KR19990010172A - Common method for reflow / flow process of printed circuit board - Google Patents

Abstract

According to the present invention, the upper and lower surfaces of the surface mount component are simultaneously mounted in a single facility during the reflow process and the flow process performed during the double-sided mounting in which the surface mount component and the insert mount component are mixed and mounted on the printed circuit board. The present invention relates to a method for sharing a reflow / flow process of a printed circuit board, which shortens the movement between lines and improves productivity.

According to the method of the present invention, after loading a printed circuit board having unit printed circuit boards formed on both sides of the connection part in a surface mounting facility, powder lead is applied to one unit printed circuit board and an adhesive is applied to the other side. A process for mounting the surface mount component by mounting the surface mount component thereon to allow reflow soldering and curing of the adhesive to mount the surface mount component on one surface of the printed circuit board, and then flip the printed circuit board upside down. After repeating the above to complete the mounting of the surface-mounted components on both sides of the printed circuit board is made of a process for performing flow soldering by inserting the insertion-mounting components on each unit printed circuit board.

Description

Common method for reflow / flow process of printed circuit board

1A and 1B are side and plan views of a conventional double-sided printed circuit board.

Figure 2 (a) to (i) is a manufacturing process of reflow / flow double-sided mounting of a conventional printed circuit board.

3 is a side view showing a reflow soldering process.

4 is a side view showing the flow soldering process.

(A) (b) of FIG. 5 is a side view and a plan view of a double-sided printed circuit board according to the method of the present invention.

Figure 6 (a) to (i) is a manufacturing flow diagram of the reflow / flow double-sided mounting of the printed circuit board by the method of the present invention.

Explanation of symbols for main parts of the drawings

1: printed circuit board 1 ', 1: unit printed circuit board

2a, 2b: surface mount component 3: insertion mount component

4: powder lead 7: adhesive

The present invention relates to a method for mounting a circuit component on a printed circuit board, and more particularly, the surface mount when performing a leaf roll process and a flow process that are subjected to the double-sided mounting in which the surface mount component and the insert mount component are mixed and mounted. The present invention relates to a method for sharing a reflow / flow process of a printed circuit board which shortens the movement between lines by simultaneously mounting the upper and lower parts of a component, thereby improving productivity.

In general, circuit components mounted on a printed circuit board are classified into two types, surface mount components attached to one surface of the substrate and insertion-mount components inserted through the substrate, depending on the mounting type. The mounting on the substrate is made by the flow process.

The surface mount component is mounted on a substrate by performing a reflow process and a flow process, and the insert mounting component is mounted only by performing a flow process. In the double-sided mounting process in which the surface mount component and the insert mount component are mixed, both the reflow process and the flow process are performed.

(A) and (b) of FIG. 1 are a side view and a plan view showing a structure of a conventional double-sided mounted printed circuit board. As shown in the drawing, the upper surface of the printed circuit board 1 having the guide hole 1c formed on the corner thereof ( Surface mounting components 2a and 2b are respectively mounted on both sides 1a) and the lower surface 1b, while an insertion mounting component 3 penetrating through the printed circuit board 1 is mounted in the substantially central portion.

The manufacturing process of the double-sided printed circuit board shown in FIG. 1 will be described with reference to the drawings shown in FIGS. 2 through 4.

2A to 2D are a manufacturing process diagram of a reflow / flow double-sided mounting of a conventional printed circuit board, FIG. 3 is a side view showing a reflow soldering process, and FIG. 4 is a side view showing a flow soldering process.

First, as shown in (a) of FIG. 2, the printed circuit board 1 on which the circuit components are to be mounted is loaded. Then, the surface mounting component is mounted on the upper surface 1a of the printed circuit board 1 in the process of (b). Powder lead (4) is applied to the site to be used.

Subsequently, the surface mount component 2a is placed on the powdered lead 4 coated surface, and then moved to the reflow furnace 5 as shown in FIG. 3 in FIG. 2C to perform reflow soldering. do.

