JPH08321368A - Ic socket - Google Patents

Abstract

PURPOSE: To allow easy manufacture and ensure an easy slide motion in a state of pressed contact with an IC lead for the improvement of electrical contact by providing a contact pin mounting section detachably and loosely in an IC socket body. CONSTITUTION: A leg 1a engaged and fixed to a socket body 2 and a leg 1b with a spring section are formed on a contact pin 1 used for electrically connecting an IC lead 7a to a conductive pattern 5 formed on a wiring board 4, respectively as integral part of the pin 1. Also, the leg 1a is detachably and loosely engaged to a gap between a socket body inner frame 2a and outer frame 2b, and the leg 1b is fastened to an engagement section C at the inner surface upper corner of the outer frame 2b. When the lead 7a is placed on the contact point A of the pin 1 and an IC package is pressed with a pressing member 8, a contact point B comes in pressed contact with the conductive pattern 5, while sliding thereon, due to the elasticity of the pin 1. Also, the contact points A and B, and the engagement section C respectively act as a point for the application of a force, a support point and a point of application, thereby properly connecting the lead 7a and the pattern 5 to each other electrically.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for connecting an electric component such as an IC package, and more particularly to an IC socket suitable for applying an electric signal of high frequency.

[0002]

2. Description of the Related Art When a high frequency electric signal is used, the inductance resulting from the length of the contact pin affects the test result of the IC package. Need to be short. Therefore, it has been considered to reduce the distance between the lead and the wiring board by using a contact pin having a flat shape as in JP-A-3-37983. However, in the invention of Japanese Patent Laid-Open No. 3-37983, as shown in FIG. 8, the contact pin 1 is fixed to the member 4a provided on the wiring board 4 by press fitting. Alternatively, as shown in FIG. 9, the contact pin 1 is fixed between the IC socket body 2 and the wiring board 4 by three-point support.

[0003]

However, in the case of the device shown in FIG. 8, since the contact pins 1 are attached to the wiring board 4 by press-fitting one by one, the attachment is difficult and the contact pins 1 are broken or damaged. Then, when it has to be replaced, the replacement is difficult. In the case of the device of FIG. 9, when the IC socket body 2 and the wiring board 4 are separated,
Contact pin 1 comes off. Therefore, IC
It is impossible to attach the IC socket body 2 to the wiring board 4 when the socket body 2 and the wiring board 4 are separately manufactured and used. The present invention eliminates such drawbacks, and provides an IC socket in which the contact pin mounting portion is detachably mounted in the IC socket body in a loosely fitted state.

[0004]

In order to solve the above-mentioned problems, a contact pin which is interposed between the IC lead 7a and the conductive pattern 5 and is connected to each other in a pressure contact state by a substantially linear conduction path. In the IC socket having 1, the first foot 1a for fitting and fixing and I
A second leg 1b formed of a spring portion for generating an elastic contact pressure is integrally formed with the lead 7a of the C package 7, and the first leg 1a is removably fitted and fixed to the IC socket body 2. The end portion of the second foot 1b engages with the IC socket body 2. A connector pin 9 for electrically connecting to the conductive pattern 5 is attached to the wiring board 4, and a plug 10 having a surface capable of sliding contact with the contact point B of the contact pin 1 is attached to the connector pin 9. It is characterized in that it is crimped and inserted into and is electrically connected to the conductive pattern 5 through the plug 10.

[0005]

The contact point A between the conductive path portion of the contact pin 1 and the lead 7a, the slidable contact point B with the conductive pattern 5, and the engaging portion C of the second foot 1b are the force point and the fulcrum of the contact pin 1, respectively. , Make the point of action.

[0006]

1 and 2 show a first embodiment of the present invention, in which 1 is a flat contact pin, 2 is a large number of contact pins 1, 1 ... The IC socket main bodies 4 accommodated in parallel are wiring boards for performing the performance test of the IC package by mounting the IC socket main bodies 2. Reference numeral 5 is a conductive pattern provided on the wiring board 4.

The first leg 1a for mounting the contact pin 1, that is, for fitting and fixing, extends upward and is loosely fitted in the space between the inner frame 2a of the socket body and the outer frame 2b, and is screwed or the like. Both end portions of the socket body inner frame 2a and the outer frame 2b are detachably fixed. The spring-like second leg 1b of the contact pin 1 extends obliquely upward in the space inside the outer frame 2b and engages with the engaging portion C at the upper outer corner portion thereof.

FIG. 2 is a plan view of the IC socket body 2 as seen from above. 6 is a bolt, by which the IC socket body 2 is fixed to the wiring board 4.

