KR19990003954U

KR19990003954U - Socket assembly for semiconductor device inspection

Info

Publication number: KR19990003954U
Application number: KR2019980019266U
Authority: KR
Inventors: 정운영
Original assignee: 정운영
Priority date: 1998-10-09
Filing date: 1998-10-09
Publication date: 1999-01-25

Abstract

본 제품은 메모리 칩의 성능 검사를 하기위한 중요한 부품의 하나인 CONTACTFINGER용 SOCKET ASSEMBLY로서 기존의 SOCKET 사용 시 SOCKET 수명이 다하여 교체 시 SOCKET 전체를 교환하여야 하나 본 제품은 CONTACT FINGER만 교체함으로 비용을 줄일 수 있으며, 또한 기존의 SOCKET 사용 시 P.C. BOARD상의 접촉 패턴과 SOCKET 간의 접촉을 위하여 SOCKET BOARD를 사용하여야 하나 본 고안은 CONTACT FINGER와 P.C BOARD와 직접 접촉하게 함으로서 원가 절감과 전체 회로선의 길이를 줄임으로 인한 주파수 특성이 양호함으로 고주파 및 SPEED관련 특성의 소자 검사 시 수율 개선 과 수입품인 I.C SOCKET의 대체 효과와 비용 절감을 위한 제품이다.This product is SOCKET ASSEMBLY for CONTACTFINGER, one of the important parts to test the performance of memory chip. So, when the existing SOCKET is used, the SOCKET life will be exhausted. Also, when using existing SOCKET, PC SOCKET BOARD should be used for the contact between the contact pattern on the board and SOCKET. However, this design makes direct contact with CONTACT FINGER and PC BOARD so that the frequency characteristics are good due to cost reduction and shortening the length of the entire circuit. It is a product to improve the yield at the time of device inspection and to replace the imported IC SOCKET and reduce the cost.

또한 본 고안은 SOCKET 상단이 집게구조로 되어 있어서 소자를 SOCKET에 삽입시 손잡이를 누르면 개방 되고, 삽입후 놓으면 손잡이의 스프링에 의하여 전기적 접촉이 이루어지는 구조로서 BURN-IN TEST용 SOCKET으로도 사용 가능한 구조임.In addition, the present invention has a structure in which the upper part of the socket is clamped, and when the device is inserted into the socket, the handle is opened by pressing the handle, and when it is released, the electrical contact is made by the spring of the handle, which can be used as a socket for burn-in test. .

Description

Socket assembly for semiconductor device inspection

본 고안 SOCKET ASSEMBLY는 기존의 SOCKET의 전기적 특성을 개선하였고, 또한 SOCKET 전체를 교체하지 않고 CONTACT FINGER 부분만 교체하게 함으로 교체 비용을 절감케 하였으며, 또한 OPEN-TOP 방식으로 BURN-IN SOCKET으로도 사용 가능한 구조로서, 기존의 SOCKET은 도면 1에서 SOCKET(C)와 P.C BOARD(M) 위의 패턴(E) 간의 연결을 위하여 또 하나의 SOCKET BOARD를 사용하여야 하나 본 고안은 SOCKET BOARD가 필요치 않으며, 기존의 SOCKET은 접촉 단자(D) 가 교체가 불가능한 고정형 이거나 낱개로 하나 하나씩 교체 하여야 하나 본 고안은 접촉 단자(D)를 열 접착 고정 TAPE을 사용하여 필요한 숫자만큼 연결하여 한꺼번에 교체 가능케 하였으며, 또한 실리콘 고무(H)를 접촉 단자 (CONTACT FINGER) 상/하단에 심어서 접촉 단자의 탄성을 항상 일정하게 유지 하도록 하였다.The present invention SOCKET ASSEMBLY improved the electrical characteristics of the existing SOCKET, and also reduced the replacement cost by replacing only the entire socket without replacing the entire SOCKET. Also, it can be used as the BURN-IN SOCKET by the OPEN-TOP method. As a structure, the existing SOCKET should use another SOCKET BOARD for the connection between the SOCKET (C) and the pattern (E) on the PC BOARD (M) in Figure 1, but the present invention does not require the SOCKET BOARD, SOCKET is a fixed type that the contact terminals (D) are not replaceable or must be replaced one by one, but the present invention connects the contact terminals (D) as many times as necessary by using heat-adhesive fixing tapes, and makes it possible to replace silicone rubber at once. H) was planted on top / bottom of contact terminal to keep contact terminal's elasticity always constant.

이하에서 본 고안 장치의 구조 및 작동 상태를 첨부 도면을 참고로 하여 상세히 설명 한다.Hereinafter, a structure and an operating state of the device of the present invention will be described in detail with reference to the accompanying drawings.

