기의 상기 제 1 조합의 제 1 결과는 열 버스에 접속되고, 상기 지정된 행 내의 화소의 제 2 조합의 제 2 결과는 상기 행 버스에 접속되는 자신의 증폭기를 구비하지 않는 상기 부분을 생성하는 단계를 더 포함하는 활성 화소 센서 제조 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/223,608 US6218656B1 (en) | 1998-12-30 | 1998-12-30 | Photodiode active pixel sensor with shared reset signal row select |
US09/223,608 | 1998-12-30 | ||
US9/223,608 | 1998-12-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000048439A true KR20000048439A (ko) | 2000-07-25 |
KR100750778B1 KR100750778B1 (ko) | 2007-08-20 |
Family
ID=22837246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990063213A KR100750778B1 (ko) | 1998-12-30 | 1999-12-28 | 능동 화소 센서 및 그 제조 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6218656B1 (ko) |
EP (1) | EP1017231B1 (ko) |
JP (1) | JP4829393B2 (ko) |
KR (1) | KR100750778B1 (ko) |
DE (1) | DE69930206T2 (ko) |
TW (1) | TW453108B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100976886B1 (ko) * | 2006-12-22 | 2010-08-18 | 크로스텍 캐피탈, 엘엘씨 | 부동 베이스 판독 개념을 갖는 cmos 이미지 센서 |
KR101128578B1 (ko) * | 2011-12-13 | 2012-03-23 | 인텔렉츄얼 벤처스 투 엘엘씨 | 부동 베이스 판독 개념을 갖는 cmos 이미지 센서 |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6051857A (en) * | 1998-01-07 | 2000-04-18 | Innovision, Inc. | Solid-state imaging device and method of detecting optical signals using the same |
FR2781929B1 (fr) * | 1998-07-28 | 2002-08-30 | St Microelectronics Sa | Capteur d'image a reseau de photodiodes |
IL134481A (en) * | 2000-02-10 | 2005-09-25 | Samuel Weisman | System and method for cataloguing vehicle parts |
US7274396B2 (en) * | 2000-05-16 | 2007-09-25 | Micron Technology, Inc. | Image sensors with isolated flushed pixel reset |
US6635857B1 (en) * | 2000-07-10 | 2003-10-21 | National Semiconductor Corporation | Method and apparatus for a pixel cell architecture having high sensitivity, low lag and electronic shutter |
JP3750502B2 (ja) * | 2000-08-03 | 2006-03-01 | ソニー株式会社 | 固体撮像装置およびカメラシステム |
US6950131B1 (en) * | 2000-09-26 | 2005-09-27 | Valley Oak Semiconductor | Simultaneous access and reset system for an active pixel sensor |
JP4597354B2 (ja) * | 2000-12-20 | 2010-12-15 | ルネサスエレクトロニクス株式会社 | Mos型イメージセンサ |
US6541772B2 (en) * | 2000-12-26 | 2003-04-01 | Honeywell International Inc. | Microbolometer operating system |
CA2358223A1 (en) * | 2001-01-11 | 2002-07-11 | Symagery Microsystems Inc. | A row decoding scheme for double sampling in 3t pixel arrays |
FR2820882B1 (fr) | 2001-02-12 | 2003-06-13 | St Microelectronics Sa | Photodetecteur a trois transistors |
FR2820883B1 (fr) | 2001-02-12 | 2003-06-13 | St Microelectronics Sa | Photodiode a grande capacite |
JP3844699B2 (ja) | 2001-02-19 | 2006-11-15 | イノテック株式会社 | 可変利得アンプ |
FR2824665B1 (fr) * | 2001-05-09 | 2004-07-23 | St Microelectronics Sa | Photodetecteur de type cmos |
US6777660B1 (en) | 2002-02-04 | 2004-08-17 | Smal Technologies | CMOS active pixel with reset noise reduction |
US6982403B2 (en) * | 2002-03-27 | 2006-01-03 | Omnivision Technologies, Inc. | Method and apparatus kTC noise cancelling in a linear CMOS image sensor |
WO2003085964A1 (fr) * | 2002-04-04 | 2003-10-16 | Sony Corporation | Dispositif analyseur d'image a semi-conducteurs |
US7489352B2 (en) * | 2002-11-15 | 2009-02-10 | Micron Technology, Inc. | Wide dynamic range pinned photodiode active pixel sensor (APS) |
