KR20000005667A - Ventilation Structure of Planarization Chamber - Google Patents

Abstract

PURPOSE: A ventilation structure of a polish processing chamber is provided to prevent the scratch of a structure from generating by eliminating the rise and the turbulence of particles by the flow of air in a polish processing chamber. CONSTITUTION: The ventilation structure of a polish processing chamber(1) is formed by:a suction duct(2-1, 2-2) installed in an area of a polish processing chamber having a second area facing a first area and attaching a filter(41) for preventing the vibration; a ventilating device(3) installed in an area of at least one side of the polish processing chamber; and a porous chamber(5) having plural slots, equally formed on a surface facing the first area.

Description

Ventilation Structure of Polishing Processing Chamber

The present invention relates to a ventilation structure of a polishing processing chamber for receiving a planarization device such as, for example, a polishing or lapping device.

10 is a schematic cross-sectional view of a ventilation structure of a polishing processing chamber of the prior art.

As shown in FIG. 10, the polishing chamber 1 containing the polishing apparatus 100 is defined by a ceiling region 10, a bottom region 11 and four side regions 12.

The polishing apparatus 100 includes a lower plate 101 and a carrier 102 capable of holding and holding the wafer W. As shown in FIG. As shown by the dashed-dotted line in FIG. 10, the polishing apparatus is rotated and polished while pressing the wafer W held by the carrier 102 onto the rotating lower plate 101.

During the polishing operation, a slurry (not shown) is supplied to the lower plate 101 to increase the polishing efficiency of the wafer W. Solidified abrasive slurry, abrasive dross, and other particles are scattered in the chamber 1.

The ventilation structure of the polishing chamber discharges the particles to the outside, and includes suction ducts 2-1 and 2-2 provided in the ceiling region 10 and an exhaust blower 3 provided in the side region 12. .

That is, by operating the ventilation fans 40 of the filter units 4-1 and 4-2 attached to the suction ducts 2-1 and 2-2, external air is supplied to the filter units 4-1 and 4-2. ) And the suction ducts 2-1 and 2-2 are sucked into the polishing processing chamber 1. In addition, by driving the discharge blower 3 and releasing air together with the particles, the particles in the polishing processing chamber 1 generated during polishing are removed.

However, in the above-described conventional ventilation structure of the polishing chamber, the outside air flows directly into the polishing chamber 1 from the suction ducts 2-1 and 2-2 of small size, as shown in FIG. Therefore, turbulence and convection of air A eventually occur in the polishing chamber 1. Accordingly, the turbulence and convection cause particles to be swept and enter between the wafer W and the lower plate 101 to be polished, causing scratches on the wafer W.

Further, in the ventilation structure of the polishing chamber in the prior art, since the blower blower 3 is attached at a position higher than the polishing surface 101a of the lower plate 101, particles lower than the polishing surface 101a By the suction force of the discharge blower 3, it is easy to ascend toward the polished surface side of the lower plate 101, accumulates on the polished surface of the lower plate 101, and once again the wafer W and the lower plate 101 It goes in between.

It is an object of the present invention to provide a ventilation structure of an abrasive machining chamber which substantially makes the flow of air in the abrasive machining chamber substantially laminar and thus eliminates the rise of particles and turbulence to prevent scratching of the workpiece.

In order to achieve the above object, according to an aspect of the present invention, there is provided an abrasive processing apparatus having a rotatable platen and a rotatable pressing member for pressurizing a workpiece to the plate, the plate having the plate attached A ventilation structure of a polishing processing chamber for ventilating a polishing processing chamber having one region, comprising: a suction duct installed in one region of the polishing processing chamber having a second region facing the first region and having a dustproof filter; An exhaust device provided in at least one region of the polishing chamber having side surfaces of the first and second regions and side regions hermetically connected to the first region, and substantially the entire second region and the surface in close proximity to the inner side of the second region. To provide a ventilation structure of a polishing processing chamber including a porous chamber having a plurality of holes formed on the surface facing the first region and formed substantially uniformly.