1) 도면 제 1도 와 같이 접촉 단자(D)인 CONTACT FINGER를 SOCKET ASSE MBLY (C)의 중앙 고정 홈에 좌/우 SOCKET 결합 고정핀(K)로 고정한 후 SOCKET ASSEMBLY(C)를 P.C BOARD 상의 접촉 패턴(E)에 접촉되게 고정핀(G)와 고정볼트(F)로 고정 한다.1) As shown in Fig. 1, fix the contact finger D, the contact terminal D, to the center fixing groove of SOCKET ASSE MBLY (C) with the left / right SOCKET coupling fixing pin (K), and then fix the SOCKET ASSEMBLY (C) on the PC BOARD. Fix it with fixing pins (G) and fixing bolts (F) to make contact with the contact pattern (E).

2) 손잡이(B)를 누르면 손잡이가 좌/우로 벌어져, 반도체소자(1)를 SOCKET ASSEMBLY (C)에 삽입 후 놓으면 손잡이(B) 의 스프링 힘에 의하여 반도체소자(1)의 LEAD를 누르면서 CONTACT FINGER(D)와 P.C BOARD 위의 접촉 패턴(E)간의 동시 접촉으로 인하여 검사가 수행된다.2) Press the handle (B) to open the handle to the left / right. Insert the semiconductor device (1) into SOCKET ASSEMBLY (C) and release it. Press the LEAD of the semiconductor device (1) by the spring force of the handle (B) and press CONTACT FINGER. The inspection is performed due to the simultaneous contact between (D) and the contact pattern (E) on the PC BOARD.

이때 2)번 동작의 수십 만번이 되풀이 될 시 CONTACT FINGER(D)의 탄력성 유지를 위하여 실리콘 고무 판(H)을 CONTACT FINGER 상/하단에 고정 시킨다.At this time, when several hundred thousand times of operation 2) is repeated, the silicone rubber plate (H) is fixed to the upper and lower sides of the contact finger to maintain the elasticity of the contact finger (D).

1) CONTACT FINGER(E)간 간격을 정확히 유지하기 위하여 열 접착 TAPE(L)을 사용하여 핀간을 연결하여 CONTACT FINGER(D)를 SOCKET ASSEMBLY(C)에 삽입 및 분해가 용이 하게 제작 한다.1) In order to maintain the gap between contact finger (E) accurately, connect contact pin using heat adhesive tape (L) to make contact finger (D) inserted into socket assembly (C) easily.

상기의 식별자가 없습니다.No identifier above

제 1 도는 조립 단면도1st turning assembly section

제 2 도는 평면도2nd turning top view

제 3 도는 분해 단면도3rd turning exploded section

[도면의 주요 부분에 대한 설명][Description of main part of drawing]

A : SOCKET 고정 장치A: SOCKET fixing device

B : 손잡이(검사할 반도체 소자 물림장치)B: Handle (semiconductor bite device to be inspected)

C : 본 고안 장치의 SOCKET BODY(CONTACT FINGER 및 손잡이를 고정하는SOCKET 몸체)C: SOCKET BODY (SOCKET body to fix CONTACT FINGER and handle)

D : CONTACT FINGERD: CONTACT FINGER

E : P.C BOARD 상 접촉 패턴E: Contact pattern on P.C BOARD

F :고정 볼트 구멍 (SOCKET 과 P.C BOARD 를 고정)F: Fixing bolt hole (fixes SOCKET and P.C BOARD)

G : 위치 고정 핀 구멍G: positioning pin hole

H : 실리콘 고무판H: Silicone Rubber Sheet

J : 손잡이 고정핀J: handle fixing pin

K : SOCKET 좌/우 고정핀.K: SOCKET left / right fixing pin.

L : 열 접착 TAPE.L: heat adhesive TAPE.

상기의 식별자가 없습니다.No identifier above

Claims

When replacing, disassemble the left / right socket (C) to both sides without replacing the entire socket like the existing socket, and replace only the contact finger (D) located in the center of the socket with the fixing pin (K) at the fixed groove position. SOCKET ASSEMBLY rescue device.

Like the conventional SOCKET for semiconductor inspection, additional socket board is required when connecting between PIN of socket and contact pattern (E) on P.C board.

SOCKET ASSEMBLY structure device connected to CONTACT FINGER (D) and P.C BOARD contact pattern (E) by fixing SOCKET ASSEMBLY (C) and P.C BOARD with fixing pin (G) and fixing bolt (F).

SOCKET ASSEMBLY structure device in which high elasticity / heat resistant rubber such as silicone rubber (H) is inserted into SOCKET ASSEMBLY, which is the upper / lower part of CONTACT FINGER to maintain elasticity of CONTACT FINGER (D).

The upper part of the socket consists of a grip (B) with a tong structure. When the semiconductor device is inserted into the socket, the handle is pushed to the left or right to be inserted, and when it is released, it is pressed by pressing the leg of the device by the spring force of the handle. Rescue device in which electrical electrical contact is made.