JP3951994B2 (ja) * | 2003-09-16 | 2007-08-01 | ソニー株式会社 | 固体撮像装置およびカメラシステム |
US7332786B2 (en) * | 2003-11-26 | 2008-02-19 | Micron Technology, Inc. | Anti-blooming storage pixel |
US20050128327A1 (en) * | 2003-12-10 | 2005-06-16 | Bencuya Selim S. | Device and method for image sensing |
US7460165B2 (en) * | 2004-01-09 | 2008-12-02 | Aptina Imaging Corporation | Photo-array layout for monitoring image statistics |
DE602004017969D1 (de) * | 2004-06-05 | 2009-01-08 | St Microelectronics Res & Dev | Bildsensor mit geteilten Rücksetz-Signalen und Zeilenauswahl |
US7605854B2 (en) | 2004-08-11 | 2009-10-20 | Broadcom Corporation | Operational amplifier for an active pixel sensor |
US7333043B2 (en) * | 2004-08-18 | 2008-02-19 | Broadcom Corporation | Active pixel array with matching analog-to-digital converters for image processing |
US7145188B2 (en) | 2004-08-19 | 2006-12-05 | Broadcom Corporation | Apparatus and method of image processing to avoid image saturation |
JP4971586B2 (ja) | 2004-09-01 | 2012-07-11 | キヤノン株式会社 | 固体撮像装置 |
US20060255381A1 (en) * | 2005-05-10 | 2006-11-16 | Micron Technology, Inc. | Pixel with gate contacts over active region and method of forming same |
US7446357B2 (en) * | 2005-05-11 | 2008-11-04 | Micron Technology, Inc. | Split trunk pixel layout |
US7830437B2 (en) * | 2005-05-11 | 2010-11-09 | Aptina Imaging Corp. | High fill factor multi-way shared pixel |
US7468532B2 (en) * | 2005-07-12 | 2008-12-23 | Aptina Imaging Corporation | Method and apparatus providing capacitor on an electrode of an imager photosensor |
US7728896B2 (en) * | 2005-07-12 | 2010-06-01 | Micron Technology, Inc. | Dual conversion gain gate and capacitor and HDR combination |
US7432540B2 (en) | 2005-08-01 | 2008-10-07 | Micron Technology, Inc. | Dual conversion gain gate and capacitor combination |
US20070035649A1 (en) * | 2005-08-10 | 2007-02-15 | Micron Technology, Inc. | Image pixel reset through dual conversion gain gate |
US7511323B2 (en) * | 2005-08-11 | 2009-03-31 | Aptina Imaging Corporation | Pixel cells in a honeycomb arrangement |
US20070040922A1 (en) * | 2005-08-22 | 2007-02-22 | Micron Technology, Inc. | HDR/AB on multi-way shared pixels |
US7804117B2 (en) * | 2005-08-24 | 2010-09-28 | Aptina Imaging Corporation | Capacitor over red pixel |
US7800146B2 (en) * | 2005-08-26 | 2010-09-21 | Aptina Imaging Corporation | Implanted isolation region for imager pixels |
US7244918B2 (en) * | 2005-08-30 | 2007-07-17 | Micron Technology, Inc. | Method and apparatus providing a two-way shared storage gate on a four-way shared pixel |
US7714917B2 (en) * | 2005-08-30 | 2010-05-11 | Aptina Imaging Corporation | Method and apparatus providing a two-way shared storage gate on a four-way shared pixel |
US8026966B2 (en) | 2006-08-29 | 2011-09-27 | Micron Technology, Inc. | Method, apparatus and system providing a storage gate pixel with high dynamic range |
US7944020B1 (en) | 2006-12-22 | 2011-05-17 | Cypress Semiconductor Corporation | Reverse MIM capacitor |
EP1971088A1 (en) * | 2007-03-12 | 2008-09-17 | Nokia Corporation | Release of resources in a communication system |
US7915702B2 (en) * | 2007-03-15 | 2011-03-29 | Eastman Kodak Company | Reduced pixel area image sensor |
US7969494B2 (en) * | 2007-05-21 | 2011-06-28 | Aptina Imaging Corporation | Imager and system utilizing pixel with internal reset control and method of operating same |