Due to the above structure, by driving the exhaust device, the air outside the polishing chamber is sucked into the polishing chamber from the suction duct provided in the second area and fills the porous chamber. In addition, the air filled in the porous chamber is discharged from a plurality of holes formed substantially uniformly on the surface facing the first area. This air forms a substantially laminar flow that flows toward the first region side and is then discharged out of the chamber by the exhaust device.

It is preferable to set the diameter and the number of the holes so that the entire air flowing out from the plurality of hole heads is directed toward the first region side. Thus, as a preferred embodiment, according to one feature of the invention, the diameter of the pores of the porous chamber is set to a value of 3 mm to 5 mm, the number of holes being the sum of the opening areas of the holes and the area of the surface on which the holes are formed. It is set to be a value of 10 to 20 percent for.

Further, according to one aspect of the invention, the exhaust chamber is provided with a partition wall, a first region and a side region attached to the inside of the polishing chamber in a state of being loosely fitted on the plate of the polishing apparatus by holes to form a gap around the plate. And an exhaust device is attached to at least one of the first region and the side region of the exhaust chamber.

Due to the above structure, the air discharged from the pores of the porous chamber and forming a substantially laminar flow flowing to the partition wall side of the exhaust chamber flows through the space between the plate and the partition wall aperture and enters the exhaust chamber. Air in the exhaust chamber is discharged to the outside by the exhaust device.

However, not only the air in the polishing chamber can flow into the exhaust chamber from the space between the hole of the partition wall and the flat plate, but also it can flow into the exhaust chamber from a position different from the space.

Therefore, according to one feature of the present invention, a predetermined number of suction holes are provided in the partition wall of the exhaust chamber.

Further, according to one aspect of the invention, there is provided a polishing processing apparatus having a rotatable plate and a rotatable pressing member having a rotatable pressing member for pressurizing the workpiece to the plate, and having a first region to which the plate is attached. A ventilation structure of a polishing chamber for ventilation, comprising: a suction duct installed in one region of the polishing chamber having a second region facing the first region and having a dustproof filter, and a gap formed around the plate; An exhaust chamber formed of a partition wall, a first region and a side region attached inside the polishing chamber in a state of being loosely fitted on the flat plate of the polishing apparatus by a hole, and attached to at least one of the first region and the side region of the exhaust chamber. It is to provide a ventilation structure of the polishing processing chamber including the exhaust device.

Further, according to one feature of the present invention, a predetermined number of holes are attached to the partition wall of the exhaust chamber.

1 is a schematic cross-sectional view showing a ventilation structure of a polishing processing chamber according to a first embodiment of the present invention.

2 is a perspective view of a forming position of the suction duct;

3 is a plan view showing a state of a hole covering an entire surface of a porous plate formed substantially uniformly.

4 is a schematic cross-sectional view of a laminar flow forming state.

Fig. 5 is a schematic cross-sectional view showing a state in which particles are pushed down to the side of the bottom region by laminar flow of air.

6 is a schematic cross-sectional view of the ventilation structure of the polishing processing chamber according to the second embodiment of the present invention.

7 is a plan view showing a gap of the exhaust chamber;

Fig. 8 is a schematic cross sectional view showing a discharge state of particles in a second embodiment.

9 is a schematic cross-sectional view showing a ventilation structure of the polishing processing chamber according to the third embodiment of the present invention.

10 is a schematic cross-sectional view showing a ventilation structure of a polishing processing chamber of the prior art.

Fig. 11 is a schematic cross-sectional view showing a state of generation of turbulence and convection in the polishing processing chamber.

Explanation of symbols on the main parts of the drawings

1: polishing processing chamber 3: exhaust device

5: porous chamber 6: blower

12: side region 100: polishing apparatus

101: lower plate 101a: polishing surface

102: carrier (pressure member) 103: index table

W: Workpiece (wafer) L: Centerline

2-1, 2-2: Suction Duct 4-1, 4-2: Filter Unit

40: ventilation fan 41: dustproof filter

50: porous plate 51: partition wall

P: Particle A: Air

Preferred embodiments of the present invention are described below with reference to the drawings.

<First Embodiment>

1 is a schematic cross-sectional view of a ventilation structure of a polishing processing chamber according to a first embodiment of the present invention. The same members as those shown in Figs. 10 and 11 use the same reference numerals.

