JPH1126125A - Ic socket - Google Patents

Ic socket

Info

Publication number
JPH1126125A
JPH1126125A JP9175979A JP17597997A JPH1126125A JP H1126125 A JPH1126125 A JP H1126125A JP 9175979 A JP9175979 A JP 9175979A JP 17597997 A JP17597997 A JP 17597997A JP H1126125 A JPH1126125 A JP H1126125A
Authority
JP
Japan
Prior art keywords
contact
pad
lead
socket
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9175979A
Other languages
Japanese (ja)
Inventor
Yu Takebe
祐 建部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP9175979A priority Critical patent/JPH1126125A/en
Publication of JPH1126125A publication Critical patent/JPH1126125A/en
Pending legal-status Critical Current

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  • Connecting Device With Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To cope with a high speed signal by shortening an electric conductor length up to a pad of a base board through a contact from an IC lead. SOLUTION: A socket main body 1 is placed on a printed wiring board 6, and after an IC 5 is housed in the socket main body 1, a cover 4 is put on it. When the cover 4 is pushed down in the arrow direction, a lead 5a of the IC 5 contacts with a lead contact part 3a of a contact 3. The contact 3 is going to be pushed down, but since its pad contact part 3b contacts with a pad of the printed wiring board 6, the contact 3 cannot descend. Therefore, the pad contact part 3b is energized in the arrow direction. As a result, since a spring part 3c of the contact 3 is elastically deformed, contact force is generated between the lead 5a and the lead contact part 3a and between the pad contact part 3b and the pad of the printed wiring board 6.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ICソケットにお
ける電気的導体長の短縮に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reduction in the length of an electric conductor in an IC socket.

【0002】[0002]

【従来の技術】従来のICソケットについて図2を参照
して説明する。
2. Description of the Related Art A conventional IC socket will be described with reference to FIG.

【0003】ICソケットは、ソケット本体11と、カ
バー14と、IC15とから構成される。
[0003] The IC socket includes a socket body 11, a cover 14, and an IC 15.

【0004】ソケット本体11のインシュレータ12に
は、弾性変形可能なコンタクト13が組み込まれてい
る。コンタクト13は、IC15のリード15aに接触
するリード接触部13a、プリント配線基板16のパッ
ドに接触するパッド接触部13b、ばね部13c,保持
部13d及びリード接触部13aとパッド接触部13b
との間の一対の短絡部13eから一体の枠形状に構成さ
れている。
[0004] The insulator 12 of the socket body 11 incorporates an elastically deformable contact 13. The contact 13 includes a lead contact portion 13a that contacts the lead 15a of the IC 15, a pad contact portion 13b that contacts a pad of the printed wiring board 16, a spring portion 13c, a holding portion 13d, and the lead contact portion 13a and the pad contact portion 13b.
Are formed into an integral frame shape from a pair of short-circuit portions 13e.

【0005】ソケット本体11をプリント配線基板16
の上に置き、IC15をソケット本体11に収容した後
に、カバー14を被覆する。すると、IC15のリード
15aがコンタクト13のリード接触部13aを押し下
げるから、上方のばね部13cが弾性変形して、一対の
短絡部13eが接触する。
[0005] The socket body 11 is connected to the printed wiring board 16.
After the IC 15 is accommodated in the socket body 11, the cover 14 is covered. Then, since the lead 15a of the IC 15 pushes down the lead contact portion 13a of the contact 13, the upper spring portion 13c is elastically deformed, and the pair of short-circuit portions 13e come into contact.

【0006】[0006]

【発明が解決しようとする課題】従来のICソケットで
は、ICのリードからコンタクトを経てプリント配線基
板のパッドまでの電気的導体長が相当長く、これを短く
するには限界があった。
In the conventional IC socket, the length of the electric conductor from the lead of the IC to the pad of the printed wiring board through the contact is considerably long, and there is a limit in shortening the length.

【0007】そこで、本発明は、高速信号に対応可能と
するために、従来のICソケットの欠点を改良し、IC
のリードからコンタクトを経て基板のパッドまでの電気
的導体長の短縮を図るものである。
Therefore, the present invention improves the disadvantages of the conventional IC socket in order to be able to cope with high-speed signals, and
The length of the electrical conductor from the lead to the pad of the substrate via the contact is reduced.

