JPH08288641A - Soldering method - Google Patents

Abstract

PURPOSE: To provide a soldering method wherein manual soldering work can be eliminated when soldering parts of a reflow component and a flow component are mixedly present on the same surface of the same board. CONSTITUTION: A board 5 is devided into a reflow region I and a flow region II. After a surface mount component 6 of reflow solder mounting is mounted on the reflow region I, the reflow region I is covered with a tape 8. In this state, a flow soldering part like a lead 1a of an insert component 1 of the flow region is flow-soldered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method, and in particular, it is used when a soldering portion where reflow soldering is impossible and a soldering portion where flow soldering is impossible are mixed on the same surface of a substrate. It is useful.

[0002]

2. Description of the Related Art Soldering is required to mount electronic components on a board. For this soldering method, two types of soldering methods, a reflow soldering method and a flow soldering method, are mainly used.

The reflow soldering method is a method in which cream solder is printed on a substrate, and the solder paste is melted by heating the electronic solder (surface-mounted component) placed on the cream solder. Is.

In flow soldering, electronic components to be mounted (surface mount components) are fixed to one surface of a substrate with an adhesive and cured,
In this state, insert the insertion part from the opposite surface, and immerse the soldering part where the lead protrudes and the electrode part of the already hardened electronic part (surface mounting part) in the jet solder of the solder dip tank to perform soldering. Is.

FIG. 6 is an explanatory view showing an outline of flow soldering. As shown in the figure, when soldering the leads 1a of the insert component 1 such as a DIN connector, the substrate 2 on which the insert component 1 is mounted is conveyed toward the flow solder 4 ejected from the solder dip bath 3. The bottom surface of the substrate 2 is dipped (dipped) in the flow solder 4. As a result, the leads 1a protruding from the lower surface of the substrate 2 are soldered.

When the insertion component 1 is mounted on the substrate 2 prior to such soldering, the insertion component 1 is first inserted from one surface of the substrate 2. At this time, the lead 1a of the insertion component 1 is penetrated from one surface of the substrate 2 to the other surface. In this state, the leads 1a are soldered.

As described above, the two types of soldering methods, reflow soldering and flow soldering, are properly used according to the electronic component to be soldered. That is, reflow soldering is used exclusively for the small surface mount parts or surface mount parts that do not have heat resistance, in which the leads are bridged by the solder by the flow soldering, while the insert part 1 and the like are used. Flow soldering is used exclusively for the components whose leads 1a penetrate the substrate 2. That is, there are electronic components that can only be reflow-soldered (hereinafter referred to as reflow components) and electronic components that can only be reflow-soldered (hereinafter referred to as flow components). In addition, there are surface mount components that may be either reflow soldering or flow soldering. This is a component that does not bridge the leads with solder even in flow soldering and has heat resistance.

[0008]

In the prior art as described above, when the soldering portions of the reflow component and the flow component coexist on the same surface of the substrate, either the reflow component or the flow component is soldered. After the work is completed, it is necessary to solder the other component by hand.

Therefore, there is a problem that the soldering work requires a lot of time. Further, if this defect is to be avoided, there is a problem that the soldering portions of the reflow component and the flow component cannot be mixed on the same surface of the same substrate, and the layout of the electronic component on the substrate is limited. .

In view of the above-mentioned prior art, the present invention provides a soldering method capable of eliminating manual soldering work even when soldering portions of reflow components and flow components are mixed on the same surface of the same substrate. The purpose is to

[0011]

The structure of the present invention which achieves the above object is a reflow area facing the reflow surface on which the electronic component to be soldered is mounted on the same surface of the substrate on which the electronic component is mounted by reflow soldering. And a flow region where the flow surface of the component to be soldered by the flow soldering faces, the predetermined process is performed by mounting a predetermined electronic component in the reflow region and performing the reflow soldering. A second step of mounting a predetermined component on the obtained flow area of the board and covering the electronic component which has been reflow-soldered with a tape, and a surface having the flow area and the reflow area of the board obtained by the second step And a third step of performing flow soldering of electronic components in the flow region as a flow surface.

Further, the same surface of the board on which the electronic component is mounted is provided with a reflow region facing the reflow surface for mounting the electronic component to be soldered by reflow soldering and a flow surface of the component to be soldered by flow soldering. A first step of performing reflow soldering by dividing into a flow area and a predetermined electronic component mounted in the reflow area;
The second step of mounting a predetermined component in the flow area of the substrate obtained by the step of, and the surface having the flow area and the reflow area of the substrate obtained by the second step as a flow surface in a portion corresponding to the reflow area. The third step of carrying the solder toward the solder dip tank in which the jet flow of the solder is blocked and contacting only the flow area with the solder in the solder dip tank to selectively perform the flow soldering only on the electronic components in this area. And having.

The electronic components in the flow region are only insertion components such as connectors that cannot be reflow-soldered, or any of the insertion components that cannot be reflow-soldered and reflow soldering or flow soldering. It may be a large-sized surface mount component.

[0014]

According to the present invention having the above structure, the electronic components in the reflow area are not soaked in the flow solder in the dip bath,
Only the electronic components in the flow area are immersed in the flow solder.