In FIG. 1, the lower flat plate 101 of the polishing apparatus 100 is disposed in the polishing processing chamber 1 with the polishing surface 101a upward. The lower plate 101 is designed to be rotationally driven by the motor 111 inside the drive chamber 110 under the bottom region 11 that defines a part of the polishing processing chamber 1. In addition, the carrier 102 (pressure member) of the polishing apparatus 100 is designed to be raised or lowered, vibrated and rotated by a lifting mechanism, a vibration mechanism and a rotation mechanism (not shown). Reference numeral 103 is an index table. The carrier 102 picks up the unpolished wafer W (workpiece) disposed on the index table 103, transfers it to the surface to be polished 101a of the lower plate 101, and transfers the polished wafer W. It is designed to return to the index table 103.

The polishing processing chamber 1 accommodates the polishing apparatus 100. More specifically, the polishing processing chamber 1 includes a floor area 11 (first area), a ceiling area 10 facing the floor area 11 (second area), and a floor area 11 and a ceiling area 10. Is defined by four side regions 12 which are hermetically connected to the sides.

The ventilation structure of this polishing chamber 1 is composed of suction ducts 2-1 and 2-2 to which filter units 4-1 and 4-2 are attached, porous chambers 5 and blowers 3: exhaust device. ).

The suction ducts 2-1 and 2-2 transfer external air into the interior of the polishing chamber 1. As shown in FIG. 2, the suction ducts 2-1 and 2-2 are formed in the substantial center of the left half of the ceiling region 10 from the center line L, while the suction ducts 2-2 are formed. Is formed in the substantial center of the right half.

In Fig. 1, the filter units 4-1 and 4-2 are provided with the ventilation fan 40 and the dustproof filter 41, and the suction ducts 2-1 and 2- with the filter 41 facing downward. 2) is attached. Due to this, when the ventilation fan 40 is driven, external air flows into the polishing chamber 1.

The porous chamber 5 jets the air flowing from the suction ducts 2-1 and 2-2 into the laminar flow into the polishing chamber 1 and substantially faces the entire area of the ceiling area 10. It is designed so as to be limited to the bottom of (10).

More specifically, the porous plate 50 is attached in parallel to the bottom of the ceiling region 10. The central portion between the ceiling region 10 and the porous plate 50 is divided by partition walls 51.

In addition, as illustrated in FIG. 3, the porous plate 50 has a plurality of holes 52 formed substantially uniformly over the entire surface of the porous plate 50.

Due to this, once the air outside the polishing chamber 1 is accumulated in the porous chamber 5, they are blown into the polishing chamber 1 by a predetermined pressure through the plurality of holes 52.

In this embodiment, in order to obtain a substantially complete laminar flow, the diameter of the hole 52 is set to a value between 3 mm and 5 mm, and the number of the holes 52 is equal to the sum of the opening areas of the holes 52. It is set to be a value between 10 percent and 20 percent of the area of the porous plate 50.

The discharge blower 3 is for discharging air descending in the laminar flow state from the porous chamber 5 to the outside of the polishing processing chamber 1. The discharge blower 3 is attached to the side region 12 on the left side in FIG. 1 and is disposed to some extent higher than the polishing surface 101a of the lower plate 101.

Next, the operation of the ventilation structure of the polishing processing chamber according to the present embodiment will be described.

As shown by the dashed-dotted line of FIG. 4, the unpolished wafer W is held by the carrier 102. The wafer W is pressed against the polishing surface 101a of the rotating lower plate 101 and in this state, the carrier 102 rotates, at which time the wafer W is polishing surface 101a of the lower plate 101. Polished by). Slurry such as abrasive dross or solidified abrasive powder (not shown) is sprayed around the lower plate 101 like the particles P. As shown in FIG.

When the filter units 4-1 and 4-2 are driven before the polishing process, the outside air is sucked into the porous chamber 5 through the suction ducts 2-1 and 2-2 and the porous chamber 5 The pressure in) will increase.

Due to this, the air A in the porous chamber 5 is discharged from the plurality of holes 52 to the inside of the polishing processing chamber 1 at a constant pressure. As shown by the arrow, it is formed in a laminar flow as a whole and descends.

