KR200168479Y1 - Water purifier using peltier device of metal substrate - Google Patents
Water purifier using peltier device of metal substrate Download PDFInfo
- Publication number
- KR200168479Y1 KR200168479Y1 KR2019990018648U KR19990018648U KR200168479Y1 KR 200168479 Y1 KR200168479 Y1 KR 200168479Y1 KR 2019990018648 U KR2019990018648 U KR 2019990018648U KR 19990018648 U KR19990018648 U KR 19990018648U KR 200168479 Y1 KR200168479 Y1 KR 200168479Y1
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- South Korea
- Prior art keywords
- thermoelectric
- heat
- drinking water
- heat pipe
- cold
- Prior art date
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- 239000002184 metal Substances 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 title claims abstract description 16
- 239000003651 drinking water Substances 0.000 claims abstract description 25
- 235000020188 drinking water Nutrition 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 229920001577 copolymer Polymers 0.000 claims abstract description 4
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- 238000001354 calcination Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 239000000498 cooling water Substances 0.000 abstract description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 238000010304 firing Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005524 ceramic coating Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
- B01D35/18—Heating or cooling the filters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/002—Liquid coolers, e.g. beverage cooler
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Water Treatment By Sorption (AREA)
Abstract
본 고안은 금속기판의 열전냉온소자를 이용한 정수기에 관한 것으로서, 필터를 거친 물을 금속기판의 열전소자를 방냉판을 거쳐 냉각하는 구조로 소음을 줄이고 부가적인 냉각시스템 최소화한 열전냉온소자를 이용한 정수기를 얻기 위한 것인 바,The present invention relates to a water purifier using a thermoelectric cold / hot element of a metal substrate, and a water purifier using a thermoelectric cold / hot element that minimizes noise and minimizes an additional cooling system by cooling water that has passed through the filter through a cooling plate. To obtain
내장히트파이프에서 흡수한 식수의 잠열을 전도시키는 제1열전소자와, 상기 제1열전소자에 의해 전도된 식수의 잠열을 흡수하는 제1전도부와, 상기 제1전도부에서 흡수한 식수의 잠열을 외장히트파이프의 하부를 감싸고 있는 제2전도부를 통해 상기 외장히트파이프로 전도시키는 제2 및 제3열전소자와, 상기 제2 및 제3열전소자의 냉각 및 방열측 온도에 따라 상기 제2 및 제3열전소자의 열전도방향을 역방향으로 전환시키는 제어회로부에 있어서, 상기 열전냉온소자는 열팽창에 대응할 수 있는 유연성과 높은 절연성 및 열전도율이 높은 수지의 공중합체를 이용한 절연물질로 전기적인 절연막으로 1차코팅된 금속판을 소성로에서 열처리한 후, 페이스트 (Paste)상의 절연막을 2차코팅하고, 상기 절연막의 접착력을 이용하여 동(銅) 호일면에 필요한 패턴을 에칭(Etching)하여 금속기판과, 상기의 두 금속판 사이에 N-형 반도체칩과, P-형 반도체칩을 샌드위치형으로 배열한 구조의 열전냉온소자을 장착함으로써, 냉각효율의 극대화와 금속기판의 두께를 높이므로 견고성과 전도성이 매우 뛰어난 특징이 있다.A first thermoelectric element for conducting latent heat of drinking water absorbed by the internal heat pipe, a first conductive part for absorbing the latent heat of drinking water conducted by the first thermoelectric element, and a latent heat of drinking water absorbed by the first conductive part Second and third thermoelectric elements that conduct the external heat pipes through the second conductive part surrounding the lower portion of the heat pipe, and the second and third thermoelectric elements according to cooling and heat dissipation side temperatures of the second and third thermoelectric elements. In the control circuit unit for converting the direction of the thermal conductivity of the thermoelectric element in the reverse direction, the thermoelectric cold and warm element is an insulating material using a copolymer of a resin of flexibility, high insulation and high thermal conductivity resin to cope with thermal expansion is first coated with an electrical insulating film After heat-treating the metal plate in the firing furnace, the secondary insulating film of the paste is coated, and the necessary pattern on the copper foil surface is obtained by using the adhesive force of the insulating film. Etching maximizes the cooling efficiency and the thickness of the metal substrate by attaching a N-type semiconductor chip and a P-type semiconductor chip in a sandwich arrangement between the metal substrate and the two metal plates. Since it increases the robustness and conductivity is very excellent.