At this time, in the reflow soldering process, the surface-mounted component 2a is placed on a conveyor line 6 installed to pass through a reflow furnace 5 equipped with a heater 6 for heating the entire inside of a closed furnace. The surface mount component is formed by the molten lead 4a formed as a result of melting the powdered lead 4 by the high temperature by placing the printed circuit board 1 and allowing the substrate 1 to pass through the reflow furnace 5. The bonding between 2a) and the substrate 1 is made.

Next, the reflow soldering-completed printed circuit board 1 (FIG. 2D) is moved to the insertion mounting facility, and the insertion mounting component 3 is inserted through the insertion hole formed on the printed circuit board 1. Then, [Fig. 2 (e)], the printed circuit board 1 is turned over and moved back to the surface mounting equipment to apply the adhesive 7 for attachment of the surface mounting component 2b [Fig. 2 (bar)]. .

Subsequently, in the state where the surface mounting component 2b is placed on the adhesive 7 coated surface (FIG. 2), the reflow furnace 5 in FIG. 3 is passed in the same manner as in the step (D) above. The hardening of the adhesive 7 causes the mounting of the surface mounting component 2b to be completed (FIG. 2 (a)).

Next, the printed circuit board 1 on which the mounting work of the surface mounting component 2b is completed is turned over again to perform flow soldering as shown in FIG.

At this time, the flow soldering is placed on the printed circuit board (1) after the flow soldering is completed on the conveyor line (10) installed so as to pass inclined by a predetermined angle (θ) over the solder tank (9) containing the molten lead (8) The soldering of the surface mount component 2b is completed by making the wave molten lead 8a of FIG. 9 contact the end side protruding to the bottom surface through the printed circuit board 1. In addition, the entire double-sided mounting process of the printed circuit board 1 is completed.

However, in the case of the double-sided mounting in which the conventional reflow process and the flow process are mixed, frequent equipment lines must be moved from the surface mounting equipment → the insertion mounting equipment → the surface mounting equipment, and the top surface mounting components are mounted → the top surface mounting components are inserted. → There is a disadvantage in that the utilization of the facilities is lowered and productivity and quality deteriorate as the surface mounting parts must be installed.

Accordingly, the present invention is to solve the above-mentioned problems which are pointed out in the circuit component mounting process of a double-sided printed circuit board in which a conventional surface mount component and an insert mount component are combined. It is an object of the present invention to provide a common method for reflow / flow process of a printed circuit board, by which the upper and lower surfaces may be simultaneously mounted to shorten the line movement and improve the utilization and productivity of the equipment.

According to the present invention, in the construction of a printed circuit board on which circuit components are to be mounted, unit printed circuit boards are formed on both sides of a center connection part, and surface mounting components are mounted on upper surfaces of both printed circuit boards in a surface mounting facility. Then, the printed circuit board is turned upside down to mount the surface mounting component on the bottom surface on the same line, and then the line is moved to the insertion mounting facility to mount the insertion mounting component.

In this case, the two sets of printed circuit boards of the present invention are separated into two printed circuit boards by cutting the connection part after the mounting of the circuit components is completed.

Details of the object and the step-by-step manufacturing process and effect of the present invention will be clearly understood by the following detailed description with reference to the drawings showing a preferred embodiment of the present invention.

(A) and (b) of FIG. 5 are side and plan views of a double-sided printed circuit board manufactured by the method of the present invention, and (a) to (i) of FIG. 6 are according to an embodiment method of the present invention. Reflow / flow double sided mounting process diagram of a printed circuit board.

First, as shown in FIG. 3, the double-sided printed circuit board 1 fabricated by the method of the present invention is formed on the upper surface 1a and the lower surface 1b as in the conventional printed circuit board as described above. Each of the surface mounting components 2a and 2b is mounted, and the insertion mounting components 3 are mounted between the surface mounting components 2a and 2b, respectively, and the two unit printed circuit boards 1 'and 1 are mounted. It takes the structure connected with each other through this center connection part (c).