As a result, as shown in FIG. 5, the particles P injected around the lower plate 101 are pushed down to the bottom region 11 side by the laminar flow of air A. As shown in FIG.

Further, by driving the discharge blower 3 substantially simultaneously with the drive of the filter units 4-1 and 4-2, the particles P pushed down to the bottom region 11 side together with the air A. It is discharged out of the polishing chamber 1.

Thus, according to the ventilation structure of the grinding processing chamber of this embodiment, since the particles P injected around the lower plate during the polishing process are pushed down to the side of the bottom region 11 by the laminar flow of air A. , Particle P is unlikely to rise. As a result, the particles P enter between the wafer W and the polishing surface 101a, and there is almost no possibility of scratching on the wafer W. As shown in FIG.

Second Embodiment

6 is a schematic cross-sectional view of the ventilation structure of the polishing processing chamber according to the second embodiment of the present invention. The same members as those shown in FIGS. 1 to 5 are given the same reference numerals.

The ventilation structure of the polishing chamber of this embodiment defines an exhaust chamber 6 under the lower plate 101 of the polishing apparatus 100 and includes an exhaust blower 3 attached to the chamber 6.

More specifically, as shown in FIGS. 6 and 7, the partition wall 60 having a hole 61 larger than the diameter of the lower plate 101 is passed through the hole 61 above the lower partition wall 101. Loosely coupled, a space 62 is formed between the hole 61 of the partition wall 60 and the lower plate 101. The peripheral edge of the partition wall 60 is attached to the partition wall 63 and the lateral area 12 standing on the bottom area 11 to define the exhaust chamber 6. In addition, the partition wall 63 includes a suction hole 64 so that the polishing chamber 1 and the exhaust chamber 6 communicate with each other.

The discharge blower 3 is attached to the left position of FIG. 6 corresponding to the exhaust chamber 6.

Due to the above structure, as shown in FIG. 8, air A flowing from the suction ducts 2-1 and 2-2 into the polishing processing chamber 1 is partitioned by the discharge blower 3. It is sucked into the exhaust chamber 6 from the space 62 between the wall 60 and the lower plate 101 and is then discharged out of the polishing chamber 1.

Therefore, the particles P injected around the lower plate 101 during the polishing process are sucked into the exhaust chamber 6 together with the air A, and then outside the polishing chamber 1 by the discharge blower 3. To be discharged.

The rest of the structure, the mode of operation, and the good effects are similar to those of the first embodiment described above, and thus description thereof will be omitted.

Third Embodiment

9 is a schematic cross-sectional view of the ventilation structure of the polishing processing chamber according to the third embodiment of the present invention. The same members as those shown in FIGS. 1 to 8 are given the same reference numerals.

The ventilation structure of the polishing chamber of this embodiment is a combination of the ventilation structures of the first embodiment and the second embodiment.

In the ventilation structure of the polishing processing chamber of the first embodiment, the discharge blower 3 is disposed on the polishing surface 101a of the lower plate 101, and thus the bottom area ( Particles P pushed down to 11) may rise to the vicinity of the polishing surface 101a.

On the other hand, in the ventilation structure of the polishing chamber of the second embodiment, the majority of particles P injected around the lower plate 101 are sucked into the exhaust chamber 6 in the space 62. However, there are also particles P which are swept away by turbulence or the like in the polishing chamber 1. The particles may accumulate on the polishing surface 101a of the lower plate 101.

Therefore, in the ventilation structure of the polishing processing chamber of this embodiment, as in the case of the first embodiment, the suction ducts 2-1 and 2-2 with the filter units 4-1 and 4-2 are provided. A porous chamber 5 is provided below one ceiling region 10, and the exhaust chamber 6 is installed below the lower plate 101, as in the case of the second embodiment. The discharge blower 3 is attached to this.

Due to this structure, the particles P injected around the lower plate 101 are pushed down to the partition wall 60 side of the exhaust chamber 6 by the laminar flow of air A, and then the space ( It is sucked into the exhaust chamber 6 from 62 and discharged to the outside by the discharge blower 3. As a result, accumulation of the particles P injected onto the polishing surface 101a is completely prevented.

