KR200265544Y1 - Semiconductor package test socket by using silicone rubber - Google Patents

Abstract

The present invention relates to a semiconductor package test socket using silicon rubber, wherein the support frame is fixed to a socket board, a silicon rubber supported by the support frame, and formed at a place corresponding to a lead of the semiconductor package on the silicon rubber. It is configured to include a conductive portion.

According to the present invention, the test socket can be miniaturized by utilizing the elastic force of the silicon rubber to cope with the trend of narrowing the lead spacing, and it is possible to provide a test socket that can be used for testing a high frequency semiconductor package.

Description

Semiconductor package test socket by using silicone rubber

The present invention relates to a semiconductor package test socket using silicon rubber. More specifically, the present invention relates to a device that can extend the service life of a socket and manufacture a smaller socket by using the elasticity of a silicon rubber in a test socket of a semiconductor package.

The semiconductor package test socket is a connecting device that connects a completed semiconductor package completed to the packaging process and connects it to the test equipment. The semiconductor package test socket transfers electrical signals from the test equipment to the semiconductor package and transfers the return signal of the semiconductor package to the test equipment. It is a device for passing back and testing whether the semiconductor package performs normal operation.

In light of the recent trend of miniaturized and multi-pinned semiconductor package leads, testing of semiconductor package leads and test socket socket pins ensures reliable contact, miniaturization of test sockets, and high-frequency semiconductor packages. Important considerations when manufacturing the socket. It is also important to ensure that the socket pins of the test sockets are strong enough to withstand the testing of the semiconductor package from tens of thousands to hundreds of thousands of times.

1 shows an example of a conventional TSOP or QPN type semiconductor package test socket, in which the lead 3 of the semiconductor package 1 and the conductive socket pin 8 of the test socket 7 are in contact with each other. The socket pin 8 is supported and protected by a housing 5 made of epoxy resin or the like, the lower part of which extends to the PCB substrate 9.

In the test socket 7 according to the related art, in order to increase the contact force between the lead 3 and the socket pin 8, the socket pin 8 is curved or spiraled as shown in FIG. However, the curved or helical shape of the socket pin 8 causes the test socket 7 to become bulky, which makes it difficult to apply to a semiconductor having a narrow lead spacing, and also increases the length of the socket pin 8, thereby increasing the high frequency. There is a disadvantage in the test of the semiconductor package for.

The present invention has been made to solve the problems in the conventional semiconductor package test socket as described above, by miniaturizing the test socket by utilizing the elastic force of the silicon rubber can cope with the trend of narrowing the lead spacing, An object of the present invention is to provide a semiconductor package test socket using a silicon rubber that can be used for testing a semiconductor package.

1 is a cross-sectional view of a semiconductor test socket according to the prior art.

Figure 2a is a cross-sectional view of a semiconductor test socket according to the present invention

Figure 2b is a plan view of a semiconductor test socket according to the present invention

Figure 3a is an exploded perspective view of a coupling method of an embodiment according to the present invention

3b is a perspective view showing a coupling method of an embodiment according to the present invention

<Description of Major Symbols in Drawing>

1, 10 semiconductor packages, 3, 13 leads, 5 housings, 7 test sockets, 8 socket pins, 9 PCB boards, 20 silicon rubber, 23 conductive parts, 30 support frames, 33 screws, 40 socket boards, 43 conductive layers

Overview of the devise

The semiconductor package test socket using the silicon rubber according to the present invention is a socket for a semiconductor package test installed on a socket board and making electrical contact with a lead of the semiconductor package.

A support frame fixed to the socket board,

A silicon rubber supported by the support frame,

And a conductive portion formed at a portion corresponding to the lead of the semiconductor package on the silicon rubber.

The conductive part may be formed by combining Be-Cu plate in a band shape.

Example and its function

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the test socket and its operation according to the present invention. Figure 2a is a cross-sectional view of one embodiment of a test socket according to the present invention, Figure 2b is a plan view thereof.

The support frame 30, which is an insulator, is fixed on the socket board 40. The silicone rubber 20 is fixed and supported by the support frame 30. 3A and 3B are perspective views illustrating a coupling method of the support frame 30, the silicon rubber 20, and the Be-Cu plate in this embodiment. As shown in Figs. 3A and 3B, in this embodiment, both ends of the plate-shaped support frame 30 are fixed to the socket board 40 by the small screws 33, and are transverse to a predetermined portion of the silicone rubber 20. Although the gap 31 is fixed in the direction to be inserted into the support frame 30, the coupling method of the support frame 30 and the silicon rubber 20 is not limited thereto.

Silicone rubber (Silicone rubber, 20) is a polymer material mainly composed of silicon, and is a kind of conducting resin, and has elasticity such as rubber. The conductive portion 23 is formed on the surface of the silicon rubber 20. The conductive portion 23 is formed at a position corresponding to the lead 13 of the semiconductor package 10 and is electrically connected to the conductive layer 43 formed on the socket board 40. The socket board 40 is connected to test equipment (not shown) to test the semiconductor package 10 while transmitting and receiving electrical signals.

In the present embodiment, the conductive portion 23 serves as a socket pin of a conventional test socket, and is formed by bonding a Be-Cu plate in a band shape. The conductive portion 23 extends to the conductive layer 43 of the socket board 40.

Referring to the operation of the semiconductor package test socket using the silicon rubber according to the present invention is as follows. The semiconductor package 10 is placed on the silicon rubber 20 of the test socket, and predetermined pressure means (not shown) pressurizes the semiconductor package 10 so that the lead 13 and the test socket of the semiconductor package 10 are pressed. The Be-Cu plate 23, which is a conductive portion of N, is in close contact and electrically conducts. Since the silicon rubber 20 has elasticity, the silicon rubber 20 can cope with a test of a semiconductor package which is repeated tens of thousands or more times, thereby extending the life of the test socket. Be-Cu plate 23 is connected to the conductive layer 43 of the socket board 40 to exchange electrical signals with test equipment (not shown).

Although one embodiment of a semiconductor package test socket using a silicon rubber according to the present invention has been described above, the technical scope of the present invention is not limited thereto. The present invention may be variously modified under the same technical concept, and the technical scope should be determined by the matters described in the utility model registration claims.

According to the semiconductor package test socket using the silicon rubber according to the present invention has the following effects.

First, manufacturing is simpler than conventional test sockets, and thus the price can be lowered.

Second, since the socket can be miniaturized, the lead gap of the semiconductor package can be narrowed.

Third, since there is no bone at the contact area of the lead of the semiconductor package, foreign matter does not remain so that the contact characteristics are improved and the life is extended.

Fourth, the length of Be-Cu plate, which acts as a socket pin, is shortened, so that it can be used for electrical characteristics test of high frequency semiconductor package.

Claims (3)

A socket for a semiconductor package test, which is installed on a socket board 40 and makes electrical contact with a lead of a semiconductor package, Support frame 30 fixed to the socket board 40, Silicon rubber 20 supported by the support frame 30, A semiconductor package test socket using a silicon rubber comprising a conductive portion 23 formed at a portion corresponding to the lead 13 of the semiconductor package on the silicon rubber phase 20. The method of claim 1, The support frame 30 is plate-shaped and fixed to the socket board 40 by screws, and the silicon rubber 20 is joined by fitting and fitting it to the support frame 30 by taking a gap 31 therein. Semiconductor package test socket using a silicon rubber, characterized in that. The method according to claim 1 or 2, The conductive part 23 is a semiconductor package test socket using a silicon rubber, characterized in that formed by coupling the Be-Cu plate in a band shape.