KR100540909B1 - Epoxy molding compound for encapsulating semiconductors elements with good markability - Google Patents
Epoxy molding compound for encapsulating semiconductors elements with good markability Download PDFInfo
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- KR100540909B1 KR100540909B1 KR1019990003785A KR19990003785A KR100540909B1 KR 100540909 B1 KR100540909 B1 KR 100540909B1 KR 1019990003785 A KR1019990003785 A KR 1019990003785A KR 19990003785 A KR19990003785 A KR 19990003785A KR 100540909 B1 KR100540909 B1 KR 100540909B1
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- epoxy resin
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- 239000004065 semiconductor Substances 0.000 title claims description 13
- 229920006336 epoxy molding compound Polymers 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 22
- 239000003086 colorant Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003063 flame retardant Substances 0.000 claims abstract description 6
- 239000000654 additive Substances 0.000 claims abstract description 5
- 230000000996 additive effect Effects 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003607 modifier Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 239000012796 inorganic flame retardant Substances 0.000 claims description 2
- 239000012756 surface treatment agent Substances 0.000 claims 1
- 238000010330 laser marking Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0041—Optical brightening agents, organic pigments
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
본 발명은 에폭시 수지, 경화제, 경화촉진제, 난연제, 착색제 및 첨가제로 이루어지는 에폭시 수지 조성물에 있어서, 상기 성분외에 바이올렛 컬러의 염료를 에폭시 수지 조성물에 첨가함으로써 레이저 마킹시의 문자선명도를 현저히 향상시킬 수 있게된다.In the epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, a flame retardant, a coloring agent and an additive, in addition to the above components, by adding a dye of violet color to the epoxy resin composition, it is possible to remarkably improve the character sharpness at the time of laser marking. do.
Description
본 발명은 열경화성 에폭시 수지 조성물에 관한 것으로, 더욱 상세하게는 에폭시수지, 경화제, 경화촉진제, 무기충전제 및 기타 첨가제로 이루어진 에폭시 수지조성물에 바이올렛 컬러 착색제를 첨가함으로써 우수한 레이저 마킹성(Laser Markability)을 발현할 수 있는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다.
The present invention relates to a thermosetting epoxy resin composition, and more particularly to expressing excellent laser marking properties by adding a violet color colorant to an epoxy resin composition composed of an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and other additives. It is related with the epoxy resin composition for semiconductor element sealing which can be performed.
일반적으로 반도체 조립 공정의 마지막 순서로서 대부분의 패키지 표면에 각종 문자나 그림 등을 표기하는 마킹(Marking)공정이 있는데, 이 공정은 마킹방식에 따라 잉크마킹과 레이저 마킹방식으로 나눌 수 있다. 종래에는 상기 마킹방식중 주로 잉크마킹방식을 사용하여 왔으나 반도체 생산성이나 품질향상의 문제로 인하여 최근에는 대부분이 레이저 마킹으로 전환하여 생산하고 있다.In general, as a final step of the semiconductor assembly process, there is a marking process for marking various characters or pictures on most package surfaces, which can be divided into ink marking and laser marking according to the marking method. Conventionally, the ink marking method has been mainly used among the marking methods, but most of them have recently been converted to laser marking and produced due to problems in semiconductor productivity or quality improvement.
레이저 마킹방식은 잉크 마킹방식과는 달리 표기후 문자가 지워지거나 반도 체 패키지 표면에서 이탈될 우려가 없으며, 표기후에 경화과정을 거치지 않아도 되는 등 생산성과 품질향상을 도모할 수 있는 장점들을 가지고 있다. 그러나, 이와 같은 마킹공정은 반도체 패키지용 에폭시 수지 조성물의 종류에 따라 레이저 마킹후의 선명도가 큰 차이를 나타내는 문제점을 가지고 있어 이에 대한 해결책이 요구되고 있다.Unlike the ink marking method, the laser marking method has the advantage of improving productivity and quality such that there is no risk of erasing of characters after marking or detaching from the surface of the semiconductor package. However, such a marking process has a problem that the sharpness after laser marking shows a large difference according to the kind of epoxy resin composition for semiconductor packages, and a solution for this is required.
일본국 특개소 63-15446호에는 갈색 착색 실리카를 이용하여 레이저 마킹 특성의 향상을 시도하였으나, 그 효과가 미미하였고, 일본국 특개소 62-209841호와 일본국 특개평 6-88011호에서는 착색제인 카본블랙의 함량을 변화시키는 방법을 제안하였으나 근본적인 효과를 얻지는 못하였다.
Japanese Patent Laid-Open No. 63-15446 attempted to improve laser marking characteristics using brown colored silica, but the effect was insignificant. In Japanese Patent Laid-Open No. 62-209841 and Japanese Patent Laid-Open No. 6-88011, A method of changing the content of carbon black was proposed but no fundamental effect was obtained.