The rest of the structure, the mode of operation, and the good effects are similar to those of the first embodiment described above, and thus description thereof will be omitted.

Note that the present invention is not limited to the embodiment described above. Various modifications and variations are possible within the scope of the present subject matter.

For example, in the first and second embodiments, the formation of the polishing processing chamber and the polishing apparatus has been described, but the present invention can naturally also be applied to the lapping chamber and the lapping apparatus.

In addition, the partition wall plate 51 is installed in the porous chamber 5 to divide the porous chamber into two, but this also forms the interior of the porous chamber 5 as a single space without installing the partition wall plate 51. It may be. In this case, it is possible not to provide two suction ducts 2-1, 2-2, but a single suction duct 2-1 is provided at the center of the ceiling area 10 and a single filter unit 4-. 1) is attached to the suction duct 2-1.

Summarizing the preferred effects of the present invention, according to one feature of the present invention, since the air blown out of the porous chamber flows to the first region where the flat plate of the polishing apparatus adheres to the laminar flow, polishing of the workpiece formed during the polishing process The dross and solidified abrasive powder slurry and other particle slurry are introduced into the first region by substantial air laminar flow and discharged out of the polishing chamber by the exhaust device. As a result, it is possible to prevent particles sprayed around the plate from entering between the workpiece and the plate and causing scratches on the workpiece.

In addition, according to the characteristics of the present invention, since the air discharged from the porous chamber can form substantially complete laminar flow in this state, the effect of preventing the occurrence of scratches is further increased.

Further, according to the feature of the present invention, since the particles injected around the plate are guided to the partition wall side of the exhaust chamber by the laminar flow of air, and the particles are sucked into the exhaust chamber from the space between the holes of the plate and the partition wall. Therefore, the particles injected around the plate can be reliably discharged to the outside of the polishing chamber.

Further, according to the feature of the present invention, the particles discharged around the flat plate are sucked into the exhaust chamber through the space between the hole of the partition wall and the flat plate and discharged to the outside.

Claims (6)

A polishing processing apparatus for receiving a polishing apparatus having a rotatable platen and a rotatable pressing member for pressurizing a workpiece to the plate, and for venting the polishing processing chamber having the first region to which the plate is attached. In the ventilation structure, A suction duct installed in an area of the polishing processing chamber having a second area facing the first area and having a dustproof filter attached thereto; An exhaust device provided in at least one region of the polishing chamber having side surfaces of the first and second regions and side regions hermetically connected to the first region; And a porous chamber having a plurality of holes formed in a manner substantially adjacent to the entire second region and substantially uniformly formed on a surface facing the first region, the inner surface of the second region. The hole diameter of the porous chamber is set to a value of 3 mm to 5 mm, and the number of holes is 10 percent to 20 percent with respect to the area of the surface where the hole is formed. Ventilation structure of the grinding processing chamber set to be the value of. 2. The exhaust chamber as set forth in claim 1, wherein an exhaust chamber is formed in a partition wall, a first region, and a side region attached to the inside of the polishing chamber in a state of being loosely fitted on the plate of the polishing apparatus by holes to form a gap around the plate. Ventilation structure of a grinding | polishing process chamber with an exhaust apparatus attached to at least one of the 1st area | region and side surface area | region of the said exhaust chamber. 4. The ventilation structure of a polishing processing chamber according to claim 3, wherein a predetermined number of suction holes are attached to the partition wall of the exhaust chamber. In the ventilation structure of the polishing chamber for accommodating the polishing apparatus having a rotatable plate and a rotatable pressing member for pressurizing the workpiece to the plate, and for venting the polishing chamber having the first region to which the plate is attached. In A suction duct installed in an area of the polishing processing chamber having a second area facing the first area and having a dustproof filter attached thereto; An exhaust chamber formed of a partition wall, a first region and a side region attached to the inside of the polishing chamber in a state of being loosely fitted on the plate of the polishing apparatus by holes to form a gap around the plate; And a exhaust device attached to at least one of the first region and the side region of the exhaust chamber. 6. The ventilation structure of a polishing processing chamber according to claim 5, wherein a predetermined number of holes are attached to the partition wall of the exhaust chamber.