US7924332B2 (en) * | 2007-05-25 | 2011-04-12 | The Trustees Of The University Of Pennsylvania | Current/voltage mode image sensor with switchless active pixels |
US20080296639A1 (en) * | 2007-06-01 | 2008-12-04 | Dalsa Corporation | Semiconductor image sensor array device, apparatus comprising such a device and method for operating such a device |
US8130300B2 (en) * | 2007-12-20 | 2012-03-06 | Aptina Imaging Corporation | Imager method and apparatus having combined select signals |
GB0724983D0 (en) * | 2007-12-21 | 2008-01-30 | Cmosis Nv | Pixel array with reduced sensitivity to defects |
US8077236B2 (en) | 2008-03-20 | 2011-12-13 | Aptina Imaging Corporation | Method and apparatus providing reduced metal routing in imagers |
US8130302B2 (en) * | 2008-11-07 | 2012-03-06 | Aptina Imaging Corporation | Methods and apparatus providing selective binning of pixel circuits |
US20100271517A1 (en) * | 2009-04-24 | 2010-10-28 | Yannick De Wit | In-pixel correlated double sampling pixel |
US8748946B2 (en) | 2010-04-29 | 2014-06-10 | Omnivision Technologies, Inc. | Isolated wire bond in integrated electrical components |
US8318580B2 (en) | 2010-04-29 | 2012-11-27 | Omnivision Technologies, Inc. | Isolating wire bonding in integrated electrical components |
US9526468B2 (en) | 2014-09-09 | 2016-12-27 | General Electric Company | Multiple frame acquisition for exposure control in X-ray medical imagers |
JP6787343B2 (ja) * | 2016-01-07 | 2020-11-18 | ソニー株式会社 | 比較装置、アナログデジタル変換装置、固体撮像素子および撮像装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06334920A (ja) * | 1993-03-23 | 1994-12-02 | Nippon Hoso Kyokai <Nhk> | 固体撮像素子とその駆動方法 |
US5471515A (en) | 1994-01-28 | 1995-11-28 | California Institute Of Technology | Active pixel sensor with intra-pixel charge transfer |
US5631704A (en) | 1994-10-14 | 1997-05-20 | Lucent Technologies, Inc. | Active pixel sensor and imaging system having differential mode |
US5625210A (en) | 1995-04-13 | 1997-04-29 | Eastman Kodak Company | Active pixel sensor integrated with a pinned photodiode |
US5587596A (en) | 1995-09-20 | 1996-12-24 | National Semiconductor Corporation | Single MOS transistor active pixel sensor cell with automatic anti-blooming and wide dynamic range |
US5608243A (en) | 1995-10-19 | 1997-03-04 | National Semiconductor Corporation | Single split-gate MOS transistor active pixel sensor cell with automatic anti-blooming and wide dynamic range |
US5789774A (en) | 1996-03-01 | 1998-08-04 | Foveonics, Inc. | Active pixel sensor cell that minimizes leakage current |
US5721425A (en) | 1996-03-01 | 1998-02-24 | National Semiconductor Corporation | Active pixel sensor cell that reduces the effect of 1/f noise, increases the voltage range of the cell, and reduces the size of the cell |
US5881184A (en) * | 1996-05-22 | 1999-03-09 | Eastman Kodak Company | Active pixel sensor with single pixel reset |
US5949061A (en) * | 1997-02-27 | 1999-09-07 | Eastman Kodak Company | Active pixel sensor with switched supply row select |
US5838650A (en) | 1996-06-26 | 1998-11-17 | Lucent Technologies Inc. | Image quality compensation method and apparatus for holographic data storage system |
JP3579194B2 (ja) * | 1996-09-17 | 2004-10-20 | 株式会社東芝 | 固体撮像装置の駆動方法 |
JP3383523B2 (ja) * | 1996-09-19 | 2003-03-04 | 株式会社東芝 | 固体撮像装置及びその駆動方法 |