[0015]

Embodiments of the present invention will now be described in detail with reference to the drawings. The same parts as those in FIG. 6 will be assigned the same reference numerals and overlapping explanations will be omitted.

FIG. 1 is a plan view showing a board for realizing a first embodiment of the present invention in a state where electronic components are mounted. As shown in the figure, the substrate 5 has, on one surface thereof, a reflow region I for mounting a surface mount component 6 which is a reflow component,
It is divided into a flow area II facing the soldering portion of the insertion part 1 which is a flow part.

Thus, in this embodiment, first, the surface mount component 6 is fixed in the reflow area I and reflow soldering is performed. Then, the insert component 1 is inserted into the other surface of the substrate 5 with the lead 1a, which is the soldering portion of the insert component 1, facing the flow region II.

At this time, in this embodiment, a large surface mount component 7 capable of not only reflow soldering but also flow soldering is fixed to the flow region II on one surface of the substrate 5 by an adhesive.

Next, the surface mount component 6 on the substrate 5 in this state is covered with the tape 8.

Finally, in this state, as shown in FIG. 2, one surface of the substrate 5 is opposed to the flow solder 4 of the dip tank 3 and the substrate 5 is conveyed toward the flow solder 4. Thus, the leads 1a and the surface mount components 7 in the flow region II are dipped in the flow solder 4 and the predetermined soldering is performed.

FIG. 3 is a plan view showing a board for realizing the second embodiment of the present invention in a state where electronic parts are mounted. As shown in the figure, the substrate 9 is the substrate 5 used in the first embodiment.
Similarly, the reflow region III and the flow region IV are divided, and these regions III and IV are mounted so that the soldering portions of the reflow component and the electronic component which is the flow component face each other.

In this embodiment, the flow region of the substrate 9
The surface on the IV side is opposed to the flow solder 4 of the dip tank 3 and conveyed to the dip tank 3 side. At this time, the dip tank 3 is conveyed to the substrate 9 as shown in FIG. The portion corresponding to the reflow region III is closed by the lid 3a to prevent the jet flow of the flow solder 4. Thus, FIG.
As shown in FIG. 4, only the flow region IV is immersed in the flow solder 4, and the electronic components only in this flow region IV are selectively flow-soldered.

In the above-mentioned substrates 5 and 9, the large surface mount component 7 capable of flow soldering has a flow region I.
I implemented it in I and IV, but this is in reflow areas I and III,
It may be mounted by reflow soldering with cream solder.

[0024]

As described above in detail with reference to the embodiments, according to the present invention, the flow area facing the flow soldering portion and the reflow area facing the reflow soldering portion are mixed on the same surface of the substrate. Since all electronic components can be soldered without the need for manual work,
This soldering work can be performed with high efficiency.

[Brief description of drawings]

FIG. 1 is a plan view showing a board that realizes a first embodiment of the present invention with electronic components mounted thereon.

FIG. 2 is an explanatory diagram showing a mode at the time of flow soldering in the first embodiment of the present invention.

FIG. 3 is a plan view showing a board that realizes a second embodiment of the present invention with electronic components mounted thereon.

FIG. 4 is an explanatory view showing a dip tank used in the second embodiment of the present invention.

FIG. 5 is an explanatory view showing a mode at the time of flow soldering in the second embodiment of the present invention.

FIG. 6 is an explanatory view showing a mode at the time of flow soldering according to a conventional technique.

[Explanation of symbols]

 I, III Reflow area II, IV Flow area 1 Inserted parts 3 Dip bath 4 Flow solder 5,9 Substrate 6,7 Surface mount parts 8 Tape

Claims (4)

[Claims] 1. A reflow area facing a reflow surface for mounting an electronic component to be soldered by reflow soldering and a flow surface of a component to be soldered by flow soldering on the same surface of a substrate on which electronic components are mounted. The first step of dividing into a flow area facing the flow area, mounting a predetermined electronic component in the reflow area and performing reflow soldering, and mounting the predetermined component in the flow area of the board obtained in the first step and performing the reflow. A second step of covering the soldered electronic component with a tape, and a step of performing flow soldering of the electronic component in the flow region with the surface having the flow region and the reflow region of the substrate obtained in the second process as a flow face. 3. A soldering method comprising the step 3). 2. A reflow region facing a reflow surface for mounting an electronic component to be soldered by reflow soldering and a flow surface of a component to be soldered by flow soldering on the same surface of a board on which an electronic component is mounted. The first step of dividing into a flow area facing the flow area, mounting a predetermined electronic component in the reflow area and performing reflow soldering, and the second step of mounting the predetermined component in the flow area of the substrate obtained by the first step. And the surface having the flow area and the reflow area of the substrate obtained in the step 2 and the flow step is used as a flow surface, and the portion corresponding to the reflow area is covered and conveyed toward the solder dip tank in which the jet of solder is blocked, A third step of bringing only the flow region into contact with the solder in the solder dip bath to selectively perform flow soldering only on the electronic components in this region. Only way. 3. The soldering method according to claim 1, wherein the electronic components in the flow region are only insertion components such as connectors that cannot be reflow-soldered. 4. The electronic component in the flow region is an insertion component that cannot be reflow-soldered, and a large surface-mount component that can be reflow-soldered or flow-soldered. 1] or the soldering method according to claim 2.