【0008】[0008]

【課題を解決するための手段】本発明は、前記課題を解
決するため、次の手段を採用する。
The present invention employs the following means to solve the above-mentioned problems.

【0009】(1)インシュレータ及び前記インシュレ
ータに組み込まれた弾性変形可能なコンタクトを有する
ソケット本体と、カバーと、リードを有するICとから
構成され、前記コンタクトが先端に設けられたリード接
触部、基板のパッドに対するパッド接触部、ばね部及び
保持部から連続して一体に形成されているICソケッ
ト。
(1) A socket body having an insulator and an elastically deformable contact incorporated in the insulator, a cover, and an IC having a lead. An IC socket formed continuously and integrally from a pad contact portion, a spring portion, and a holding portion for the pad.

【0010】(2)前記パッド接触部が円弧状に形成さ
れている前記(1)記載のICソケット。
(2) The IC socket according to (1), wherein the pad contact portion is formed in an arc shape.

【0011】[0011]

【発明の実施の形態】本発明の一実施の形態例について
図1を参照して説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG.

【0012】本実施の形態例のICソケットは、ソケッ
ト本体1と、カバー4と、フラットリードタイプのIC
5とから構成される。
The IC socket of the present embodiment comprises a socket body 1, a cover 4, and a flat lead type IC.
And 5.

【0013】ソケット本体1のインシュレータ2には、
弾性変形可能なコンタクト3が組み込まれている。コン
タクト3は、IC5のリード5aに接触するリード接触
部3a、プリント配線基板6のパッドに接触する円弧状
のパッド接触部3b、ばね部3c及び保持部3dから連
続して一体に形成されている。
The insulator 2 of the socket body 1 includes:
An elastically deformable contact 3 is incorporated. The contact 3 is formed continuously and integrally from a lead contact portion 3a that contacts the lead 5a of the IC 5, an arc-shaped pad contact portion 3b that contacts a pad of the printed wiring board 6, a spring portion 3c, and a holding portion 3d. .

【0014】ソケット本体1をプリント配線基板6の上
に置き、IC5をソケット本体1に収容した後に、カバ
ー4を被覆する。カバー4を図1(b)の矢印方向へ押
し下げると、IC5のリード5aは、コンタクト3のリ
ード接触部3aと接触する。コンタクト3は押し下げら
れようとするが、コンタクト3のパッド接触部3bがプ
リント配線基板6のパッドに接触しているため、コンタ
クト3は下がることができない。
The socket body 1 is placed on the printed wiring board 6, and the IC 5 is accommodated in the socket body 1, and then the cover 4 is covered. When the cover 4 is pushed down in the direction of the arrow in FIG. 1B, the leads 5 a of the IC 5 come into contact with the lead contact portions 3 a of the contacts 3. Although the contact 3 tends to be pushed down, the contact 3 cannot be lowered because the pad contact portion 3b of the contact 3 is in contact with the pad of the printed wiring board 6.

【0015】したがって、プリント配線基板6のパッド
に接触するコンタクト3の円弧状のパッド接触部3b
は、図1(b)の矢印方向へ付勢される。この結果、コ
ンタクト3のばね部3cが弾性変形するので、IC5の
リード5aとコンタクト3のリード接触部3aとの間、
及び、コンタクト3の円弧状のパッド接触部3bとプリ
ント配線基板6のパッドとの間に接触力が発生する。
Therefore, the arc-shaped pad contact portion 3b of the contact 3 that contacts the pad of the printed wiring board 6
Is urged in the direction of the arrow in FIG. As a result, the spring portion 3c of the contact 3 is elastically deformed, so that between the lead 5a of the IC 5 and the lead contact portion 3a of the contact 3,
In addition, a contact force is generated between the arc-shaped pad contact portion 3b of the contact 3 and the pad of the printed wiring board 6.

