JPH0350894A - Mounting of component - Google Patents

Abstract

PURPOSE:To automatically coat a part between a board and a component to be mounted with a hardener by utilizing an automatic surface-mounting component mounting apparatus in the same process by which surface-mounting components are fixed temporarily and mounted by a method wherein the part between a pattern on the substrate and the component is coated with an insulating material by using an adhesive feed means which is used temporarily to fix and mount the surface-mounting components. CONSTITUTION:Wiring patterns 8 and through holes 6, 7 are formed in a mounting part of a lithium battery. Prescribed positions, e.g. three points, on a substrate 1 in a position in which, e.g. the lithium battery 4 or the like as a mounting component is mounted are coated automatically with a hardener 5 which is used and an insulating layer of prescribed amount and which can be coated by using a feed means by using an adhesive feed means as one means which is incorporated in an automatic mounting apparatus for surface mounting components. A feed amount and a position of the hardener 5 are decided by a program which has been incorporated in advance in the automatic mounting apparatus. One pair of lead terminals 2, 3 of the lithium pattern 4 are inserted into the through holes 6, 7 which have been made in prescribed positions in the substrate 1; they are bonded automatically in the same process by which other surface-mounting components are fixed temporarily to the substrate 1.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a component mounting method for mounting electronic components on a substrate, and particularly relates to a component mounting method for mounting an electronic component on a substrate facing surface. The present invention relates to a method for mounting components on a substrate on which a pattern is formed.

(Prior art) When mounting electronic components on a board, especially components with exposed electrodes on the surface such as lithium batteries, or components with exposed metal parts even if they are not electrodes. ,
If there are through holes or wiring patterns at the position on the board where this component is mounted, vibration or impact may cause the component to pass through even if the metal part of the component is spaced apart from these through holes. Since there is a risk of contacting holes, wiring patterns, etc. and short-circuiting and destroying the components, no through-holes, patterns, etc. were provided under the above-mentioned components.

Therefore, high-density mounting of components could not be achieved.

In order to provide a pattern etc. under the above-mentioned components to achieve high density, conventionally the components are mounted on the board 1 via a pair of lead terminals 2.3 as shown in Fig. 3. An insulating layer 5 was formed between the component 4 and the substrate 1 by manual application of a hardening agent or pasting of an insulating seal to prevent contact.

However, according to the above method, the work of applying the hardening agent and pasting the insulating seal is manually performed by the worker, and the higher the density of packaging, the more accurately the insulating layer 5 is formed at the desired location. This was time consuming and had very low reliability.

Therefore, there was a problem that the work efficiency was poor and the insulating layer 5 was not formed uniformly.

(Problems to be Solved by the Invention) As mentioned above, in the conventional component mounting method, the insulating layer was manually formed to prevent contact between the component and the board, which resulted in poor work efficiency and poor uniformity. There was a problem in that it was difficult to form an insulating layer.

Therefore, the present invention was made in consideration of the above-mentioned circumstances.
Another object of the present invention is to provide a component mounting method that can uniformly form an insulating layer.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention provides at least a conductive portion provided on a component mounted opposite to a pattern of a board on which the surface mount component is mounted. In the component mounting method in which the component is mounted on the substrate with an insulating material interposed therebetween to prevent contact with the pattern, the component is mounted on the substrate by an adhesive supply means for temporarily mounting the surface mount component on the substrate. The insulating material is applied between the pattern and the component.

(Function) According to the above method, an insulating material such as a curing agent is placed on a surface of a predetermined position on a printed circuit board using an automatic surface mount component mounting device for temporarily mounting surface mount components on a printed wiring board. It can be applied automatically and uniformly at the same time as temporarily fixing and mounting components. Therefore, by incorporating a program for applying a hardening agent to a predetermined position in an automatic mounting device, it is possible to apply the hardening agent at the same time as the temporary mounting process of surface-mounted components, and to improve the workability between the parts and the board. Contact can be reliably prevented.

(Example) Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

An embodiment of the present invention is shown in FIGS. 1 and 2. FIG.

In the figure, parts that are the same or equivalent to those of the conventional example shown in FIG. 3 are designated by the same reference numerals. Note that in order to realize high-density mounting, wiring patterns 8 and through holes 6.7 are provided in the lithium battery mounting area. A board 1 at a position where a mounted component such as a lithium battery 4 is mounted.
On the top, a predetermined amount of an insulating layer is formed by an adhesive supplying means incorporated in an automatic mounting apparatus for surface mount components (not shown), and a hardening agent 5 is applied by the supplying means.
is automatically supplied and applied to predetermined positions, for example, three points.

The supply amount and position of the curing agent 5 are determined in advance by a program installed in the automatic mounting device. lithium battery 4
A pair of lead terminals 2゜3 are inserted into through holes 6.7 formed at predetermined positions on the board 1, and they are automatically bonded in the same process as temporarily fixing other surface mount components to the board 1. be done.

As a result, an insulating layer made of the curing agent 5 is formed between the substrate 1 and the lithium battery 4, thereby preventing electrical contact between the lithium battery 4 and the through holes 6.7 and the wiring pattern 8 on the substrate 1. I can do it.

According to this embodiment, the curing agent 5 for preventing contact between the lithium battery 4 and the board 1 is automatically applied using an automatic mounting device in the same process as the temporary mounting of surface mount components. This eliminates the need to manually apply the curing agent 5, improving work efficiency, eliminating variations in the amount and position of application, and improving reliability of component mounting.

Although the above embodiment describes the case where the mounted component is the lithium battery 4, similar effects can be obtained even when the mounted component is another component with an exposed electrode portion or metal portion on the surface. Further, the positions at which the curing agent 5 is applied are not limited to three points.

[Effects of the Invention] As explained above, according to the present invention, a surface mount component automatic mounting device is used between a board and a component to be mounted to automatically mount the surface mount component in the same process as the temporary mounting of the surface mount component. Since the hardening agent is applied, the insulating layer can be formed uniformly with good workability.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of the component mounting method according to the present invention, FIG. 2 is a side view showing a state in which components are similarly mounted, and FIG. 3 is a side view showing a conventional component mounting method. It is. 1... Board 4... Lithium battery (electronic component) 5... Curing agent (insulating member) 6.7... Through hole 8... Wiring pattern

Claims (1)

[Scope of Claims] At least the part is mounted on the board with an insulating material interposed in order to prevent contact between the pattern and a conductive part provided on the part mounted opposite to the pattern of the board on which the surface mount part is mounted. A method for mounting a component on a board, characterized in that the insulating material is disposed between a pattern on the board and the component by an adhesive supply means for temporarily mounting the surface mount component on the board. How to mount the parts.