Description
본 고안은 금속기판의 열전냉온소자를 이용한 정수기에 관한 것으로서, 더욱 상세하게는 필터를 거친 물을 금속기판의 열전소자를 방냉판 거쳐 냉각하는 구조로 소음을 줄이고 부가적인 냉각시스템 최소화한 열전냉온소자를 이용한 정수기에 관한 것이다.The present invention relates to a water purifier using a thermoelectric cold / hot element of a metal substrate, and more particularly, a thermoelectric cold / hot element which reduces noise and minimizes an additional cooling system by cooling water that has passed through a filter through a cold plate of a thermoelectric element of a metal substrate. It relates to a water purifier using.
종래의 특허공개번호 제 98-10272 호의 냉수기는 식수의 잠열을 흡수하는 내장히트파이프와, 상기 내장히트파이프에서 전도된 식수의 잠열을 외부로 방출하는 외장히트파이프를 구비한 냉수기에 있어서, 상기 내장히트파이프에서 흡수한 식수의 잠열을 전도시키는 제1열전소자와, 상기 제1열전소자에 의해 전도된 식수의 잠열을 흡수하는 제1전도부와 상기 제1전도부에서 흡수한 식수의 잠열을 외장히트파이프의 하부를 감싸고 있는 제2전도부를 통해 상기 외장히트파이프로 전도시키는 제2 및 제3열전소자와, 상기 제2 및 제3열전소자의 냉각 및 방열측 온도에 따라 상기 제2 및 제3열전소자의 열전도방향을 역방향으로 전환시키는 제어회로부를 사용하고 있었다.In the conventional cold water apparatus of Korean Patent Publication No. 98-10272, the cold water machine includes a built-in heat pipe that absorbs latent heat of drinking water and an external heat pipe that discharges the latent heat of drinking water conducted by the built-in heat pipe to the outside. The outer heat pipe includes a first thermoelectric element that conducts latent heat of drinking water absorbed by the heat pipe, a first conductive part that absorbs latent heat of drinking water conducted by the first thermoelectric element, and a latent heat of drinking water absorbed by the first conductive part. Second and third thermoelectric elements which conduct the external heat pipes through the second conductive part surrounding the lower portion of the second and third thermoelectric elements, and the second and third thermoelectric elements according to cooling and heat dissipation side temperatures of the second and third thermoelectric elements. The control circuit section for switching the direction of heat conduction to the reverse direction was used.
그러나, 상기와 같은 종래의 냉수기에 사용되는 열전소자는 열전소자의 방열면의 발열온도의 억제능력에 따라 냉각능력이 결정되는 요소를 결정하는 데 기존의 세락믹판은 온도가 아니라 칩 자체의 문제로 열(熱)의 양도체(良導體)를 모듈에 사용하지 못한 문제점이 있었다.However, the thermoelectric element used in the conventional cold water as described above determines the element whose cooling capacity is determined according to the ability of suppressing the heat generation temperature of the heat dissipation surface of the thermoelectric element. There was a problem that a heat transfer conductor was not used in a module.
또 다른 문제점은 세라믹판에 2매 사이에 칩을 사용하여 칩에서 발열되는 열을 순간적으로 방열하지 못하여 냉장고의 효율을 떨어뜨리는 문제점이 있었다.Another problem is that a chip is used between two sheets on a ceramic plate so that heat generated from the chip cannot be instantaneously radiated, thereby reducing the efficiency of the refrigerator.
더욱 중요한 문제점은 두께가 얇은 세라믹판으로 조립하였으므로 충격에 매우 약한 기계적 강도가 떨어지는 문제점과, 종래의 열전소자는 기판의 유연성과 소자의 기판에 약간의 압력차로 인하여 기판이 균열이 발생되는 문제점이 있었다.More importantly, since the assembly is made of a thin ceramic plate, the mechanical strength, which is very weak against impact, drops, and the conventional thermoelectric device has a problem in that the substrate is cracked due to the flexibility of the substrate and a slight pressure difference in the substrate of the device. .
열전소자의 하트표면의 발열온도의 억제능력에 따라 냉각능력이 결정되는 요소를 결정하는 데 기존의 세라믹판의 온도가 아니라 칩 자체의 문제로 열(熱)의 양도체(良導體) 모듈을 사용하지 못한 문제점이 있었다.In order to determine the factor that determines the cooling capacity according to the ability of suppressing the heat generation temperature of the heart surface of the thermoelectric element, the heat transfer module is not used because of the problem of the chip itself, not the temperature of the conventional ceramic plate. There was a problem.