US5760458A (en) | 1996-10-22 | 1998-06-02 | Foveonics, Inc. | Bipolar-based active pixel sensor cell with poly contact and increased capacitive coupling to the base region |
US5786623A (en) | 1996-10-22 | 1998-07-28 | Foveonics, Inc. | Bipolar-based active pixel sensor cell with metal contact and increased capacitive coupling to the base region |
JP3544084B2 (ja) * | 1996-12-10 | 2004-07-21 | シャープ株式会社 | 増幅型固体撮像装置 |
JPH10257392A (ja) * | 1997-03-14 | 1998-09-25 | Matsushita Electron Corp | 物理量分布検知半導体装置およびその駆動方法ならびにその製造方法 |
US5847422A (en) | 1997-05-19 | 1998-12-08 | Foveonics, Inc. | MOS-based active pixel sensor cell that utilizes the parasitic bipolar action of the cell to output image data |
-
1998
- 1998-12-30 US US09/223,608 patent/US6218656B1/en not_active Expired - Lifetime
-
1999
- 1999-10-30 TW TW088118904A patent/TW453108B/zh not_active IP Right Cessation
- 1999-12-01 EP EP99204059A patent/EP1017231B1/en not_active Expired - Lifetime
- 1999-12-01 DE DE69930206T patent/DE69930206T2/de not_active Expired - Lifetime
- 1999-12-27 JP JP37147299A patent/JP4829393B2/ja not_active Expired - Lifetime
- 1999-12-28 KR KR1019990063213A patent/KR100750778B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100976886B1 (ko) * | 2006-12-22 | 2010-08-18 | 크로스텍 캐피탈, 엘엘씨 | 부동 베이스 판독 개념을 갖는 cmos 이미지 센서 |
KR101128578B1 (ko) * | 2011-12-13 | 2012-03-23 | 인텔렉츄얼 벤처스 투 엘엘씨 | 부동 베이스 판독 개념을 갖는 cmos 이미지 센서 |
Also Published As
Publication number | Publication date |
---|---|
EP1017231A3 (en) | 2004-02-04 |
EP1017231A2 (en) | 2000-07-05 |
DE69930206T2 (de) | 2006-11-23 |
JP2000232218A (ja) | 2000-08-22 |
JP4829393B2 (ja) | 2011-12-07 |
TW453108B (en) | 2001-09-01 |
DE69930206D1 (de) | 2006-05-04 |
US6218656B1 (en) | 2001-04-17 |
EP1017231B1 (en) | 2006-03-08 |
KR100750778B1 (ko) | 2007-08-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100750778B1 (ko) | 능동 화소 센서 및 그 제조 방법 | |
US10566379B2 (en) | Image sensor with a gated storage node linked to transfer gate | |
US6624850B1 (en) | Photogate active pixel sensor with high fill factor and correlated double sampling | |
JP4267095B2 (ja) | 共有された増幅器読出しを有する能動画素画像センサ | |
US7542085B2 (en) | Image sensor with a capacitive storage node linked to transfer gate | |
JP4638097B2 (ja) | 画像センサ | |
US7489352B2 (en) | Wide dynamic range pinned photodiode active pixel sensor (APS) | |
US7375748B2 (en) | Differential readout from pixels in CMOS sensor | |
US7427737B2 (en) | Pixel with differential readout | |
KR100834424B1 (ko) | 이미지 센서 | |
EP1947842B1 (en) | Image sensors with blooming reduction mechanisms | |
JPH1084507A (ja) | 能動画素イメージセンサ及びその製造方法 | |
US20090242740A1 (en) | Solid state imaging device, method of driving solid state imaging device, and image pickup apparatus | |
US11282891B2 (en) | Image sensor with a gated storage node linked to transfer gate | |
JP7160129B2 (ja) | 撮像素子および撮像装置 | |
WO2023002643A1 (ja) | 撮像素子及び撮像装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120727 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20130729 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20140730 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160629 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20170629 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20180628 Year of fee payment: 12 |