At this time, the upper and lower surfaces of the printed circuit boards 1 ′ and 1 of the unit of the printed circuit board 1 are formed opposite to each other.

Referring to the manufacturing process of the double-sided printed circuit board shown in FIG. 5 by the step-by-step process diagram of FIG.

First, as shown in FIG. 6A, the printed circuit board 1 is loaded into the surface mounting facility, and then powdered lead is placed at the mounting position of the surface mount component in the upper surface 1a of the one-side unit printed circuit board 1 '. While applying (4), the adhesive 7 is applied to the bottom face 1 (b) of the other unit printed circuit board 1 (Fig. 6B).

Next, the surface mount parts 2a and 2b are mounted on the powder lead 4 and the adhesive 7 [Fig. 6 (c)], and then the reflow as shown in Fig. 3 as described above. The melting of the powdered lead 4 and the curing of the adhesive 7 in the furnace are performed so that the mounting of the surface mounting parts 2a and 2b on the upper surface of the printed circuit board 1 is completed. )].

Subsequently, the printed circuit board 1 is turned upside down (Fig. 6 (e)) and the above steps (b) to (d) are repeated to mount the surface mounting components 2a and 2b on the upper surface thereof. To lose. FIG. 6B is a printed circuit board 1 in which mounting of the surface mounting components obtained by mounting the surface mounting components 2a and 2b on the top surface of the inverted printed circuit board 1 is completed.

Next, the printed circuit board 1 having completed the mounting of the surface mounting component is moved to the insertion mounting facility, and then the insertion mounting component 3 is inserted into the unit printed circuit board 1 'on one side [Fig. )]. The printed circuit board 1 is turned upside down and the insertion component 3 is inserted on the other unit printed circuit board 1.

Next, the connection part c of the printed circuit board 1 is cut to separate the two unit printed circuit boards 1 'and 1, and then flow soldering is performed in the flow soldering apparatus of FIG. As in (i), the double-sided mounted printed circuit board 1 is obtained.

As described above, in the common method of the reflow / flow process of the printed circuit board of the present invention, the surface mounting equipment is moved to the insertion mounting equipment after mounting of the surface mounting components is completed from the surface mounting equipment. As the mounting work on the mounting parts is carried out, the movement stage of the equipment is reduced to one step compared to the conventional work performed by moving from surface mounting equipment to insertion mounting equipment to surface mounting equipment, thereby improving workability and productivity. have.

In addition, according to the method of the present invention, the conventional top surface mounting component mounting → top surface mounting component mounting → top surface mounting component mounting process is shortened to upper / lower surface mounting component mounting → insertion mounting component insertion process, thereby increasing utilization of equipment and increasing equipment. It is possible to simplify the standardization and standardize it, thereby increasing the productivity and improving the quality.

Claims (1)

As a circuit component mounting method of a printed circuit board mounted by combining a surface mount component and an insertion mount component, (A) loading the printed circuit board on which the unit printed circuit board is formed on both sides of the central connection portion to the surface mounting facility; (B) applying powdered lead to one unit printed circuit board of the upper surface of the printed circuit board, and applying an adhesive to the other unit circuit board; (C) mounting a surface mount component on the powdered lead coated surface and the adhesive coated surface; (D) allowing the surface mount components to be mounted by causing reflow soldering and curing of the adhesive to the printed circuit board on which the surface mount components are mounted; (E) repeating steps (b) to (d) in the state where the printed circuit board is turned upside down to complete mounting of the surface mounting components on the upper and lower surfaces of the printed circuit board; (F) inserting the insert-mount component into the unit printed circuit board of one side of the printed circuit board, inverting the printed circuit board and inserting the insert-mount component into the other unit printed circuit board, and (G) A method for common flow / reflow process of a printed circuit board, comprising: cutting a connection part of a printed circuit board, separating two unit printed circuit boards, and then performing flow soldering on the inserted mounting component.