이에 본 고안은 상기와 같은 문제점을 해결하기 위해 안출된 것으로, 정수기의 열효율을 극대화시키고 발열부와 냉각부에 사용되는 열전소자를 금속기판의 열전냉온소자를 이용하여 장착하여 냉각효율을 극대화한 정수기를 제공하는 데 있다.Therefore, the present invention was devised to solve the above problems. The water purifier maximized the thermal efficiency of the water purifier, and the thermoelectric element used for the heat generating part and the cooling part is mounted by using the thermoelectric cold / heat element of the metal substrate to maximize the cooling efficiency. To provide.
상기와 같은 목적을 달성하기 위하여, 본 고안은 다수의 고성능 필터부와 내장히트파이프에서 흡수한 식수의 잠열을 전도시키는 제1열전소자와, 상기 제1열전소자에 의해 전도된 식수의 잠열을 흡수하는 제1전도부와, 상기 제1전도부에서 흡수한 식수의 잠열을 외장히트파이프의 하부를 감싸고 있는 제2전도부를 통해 상기 외장히트파이프로 전도시키는 제2 및 제3열전소자와, 상기 제2 및 제3열전소자의 냉각 및 방열측 온도에 따라 상기 제2 및 제3열전소자의 열전도방향을 역방향으로 전환시키는 제어회로부에 있어서, 상기 열전소자는 열팽창에 대응할 수 있는 유연성과 높은 절연성 및 열전도율이 높은 수지의 공중합체를 이용한 절연물질로 전기적인 절연막으로 1차코팅된 금속판을 소성로에서 열처리한 후, 페이스트(Paste)상의 절연막을 2차코팅하고, 상기 절연막의 접착력을 이용하여 동(銅) 호일면에 필요한 패턴을 에칭(Etching)하여 금속기판과, 상기의 두 금속판 사이에 N-형 반도체칩과, P-형 반도체칩을 샌드위치형으로 배열한 구조의 열전냉온소자를 장착한 특징이 있다.In order to achieve the above object, the present invention absorbs a first thermoelectric element that conducts latent heat of drinking water absorbed by a plurality of high performance filter units and a built-in heat pipe, and absorbs the latent heat of drinking water conducted by the first thermoelectric element. Second and third thermoelectric elements for conducting the first heat conduction portion and latent heat of drinking water absorbed by the first conduction portion to the external heat pipe through the second electric conduction portion surrounding the lower portion of the external heat pipe; In the control circuit unit for switching the heat conduction direction of the second and third thermoelectric elements in the reverse direction according to the temperature of the cooling and heat dissipation side of the third thermoelectric element, the thermoelectric element has high flexibility and high insulation and high thermal conductivity to cope with thermal expansion. After heat-treating the metal plate primary coated with an electrical insulating film with an insulating material using a copolymer of resin in a calcination furnace, and then the secondary insulating film of the paste Etching the necessary pattern on the copper foil surface by using the adhesive force of the insulating film to arrange a N-type semiconductor chip and a P-type semiconductor chip between the metal substrate and the two metal plates in a sandwich form. It is equipped with a thermoelectric cold / heat element of one structure.
