JP2548600Y2 - Surface mount connector - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount connector, and more particularly to a surface mount connector (hereinafter, referred to as an SMT connector) having a structure for connection by horizontal driving.

[0002]

2. Description of the Related Art As shown in FIG. 3 showing a longitudinal section and FIG. 4 showing a structure of a socket contact, a conventional surface mount connector has a base housing 62,
An SMT connector 61 including a cover housing 63 and a socket contact 64 is mounted. The socket contact 64 is connected to the pad 64 on the printed board 51 by a lead 64.
a is electrically and mechanically connected by soldering. The LSI 41 is mounted on the SMT connector 61 by passing the pin 42 through a hole 63a provided in the cover housing 63, and the cover 42 is driven in the direction of the arrow in FIG. Is A
The LSI 41 is moved from the position to the position B and is brought into contact with and electrically connected to the contact piece 64c of the socket contact 64, so that the LSI 41 is mounted on the SMT connector 61. The removal of the LSI 41 is realized by driving the cover housing 63 in the direction opposite to the insertion.

[0003]

In this conventional SMT connector, since the socket contact has the lead of the socket contact attached to the pad on the printed board only by soldering, the LSI pin is connected to the socket contact. The drawback that the soldering part is applied by the driving force parallel to the printed board applied to insert and remove the contact piece that has it, and if the number of driving is increased, the solder deteriorates and the solder is broken. was there.

[0004]

The surface mount connector of the present invention has a base housing mounted on a printed board, a lead housed in the base housing and connected by soldering to a pad on the printed board, and a lead of the pad. A plurality of socket contacts having an anchor pin and a contact piece which are arranged in the vicinity and are inserted into a through hole connecting the pad and an inner layer conductor; and pins of an LSI which are arranged and mounted on the upper surface of the base housing And a cover housing provided with a plurality of holes for guiding the LS through the holes in the cover housing by moving the cover housing in parallel with a surface of a printed board.
The pin of I is brought into contact with the contact piece.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a side view, partially in longitudinal section, showing an embodiment of the present invention, and FIG. 2 is a perspective view showing the mounting and fitting of socket contacts.

The surface of the printed board 51 has a pad 52 and an inner layer connection through hole 53 near the pad 52. In the surface mount type printed board as in this embodiment, the pad 52 and the inner layer connection through hole 53 are connected by a short pattern 54, and the signal transmission is performed by the pad 5
2, the pattern 54 and the inner layer connection through hole 53 are connected to an inner layer pattern (not shown) and connected to the other side. The SMT connector 21 includes a base housing 22, a cover housing 23, and a socket contact 24, and has a structure in which a pin 42 of an LSI 41 is inserted into a hole 23a of the cover housing 23.

The socket contact 24 is mounted in a hole provided in the base housing 22, and the lead 24
a, an anchor pin 24b, and a contact piece 24c.
The leads 24a are soldered to the pads 52 on the printed board 51. The anchor pin 24 b is inserted into the inner layer connection through hole 53 on the printed blank 51. Contact piece 24c
Are fitted with the pins 42 of the LSI 41.

Next, driving for fitting the pin 42 and the contact piece 24c will be described.

When the cover housing 23 is driven in the direction shown by the arrow in FIG. 1 in the state shown in FIG. 1, the pin 42 shown in FIG. 2 moves from the position A to the position B, and the contact piece 24c and the pin 42 are fitted. The removal is realized by driving the cover housing 23 in the direction opposite to the insertion.

The driving force applied to the socket contact 24 by the insertion and removal described above is received by the anchor pin 24b inserted in the inner layer connection through hole 53,
The structure is such that no force is applied to the soldered portion between the lead 24a and the pad 52.

[0012]

As described above, according to the present invention, the anchor pin provided on the socket contact is inserted into the interior connection through hole which is paired with the pad near the pad on the printed circuit board, so that the contact piece can be connected to the LSI. The anchor pin receives the driving force for inserting and removing the pin, and the force applied to the soldering part between the lead and the pad can be eliminated, so the solder is inferior even if the number of insertions and removals is increased There is an effect that the destruction of the solder is eliminated without performing.

[Brief description of the drawings]

FIG. 1 is a side view of an embodiment of the present invention.

FIG. 2 is a perspective view showing a fitted state of the socket contact 24 shown in FIG. 1 with a mounting pin 42;

FIG. 3 is a side view of a conventional surface mount connector.

FIG. 4 is a perspective view showing a fitted state of the socket contact 64 shown in FIG. 3 with a mounting pin 42;

[Explanation of symbols]

 21 SMT Connector 22 Base Housing 23 Cover Housing 23a Hole 24 Socket Contact 24a Lead 24b Anchor Pin 24c Contact Piece 41 LSI 42 Pin 51 Printed Board 52 Pad 53 Inner Layer Connection Through Hole 54 Pattern 61 SMT Connector 62 Base Housing 63 Cover Housing 64 Socket Contact 64a Lead 64c Contact piece

Claims (1)

(57) [Scope of request for utility model registration] 1. A base housing mounted on a printed board, a lead housed in the base housing and connected by soldering to a pad on the printed board, and a conductor arranged between the pad and an inner layer disposed near the pad. A cover provided with a plurality of socket contacts having an anchor pin and a contact piece inserted into a through-hole to be connected, and a plurality of holes arranged on the upper surface of the base housing and for guiding pins of an LSI mounted thereon. A housing, and moving the cover housing in parallel with a surface of a printed circuit board, so that the LSI passes through a hole in the cover housing.
A surface mount connector characterized by contacting said pin with said contact piece.