KR19980082806A - Thermoelectric cold element using metal substrate and manufacturing method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric cold / heating device using a metal substrate and a method for manufacturing the same. The present invention relates to an arrangement of N-chips and P-chips, which are cooling chips constituting a module of thermoelectric cooler / heater modules. By using the metal plate with high thermal conductivity instead of the ceramic plate, the two plates serving as substrates can quickly release Joule heat caused by power loss, thereby improving the operation characteristics of the device. Excellent breaking strength, low probability of failure due to mechanical impact, and has a useful effect such as suitable for mass production.

Description

Thermoelectric cold element using metal substrate and manufacturing method thereof

The present invention relates to a thermoelectric cold / heating device using a metal disc, and a method for manufacturing the same. The arrangement of N-chips and P-chips, which are cooling chips constituting a module of thermoelectric cooler / heater modules, is described. The present invention relates to a thermoelectric cold / heating device using a metal substrate and a method of manufacturing the same, which use a metal plate having a high thermal conductivity instead of a ceramic plate to increase the operating efficiency of the electronic cooling device.

Thermoelectric cooler / heater modules are fixed by arranging a certain type of thermally conductive material between ceramic plates in a certain shape.Thermal conductive material is composed of P-type and N-type semiconductor materials. The semiconductor materials are arranged by tens or hundreds.

The thermoelectric cold and hot element as described above has a direct energy conversion function that generates electricity when a current is cooled by applying a feedback signal from a temperature controller and generates electricity. There is no vibration, there is no noise, and the application temperature range is wide. Not only can it be used as a power consumption, but also has the advantages of small size.

The manufacturing process of the thermoelectric cold / heat element using the conventional ceramic substrate is a process of printing the pattern of the shape required on the ceramic plate to be a substrate with a conductive material and then firing and maturing in the kiln, and lead on the pattern surface printed by the above process Uniformly and uniformly soldering process, transfer the conductive piece that will be the passage of current in the form of pattern, soldering and fixing to the printed pattern surface, and completing the substrate, and the two substrates completed by the above process The semiconductor chip is sandwiched between sandwiches to form a thermoelectric element.

However, the problem with the manufacturing method is a labor-intensive manual work, there is a problem that is not even in terms of quality, it is also vulnerable to mass production, resulting in a very large financial loss.

In addition, the biggest problem in the thermoelectric cold and hot element using the ceramic substrate is the problem of processing the heat loss caused by electrical losses. Since the ceramic material used as the substrate material has a thermal conductivity of about 1.5 mA / mh ° C., the loss of heat, which is a basic requirement for the efficient operation of thermoelectric elements, is not rapidly released. Also, due to the mechanical strength of the ceramic, that is, the cracking phenomenon, There have been problems such as many restrictions in mass production.

The present invention was created in order to solve the above problems, relatively heat of less than 100㎛ thickness of 100mm or less that can withstand high pulse voltage on aluminum plate or duralumin plate with thermal conductivity about 100 times that of ceramic. Metal coated with a good conductor and then heat treated in a kiln to be used as a substrate to provide excellent adhesion to semiconductor chips and excellent electrical insulation, enabling efficient heat dissipation of lost heat. It is an object of the present invention to provide a thermoelectric cold element using a substrate and a method of manufacturing the same.

1 is a perspective view of a thermoelectric cold element.

2 is a cross-sectional view taken along the line A-A of FIG.

* Explanation of symbols for main parts of drawings *

1: thermoelectric cold and hot element 2: metal disc

3: semiconductor chip 4: coating part

5: copper foil

Hereinafter, with reference to the accompanying drawings will be described in more detail the method configuration and embodiment of the present invention.

According to the manufacturing process of the present invention, a metal disc such as aluminum or duralumin, which is to be a substrate, is cut to a predetermined dimension, and then a spacer is placed between the cut plates and evenly stacked, and then stacked. A first step of calcining with heat after pressurizing the raised layer; A second step of primary coating an electrical insulating film with an insulating material using a copolymer of a resin having flexibility, high insulation, and high thermal conductivity to cope with thermal expansion of a metal used in the metal plate heat-treated by the above steps; A third step of subjecting the first coated metal plate by the above process to a firing furnace and then secondarily coating an insulating film on a paste; A fourth step of laminating a copper foil by using an adhesive force of the insulating film, compressing the foil with a pressing plate, and then heat-treating it; A fifth step of etching the required pattern on the surface of the copper foil laminated by the fourth step to complete the metal substrate; The N-type semiconductor chip and the P-type semiconductor chip are sandwiched between the two metal substrates completed by the above process, and the lead wires are drawn and bonded to complete the thermoelectric cold / heat element using the metal substrate. 6th process.

The coating method in the second and third processes described above allows the solution of the resin to be slime on the metal plate, followed by centrifugal diffusion by rotating the metal plate.

The present invention having the above-described manufacturing method will be described in more detail with reference to Examples.