Next, the operation of this device will be described with reference to FIG. As shown in FIG. 3, when the lead 7a of the IC package 7 is placed on the contact point A of the contact pin 1 and the IC package 7 is pressed downward by the pressing member 8, the second leg, which is the spring portion of the contact pin 1, is pressed. 1b bends upward in a bow shape, and the contact point B at the lower end thereof is the conductive pattern 5
A slight sliding motion is performed on the top to make a pressure contact, and an electrical connection is made from the lead 7a to the conductive pattern 5 via the contact pin 1 by a substantially linear conduction path. At this time, the contact point A between the conductive path portion of the contact pin 1 and the lead 7a, the slidable contact point B with the conductive pattern 5, and the engaging portion C of the second foot 1b are the force point and the fulcrum of the contact pin 1, respectively. , Make the point of action.

FIG. 4 shows a second embodiment of the present invention.
The upper end of the first foot 1a of the mounting portion of the contact pin 1 forms a grommet having a shape like a diamond of a playing card,
The contact pin 1 is swingably attached to the socket body 2 by being fitted into the hole 2c of the IC socket body 2. If the contact pin 1 is broken or damaged during use and needs to be replaced, on the contrary, pull the contact pin 1 out.

5 and 6 show a third embodiment of the present invention,
FIG. 5 is a vertical cross-sectional view of the main part thereof, and FIG. 6 is a perspective view of the connector pin 9 and the plug 10. The connector pin 9 is attached to the wiring board 4 so as to be connected to the conductive pattern 5, and the plug 10 is inserted into the upper hole of the connector pin 9. The contact pin 1 is placed on the upper surface 10a of the plug 10. In this embodiment, since the conductive pattern 5 and the contact pin 1 do not directly rub against each other, there is no fear of damaging the conductive pattern 5.

In the above embodiment, only the IC package having the J-vent type lead has been described. However, the present invention is not limited to this, and the contact portion of the contact pin 1 with the lead 7a and the shape of the pressing member 8 are changed. Thus, for example, an IC package having a gull-wing type lead shown in FIG. 7 or an IC having a straight type lead
It can also be applied to packages.

[0013]

As described above, according to the present invention, since the mounting portion of the contact pin is removably mounted in the IC socket body and is mounted in a loosely fitted state, it is manufactured by a conventional press-fitting method. It is easy to replace the contact pin, and the contact pin is easy to move. Since the contact pin is loosely fitted, the contact pin is easy to move and sliding contact operation is impossible when the IC lead is pressed and contacted. Done without contact pins, or IC
A good wiping effect that destroys the oxide film attached to the leads of the package is good, and therefore good contact is obtained.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a main part of a first embodiment of the present invention.

FIG. 2 is a plan view thereof.

FIG. 3 is an explanatory diagram of its operation.

FIG. 4 is a longitudinal sectional view of a main part of a second embodiment of the present invention.

FIG. 5 is a vertical cross-sectional view of the essential parts of a third embodiment of the present invention.

FIG. 6 is a perspective view of the plug 10 and the connector pin 9.

FIG. 7 is a vertical cross-sectional view of a main part of a fourth embodiment of the present invention.

FIG. 8 is a vertical cross-sectional view showing a conventional device.

FIG. 9 is a vertical cross-sectional view showing another example of the conventional device.

[Explanation of symbols]

 1 Contact Pin 1a First Foot 1b Second Foot 2 IC Socket Body 5 Conductive Pattern 7 IC Package 7a IC Lead 9 Connector Pin 10 Plug

Claims (2)

[Claims] 1. An IC socket having a contact pin which is interposed between an IC lead and a wiring board and which is connected to each other in a pressure contact state by a substantially linear conduction path,
A first foot for fitting and fixing and a second foot made of a spring portion for generating elastic contact pressure are integrally formed from the conduction path portion between the lead of the IC package and the first foot. I
It is detachably fitted and fixed to the C socket body, and the end of the second leg engages with the IC socket body so that the contact point A of the contact pin and the lead can slide and the conductive pattern can slide. An IC socket configured such that the contact point B and the engagement portion C of the second foot form a force point, a fulcrum point, and an action point of the contact pin, respectively. 2. A connector pin for electrically connecting to the conductive pattern is attached to the wiring board, and a plug having a surface capable of sliding contact with a contact point B of the contact pin is crimped to the connector pin. The IC socket according to claim 1, wherein the IC socket has an inserted structure and is electrically connected to the conductive pattern through the plug.