본 발명은 상기와 같은 종래의 문제점을 해결하고 반도체 패키지의 레이저 마킹특성을 향상시키기 위하여 안출된 것으로, 열경화성 에폭시 수지 조성물에 바이올렛 컬러 착색제를 부가함으로써 레이저 마킹 특성이 현저하게 향상된 반도체 소자 밀봉용 에폭시 수지 조성물을 제공하는 것이다.
The present invention has been made to solve the conventional problems as described above and to improve the laser marking characteristics of the semiconductor package, epoxy resin for semiconductor element sealing markedly improved laser marking characteristics by adding a violet color colorant to the thermosetting epoxy resin composition. It is to provide a composition.
즉, 본 발명은 에폭시수지, 경화제, 경화촉진제, 무기충전제, 난연제, 착색제 및 첨가제로 이루어지는 에폭시 수지 조성물에 있어서, 상기 착색제로 바이올렛 컬러 염료를 0.1 내지 2.0중량% 첨가하여 이루어지는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다.That is, the present invention is an epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a flame retardant, a colorant, and an additive, wherein the colorant is added with 0.1 to 2.0% by weight of a violet color dye. It relates to an epoxy resin composition for sealing.
본 발명에서 사용되는 에폭시 수지 조성물은 에폭시 수지, 경화제, 경화촉진제, 무기충전제, 착색제 및 기타 첨가제로 구성되는 종래의 에폭시 수지 조성물의 구성으로 특별히 본 발명을 위하여 한정되는 것은 아니다.The epoxy resin composition used in the present invention is a configuration of a conventional epoxy resin composition composed of an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, a coloring agent, and other additives, and is not particularly limited for the present invention.
따라서, 일반적인 반도체 패키지용 에폭시 수지 조성물, 예를 들면 에폭시수지 5 내지 20중량%, 유기난연제로 브롬계 에폭시 2중량% 미만, 경화제 5 내지 10중량%, 경화촉진제 1중량% 미만, 무기충전제 60 내지 93중량%, 커플링에이전트 1중량% 미만, 개질제 5중량%미만, 왁스 1중량%미만, 무기계 난연제 3중량% 미만, 착색제 1중량% 미만으로 조성된 것을 본 발명에 사용할 수 있다.Thus, epoxy resin compositions for general semiconductor packages, for example, 5 to 20% by weight epoxy resin, less than 2% by weight bromine-based epoxy as an organic flame retardant, 5 to 10% by weight curing agent, less than 1% by weight curing accelerator, inorganic filler 60 to What is composed of 93% by weight, less than 1% by weight of coupling agent, less than 5% by weight of modifier, less than 1% by weight of wax, less than 3% by weight of inorganic flame retardant, and less than 1% by weight of colorant can be used in the present invention.
좀 더 상세하게 본 발명에서 사용되는 에폭시 수지로는 바이페닐계 또는 올소크레졸노볼락계 에폭시 수지이고, 경화제는 페놀노볼락계, 무기충전제로 사용되는 실리카는 구형과 각형중 어느 1종 또는 2가지를 병용하여 사용할 수 있다.In more detail, the epoxy resin used in the present invention is a biphenyl-based or olsocresol novolac-based epoxy resin, and the curing agent is a phenol novolac-based or silica filler used as an inorganic filler. Can be used in combination.
다만, 본 발명에서는 상기 에폭시 수지 조성물에서 착색제에 바이올렛 컬러 염료를 0.1 내지 2.0중량% 부가하여 사용함으로써 레이저 마킹특성을 향상시킬 수 있는 것을 특징으로 한다. 이때, 바이올렛 컬러 염료의 범위가 본 발명의 범위를 벗어나는 경우에는 요구하고자 하는 레이저 마킹특성을 얻을 수 없으며, 과량 사용한다 하여도 사용량에 비례하는 마킹특성을 수득할 수 없으므로 본 발명의 범위내로 첨가하는 것이 바람직하다.
However, the present invention is characterized in that the laser marking properties can be improved by adding the violet color dye 0.1 to 2.0% by weight to the colorant in the epoxy resin composition. In this case, when the range of violet color dye is out of the range of the present invention, it is impossible to obtain the laser marking characteristics required, and even if an excessive amount is used, the marking characteristics proportional to the amount used may not be obtained. It is preferable.
본 발명의 반도체 패키지용 난연성 에폭시 수지 조성물은 상기와 같은 종래 의 에폭시 수지 조성물과 본 발명에서 특징적으로 첨가되는 바이올렛 컬러 염료를 믹싱한 후 니이딩(Kneading), 냉각, 크러쉬(Crush)공정 및 블랜딩 공정을 거치는 일반적인 제조방법에 의하여 제조될 수 있다.
