KR19990055606A - Epoxy Resin Compositions for Semiconductor Device Sealing - Google Patents

Abstract

The present invention relates to an epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, a filler, a flame retardant, a coloring agent, and an additive, wherein 0.2 to 0.3 wt% of black titanium oxide or 1/2 to 2 / of black titanium oxide and carbon black are used as colorants. The present invention relates to an epoxy resin composition for sealing a semiconductor device, characterized by using 0.3 to 0.4% by weight of a mixture mixed at a ratio of 1. In terms of sharpness of written characters after laser marking, regardless of the type or package type of the epoxy resin. Excellent effect.

Description

Epoxy Resin Compositions for Semiconductor Device Sealing

The present invention relates to an epoxy resin composition for semiconductor device encapsulation with improved laser markability, and more particularly, by using black titanium oxide alone or by mixing black titanium oxide and carbon black as a colorant. It is related with the epoxy resin composition for semiconductor element sealing which can improve the sharpness of a character after laser marking.

In general, as a final step of the semiconductor assembly process, there is a marking process for marking various characters or pictures on most package surfaces, which can be divided into ink marking and laser marking according to the marking method. In the past, the ink marking method was mainly used, but most of them are converted to laser marking in recent years due to problems of semiconductor productivity or quality improvement. Unlike the ink marking method, the laser marking method does not have to be erased or escaped from the surface of the semiconductor package after marking, and has the advantage of improving productivity and quality such as not having to undergo a curing process after marking. However, such a marking process has a problem that the sharpness after laser marking shows a large difference according to the kind of epoxy resin composition for semiconductor packages, and a solution for this is required.

In Japanese Patent Laid-Open No. 63-15446, brown colored silica was used to improve the laser marking characteristics, but the effect was insufficient. Japanese Patent Laid-Open No. 62-209841 and Japanese Patent Laid-Open No. 6-88011 changed the carbon black content. The method was used but no fundamental effect was obtained.

Japanese Patent Laid-Open No. 7-161878 and Japanese Patent Laid-Open No. 7-238210 propose methods using cyan dyes and antioxidants, but have not completely solved laser marking characteristics.

An object of the present invention is to solve the above problems, laser marking by using black titanium oxide alone or a mixture of black titanium oxide and carbon black as a colorant of the epoxy resin composition for sealing semiconductor devices. It is providing the epoxy resin composition for semiconductor element sealing which can improve the sharpness of a later character.

That is, the present invention is an epoxy resin composition consisting of an epoxy resin, a curing agent, a curing accelerator, a filler, a flame retardant, a coloring agent and an additive, wherein the coloring agent is from 0.2 to 0.3 wt% of black titanium oxide or from 1/2 to about black titanium oxide and carbon black. It is related with the epoxy resin composition for semiconductor element sealing characterized by using 0.3-0.4 weight% of the mixture mixed by the ratio of 2/1.

The epoxy resin composition used in the present invention is a configuration of a conventional epoxy resin composition composed of an epoxy resin, a curing agent, a curing accelerator, various kinds of silica fillers, colorants, and other additives having different particle sizes, and is not particularly limited for the present invention. .

Therefore, epoxy resin compositions for general semiconductor packages, for example, 3 to 10% by weight of epoxy resin, 3 to 8% by weight of curing agent, 0.1 to 1.0% by weight of curing accelerator, 73 to 88% by weight of filler, organic flame retardant 0.1 to 3.0% by weight %, Inorganic flame retardant 0.1 to 4.0% by weight can be used in the present invention.

However, the present invention is 0.2 to 0.3% by weight of black titanium oxide or 1/2 to 2/1 of black titanium oxide and carbon black, unlike the conventional one using carbon black alone as a coloring agent added in the composition of the conventional epoxy resin composition. By using 0.3 to 0.4% by weight of the mixture mixed in the ratio of it is possible to satisfy the sharpness for laser marking. When the range of the colorant is outside the scope of the present invention, it is required to be added within the scope of the present invention because it becomes similar to the existing properties and thus cannot achieve the required laser marking properties.

The epoxy resin composition for sealing a semiconductor device of the present invention, after weighing each component, is uniformly mixed using a Henschel mixer to prepare a powdery primary composition, followed by melt kneading at 100 ° C. for 7 minutes using a mixing 2-roll mill. It is then manufactured by cooling and grinding.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited by the following Examples.

Examples 1-6 and Comparative Examples 1-7

After molding the epoxy resin composition for semiconductor element sealing prepared by adding the content of the colorant to 100 parts by weight of the general epoxy resin composition as shown in Table 1 for each package, and after curing at 175 ℃ for 6 hours, laser marking properties The evaluation is shown in Table 1.

The laser marking property was observed by visual observation of the appearance of the molded article after the laser marking process after molding the semiconductor package with the epoxy resin composition.

coloring agent Ash Epoxy resin Applicable Package Laser marking property (sharpness) Carbon black Black titanium oxide Example 1 0 0.2 84 O / N / B SOJ ◎ Example 2 0 0.25 84 O / D SOJ ◎ Example 3 0 0.3 84 0 SOJ ◎ Example 4 0.2 0.1 76 0 SOP ◎ Example 5 0.15 0.15 76 0 SOP ◎ Example 6 0.1 0.2 73 0 DIP ◎ Comparative Example 1 0.2 0 84 O / N / B SOJ △ Comparative Example 2 0.1 0 84 O / D SOJ × Comparative Example 3 0.3 0 84 0 SOJ △ Comparative Example 4 0.3 0 76 0 SOP △ Comparative Example 5 0.2 0 76 0 SOJ × Comparative Example 6 0.3 0 73 0 DIP △ Comparative Example 7 0.2 0 73 0 DIP ×

O: allocresol novolak series N: naphthalene series

B: Bisphenol-based D: Dicyclopentadiene-based

SOJ: Small out line 'J' Lead SOJ: Small out line package

DIP: Dual in line package

As described above, the epoxy resin composition prepared according to the present invention uses a mixture of black titanium oxide or a mixture of black titanium oxide and carbon black, so that the sharpness of the written characters after laser marking regardless of the epoxy resin type or package type Shows a very good effect.

Claims (2)

In the epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, a filler, a flame retardant, a coloring agent and an additive, 0.2 to 0.3% by weight of black titanium oxide or a ratio of 1/2 to 2/1 of black titanium oxide and carbon black as a colorant. Epoxy resin composition for semiconductor element sealing, characterized by using a mixture of 0.3 to 0.4% by weight. Epoxy resin 3.0-10.0 wt%, Curing agent 3.0 to 8.0% by weight, 0.1 to 1.0 wt% of a curing accelerator, 0.1 to 1.0 wt% silica surface treatment agent, Inorganic filler 73.0 to 88.0% by weight, 0.1 to 5.0% by weight modifier, 0.1 to 3.0% by weight of organic flame retardant, Inorganic flame retardant 0.1 to 4.0% by weight, 0.1 to 4.0% by weight of release agent, 0.2-0.3 wt% of black titanium oxide, Or black titanium oxide and carbon black at a ratio of 1/2 to 2/1 0.3-0.4 wt% of mixed mixture Epoxy resin composition for sealing semiconductor elements formed by.