【0016】従来のコンタクト13のパッド接触部13
bが平面状であるのに対し、本実施の形態例におけるコ
ンタクト3のパッド接触部3bを円弧状に形成した理由
は、次のとおりである。すなわち、円弧状は、平面状と
対比して、基板のパッドに接触する面積が狭いから、高
い圧力で確実に接触し、また、基板のパッドに対してス
ムーズに移動することができるためである。
The pad contact portion 13 of the conventional contact 13
The reason why the pad contact portion 3b of the contact 3 in the present embodiment is formed in an arc shape, while b is a planar shape, is as follows. That is, since the arc shape has a smaller area in contact with the substrate pad as compared with the planar shape, it can surely contact with high pressure and can move smoothly with respect to the substrate pad. .

【0017】[0017]

【発明の効果】以上の説明から明らかなように、本発明
によれば、ICのリードと基板のパッドとの間を短い電
気的導体長で接続することができるため、高速信号に対
応することができる。
As is apparent from the above description, according to the present invention, the connection between the lead of the IC and the pad of the substrate can be made with a short electric conductor length, so that the high speed signal can be handled. Can be.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態例のICソケットの諸図
を示し、(a)は分解断面図、(b)は嵌合時の断面
図、(c)はコンタクトの斜視図、(d)はコンタクト
を裏側から見た斜視図である。
FIG. 1 shows various views of an IC socket according to an embodiment of the present invention, wherein (a) is an exploded sectional view, (b) is a sectional view at the time of fitting, (c) is a perspective view of a contact, d) is a perspective view of the contact viewed from the back side.

【図2】従来のICソケットの断面図であり、(a)は
分解断面図、(b)は嵌合時の断面図である。
2A and 2B are cross-sectional views of a conventional IC socket, in which FIG. 2A is an exploded cross-sectional view, and FIG.

【符号の説明】[Explanation of symbols]

1 ソケット本体 2 インシュレータ 3 コンタクト 3a リード接触部 3b パッド接触部 3c ばね部 3d 保持部 4 カバー 5 IC 5a リード 6 プリント配線基板 DESCRIPTION OF SYMBOLS 1 Socket main body 2 Insulator 3 Contact 3a Lead contact part 3b Pad contact part 3c Spring part 3d Holding part 4 Cover 5 IC 5a Lead 6 Printed wiring board

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 インシュレータ及び前記インシュレータ
に組み込まれた弾性変形可能なコンタクトを有するソケ
ット本体と、カバーと、リードを有するICとから構成
され、前記コンタクトが先端に設けられたリード接触
部、基板のパッドに対するパッド接触部、ばね部及び保
持部から連続して一体に形成されていることを特徴とす
るICソケット。
1. A lead contact portion having an insulator, a socket body having an elastically deformable contact incorporated in the insulator, a cover, and an IC having a lead, wherein the contact is provided at a tip end, An IC socket, which is formed continuously and integrally from a pad contact portion for a pad, a spring portion, and a holding portion.
【請求項2】 前記パッド接触部が円弧状に形成されて
いることを特徴とする請求項1記載のICソケット。
2. The IC socket according to claim 1, wherein said pad contact portion is formed in an arc shape.
JP9175979A 1997-07-01 1997-07-01 Ic socket Pending JPH1126125A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9175979A JPH1126125A (en) 1997-07-01 1997-07-01 Ic socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9175979A JPH1126125A (en) 1997-07-01 1997-07-01 Ic socket

Publications (1)

Publication Number Publication Date
JPH1126125A true JPH1126125A (en) 1999-01-29

Family

ID=16005589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9175979A Pending JPH1126125A (en) 1997-07-01 1997-07-01 Ic socket

Country Status (1)

Country Link
JP (1) JPH1126125A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0337983A (en) * 1989-07-04 1991-02-19 Yamaichi Electric Mfg Co Ltd Contact
JPH08321368A (en) * 1996-07-05 1996-12-03 Enplas Corp Ic socket

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0337983A (en) * 1989-07-04 1991-02-19 Yamaichi Electric Mfg Co Ltd Contact
JPH08321368A (en) * 1996-07-05 1996-12-03 Enplas Corp Ic socket

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Effective date: 20020116