Flame retardant epoxy resin composition for a semiconductor package of the present invention is a kneading, cooling, crushing process and blending process after mixing the conventional epoxy resin composition as described above and the violet color dye characteristically added in the present invention Can be prepared by a general manufacturing method through.
이하, 본 발명을 실시예를 들어 더욱 상세히 설명하고자 하나 본 발명이 하기 실시예에 의하여 제한되는 것은 아니다.
Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited by the following Examples.
실시예 1∼9 및 비교예 1∼7Examples 1-9 and Comparative Examples 1-7
일반적인 에폭시 수지 조성물 100중량부에 대하여 실시예에서는 바이올렛 컬러 염료를 첨가한 후 문자선명도를 평가하여 표 1에 나타내었다.In the Example, 100 parts by weight of the general epoxy resin composition was added to the violet color dye, and then the character sharpness was evaluated and shown in Table 1.
문자선명도는 에폭시 수지 조성물로 반도체 패키지를 성형한 후 레이저 마킹공정을 거친 성형품의 외관을 육안에 의하여 관찰하였다. Character sharpness was observed by visual observation of the appearance of the molded article after the laser marking process after molding the semiconductor package with the epoxy resin composition.
OCN : 올소 크레졸 노볼락 DCPD : 디사이클로펜타디엔OCN: olso cresol novolac DCPD: dicyclopentadiene
Bi-ph : 바이페닐 PN : 페놀노볼락Bi-ph: Biphenyl PN: Phenol novolac
Xylok : 자일록Xylok: Xylok
적용 패키지 : QFP(Quad Plat Package)Application Package: QFP (Quad Plat Package)
◎ : 매우양호 ○ : 양호 × : 불량
◎: Very good ○: Good ×: Bad
이상에서 살펴본 바와 같이 본 발명에서 제안하는 것처럼 에폭시 수지 조성물에서 착색제에 바이올렛 염료를 부가하여 사용함으로써 에폭시 수지의 종류에 관계 없이 반도체 소자 레이저 마킹시 문자선명도가 탁월하게 향상된다.As described above, by using the violet dye added to the colorant in the epoxy resin composition as proposed in the present invention, the character sharpness is excellently improved when laser marking semiconductor devices regardless of the type of the epoxy resin.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990003785A KR100540909B1 (en) | 1999-02-04 | 1999-02-04 | Epoxy molding compound for encapsulating semiconductors elements with good markability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990003785A KR100540909B1 (en) | 1999-02-04 | 1999-02-04 | Epoxy molding compound for encapsulating semiconductors elements with good markability |
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| Publication Number | Publication Date |
|---|---|
| KR20000055259A KR20000055259A (en) | 2000-09-05 |
| KR100540909B1 true KR100540909B1 (en) | 2006-01-10 |
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| KR1019990003785A KR100540909B1 (en) | 1999-02-04 | 1999-02-04 | Epoxy molding compound for encapsulating semiconductors elements with good markability |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100393410B1 (en) * | 2000-12-18 | 2003-07-31 | 정도화성 주식회사 | Diffcult Combustibility Hi-Intensity Epoxy Composition For Insulator |
| DE102019101631B4 (en) | 2019-01-23 | 2024-05-23 | Infineon Technologies Ag | Corrosion-protected molding compound, process for its preparation and its use |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56106950A (en) * | 1980-01-28 | 1981-08-25 | Pentel Kk | Curable epoxy resin |
| US5229438A (en) * | 1989-12-01 | 1993-07-20 | Mitsui Petrochemical Industries, Ltd. | Two-component epoxy resin compositions |
| KR970021251A (en) * | 1995-10-31 | 1997-05-28 | 김충세 | Epoxy resin composition for semiconductor element encapsulation (2) |
| KR20000009057A (en) * | 1998-07-21 | 2000-02-15 | 유현식 | Composition of semiconductor device epoxy resins which is an excellent marking properties |
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1999
- 1999-02-04 KR KR1019990003785A patent/KR100540909B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56106950A (en) * | 1980-01-28 | 1981-08-25 | Pentel Kk | Curable epoxy resin |
| US5229438A (en) * | 1989-12-01 | 1993-07-20 | Mitsui Petrochemical Industries, Ltd. | Two-component epoxy resin compositions |
| KR970021251A (en) * | 1995-10-31 | 1997-05-28 | 김충세 | Epoxy resin composition for semiconductor element encapsulation (2) |
| KR20000009057A (en) * | 1998-07-21 | 2000-02-15 | 유현식 | Composition of semiconductor device epoxy resins which is an excellent marking properties |
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| KR20000055259A (en) | 2000-09-05 |
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