EXAMPLE

After cutting the aluminum metal plate with a thermal conductivity of 175㎉ / m²h ° C to 40 × 40mm in a roll state to be a substrate, a spacer is placed between the cut plates and evenly stacked. The stacked layer was pressed at 30 kg / cm 2 or more, and then calcined with heat of 300 to 400 ° C. to obtain a laminated duralumin metal disc.

Subsequently, Ca (heat conductivity of 91 kW / m 2 h ° C.), Na (thermal conductivity of 115 kW / m 2 h ° C.), Mg (thermal conductivity) having heat transferability to epoxy resin resin was laminated on the laminated duralumin metal disc. 137 Pa / m 2 h ℃) by centrifugal diffusion at a speed of 1500 ~ 2000RPM using a resin mixed with 100㎛ the first electrical insulating film was coated.

After heat-treating the first coated metal plate at about 180 to 250 ° C. in a calcination furnace, a resin film on a paste was secondarily coated with an insulating film.

Laminated a copper foil having a thickness of about 100 ~ 300㎛ by using the adhesive strength of the insulating film on the secondary coated metal plate (Laminate) and crimped to 30kg / ㎠ or more using a pressure plate After the heat treatment at a temperature of about 180 ~ 250 ℃.

Subsequently, the patterned metal substrate was completed by etching the laminated copper foil surface.

An N-type semiconductor and a P-type semiconductor chip were sandwiched between two metal substrates completed by the above-described method, and then lead wires were drawn and bonded to form a thermoelectric cold / heat element using the metal substrate.

1 and 2 show a thermoelectric cold element 1 manufactured by the method as described above, wherein the coating part 4 coated on one surface of the metal disc 2 and the copper laminated with the coating part. The semiconductor chip 3 is bonded between two metal substrates made of the foil 5.

Comparing the thermoelectric cold / heat device using the metal substrate of the present invention manufactured as described above and the thermoelectric cold / heat device using a conventional ceramic, in the present invention, by using aluminum or duralumin having a thermal conductivity of about 175 kW / m 2 h ° C. as a substrate material Compared to the case of using a ceramic substrate with a thermal conductivity of 10㎉ / ㎡h ℃, it is not comparable in terms of rapid discharge of Joule heat generated by power loss, and the thermal conductivity as a conductive material is 35㎉ / ㎡h ℃. Compared to the prior art soldered by soldering, the present invention is not compared in terms of operating characteristics of the device by using laminated copper foil having an average thermal conductivity of 100 kW / m 2 h or more as a current path. .

In addition, the present invention has the advantage that the likelihood of breaking even in a large impact by coating with an insulating material using a copolymer of a resin of flexibility and high insulation and high thermal conductivity to cope with thermal expansion of the metal is very small compared to the prior art have.

As described above, the present invention can quickly release Joule heat generated by power loss, thereby improving the operation characteristics of the device, and having excellent flexibility of the substrate, and low probability of breakage due to mechanical impact. There is also a useful effect such as suitable.

Claims (5)

After cutting a metal disc such as rolled aluminum or duralumin to a predetermined dimension, a spacer is placed evenly between the cut plates, and the stacked layer is pressed. A first step of calcining with heat; A second step of primary coating an electrical insulating film with an insulating material using a copolymer of a resin having flexibility, high insulation, and high thermal conductivity to cope with thermal expansion of a metal used in the metal plate heat-treated by the above steps; A third step of subjecting the first coated metal plate by the above process to a firing furnace and then secondarily coating an insulating film on a paste; A fourth step of laminating a copper foil by using an adhesive force of the insulating film, compressing the foil with a pressing plate, and then heat-treating it; A fifth step of etching the required pattern on the copper foil surface laminated by the fourth step to complete the metal substrate; The N-type semiconductor chip and the P-type semiconductor chip are sandwiched between the two metal substrates completed by the above process, and the lead wires are drawn and bonded to complete the thermoelectric cold / heat element using the metal substrate. A method for manufacturing a thermoelectric cold element using a metal substrate, characterized in that it comprises a sixth step. The method according to claim 1, A method of manufacturing a thermoelectric cold / hot element using a metal substrate, wherein a method of applying a centrifugal diffusion by rotating a metal plate after slime of a resin on a metal plate by a first or second coating method is applied. The method according to claim 1, A method of manufacturing a thermoelectric cold / heat element using a metal substrate, wherein the temperature during heat treatment is applied at about 180 to 250 ° C. The method according to claim 1 or 2, Resin to form an insulating film, which has heat transferability to epoxy resin resin (Ca (heat conductivity: 91㎉ / ㎡h ℃), Na (heat conductivity: 115㎉ / ㎡h ℃), Mg (thermal conductivity: 137㎉ /)) A method of manufacturing a thermoelectric cold / hot element using a metal substrate, characterized in that a resin mixed with ㎡h ℃) is used. Thermoelectric cold and hot element using a metal substrate, characterized in that prepared by claim 1 to claim 3.