도 1은 본 고안의 바람직한 실시예의 금속기판의 열전냉온소자를 이용한 정수기를 도시한 단면도,1 is a cross-sectional view showing a water purifier using a thermoelectric cold element of a metal substrate of a preferred embodiment of the present invention,
도 2는 도 1의 열전냉온소자를 도시한 분해상태도,FIG. 2 is an exploded state diagram showing the thermoelectric cold element of FIG. 1;
도 3은 본 고안의 열전냉온소자를 제어하는 제어회로부를 도시한 블록도이다.3 is a block diagram showing a control circuit unit for controlling a thermoelectric cold / hot element of the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
A' : 열전냉온소자 A-1 : 제1열전냉온소자A ': thermoelectric cold element A-1: first thermoelectric element
A-2 : 제2열전냉온소자 A-3 : 제3열전냉온소자A-2: 2nd thermoelectric cold element A-3: 3rd thermoelectric cold element
A1 : 방냉부 A2 : 방열부A1: Cooling part A2: Radiating part
A3 : N-형 반도체칩 A6 : 전선부A3: N-type semiconductor chip A6: wire part
A4 : P-형 반도체칩 A5 : 전열막A4: P-type semiconductor chip A5: heat transfer film
10 : 단열케이스 20 : 세라믹코팅층10: heat insulation case 20: ceramic coating layer
30 : 수입구 40 : 수출구30: import port 40: export port
50 : 내장히트파이프 60 : 방열핀50: built-in heat pipe 60: heat radiation fin
80 : 외장히트파이프 90, 100 : 전도부80: external heat pipe 90, 100: conduction unit
110 : 제1열전냉온소자 120 : 제2열전냉온소자110: first thermoelectric cold element 120: second thermoelectric cold element
130 : 제3열전냉온소자 140 : 온도검출부130: third thermoelectric cold element 140: temperature detector
150 : 제1정류부 160 : 제2정류부150: first rectifier 160: second rectifier
170 : 제어부170: control unit
이하, 본 고안의 바람직한 일실시예 금속기판의 열전냉온소자를 이용한 정수기를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, a water purifier using a thermoelectric cold element of a preferred embodiment of the present invention will be described in detail.
도 1은 본 고안의 바람직한 실시예의 금속기판의 열전냉온소자를 이용한 냉정수기를 도시한 단면도이고, 도 2는 도 1의 열전냉온소자를 도시한 분해상태도이고, 도 3은 본 고안의 열전냉온소자를 제어하는 제어회로부를 도시한 블록도이다.1 is a cross-sectional view showing a cold water purifier using a thermoelectric cold element of the metal substrate of a preferred embodiment of the present invention, Figure 2 is an exploded state diagram showing the thermoelectric cold element of Figure 1, Figure 3 is a thermoelectric cold element of the present invention Is a block diagram showing a control circuit unit for controlling the control circuit.
도 1내지 도3에 도시한 본 고안의 금속기판의 열전냉온소자를 이용한 정수기는 다수의 고성능 필터부와, 내장히트파이프(50)에서 흡수한 식수의 잠열을 전도시키는 제1열전소자와, 상기 제1열전소자(110)에 의해 전도된 식수의 잠열을 흡수하는 제1전도부와, 상기 제1전도부에서 흡수한 식수의 잠열을 외장히트파이프의 하부를 감싸고 있는 제2전도부를 통해 상기 외장히트파이프로 전도시키는 제2 및 제3열전소자와, 상기 제2 및 제3열전소자(120,130)의 냉각 및 방열측 온도에 따라 상기 제2 및 제3열전소자(120,130)의 열전도방향을 역방향으로 전환시키는 제어회로부 (170)에 있어서, 상기 열전냉온소자(A)는 열팽창에 대응할 수 있는 유연성과 높은 절연성 및 열전도율이 높은 수지의 공중합체를 이용한 절연물질로 전기적인 절연막으로 1차코팅된 금속판을 소성로에서 열처리한 후, 페이스트(Paste)상의 절연막을 2차코팅하고, 상기 절연막의 접착력을 이용하여 동(銅) 호일면에 필요한 패턴을 에칭(Etching)하여 금속기판(A-1,A-2)과, 상기의 두 금속판 사이에 N-형 반도체칩(A-3)과, P-형 반도체칩(A-4)을 샌드위치형으로 배열한 구조의 열전냉온소자(A)를 포함하여 구성된다.The water purifier using the thermoelectric cold / heat element of the metal substrate of the present invention shown in Figs. 1 to 3 includes a plurality of high-performance filter units, a first thermoelectric element conducting latent heat of drinking water absorbed by the internal heat pipe 50, and The external heat pipe through the first conductive part absorbing the latent heat of the drinking water conducted by the first thermal element 110 and the second conductive part surrounding the lower portion of the external heat pipe for the latent heat of the drinking water absorbed by the first conductive part. The second and third thermoelectric elements to be conducted in the reverse direction, and the heat conduction direction of the second and third thermoelectric elements (120, 130) to reverse the direction according to the cooling and heat dissipation side temperature of the second and third thermoelectric elements (120, 130) In the control circuit unit 170, the thermoelectric cold / heating element (A) is an insulating material using a copolymer of a resin that is flexible and has high insulation and high thermal conductivity to cope with thermal expansion. After the heat treatment in the furnace, the secondary insulating film of the paste (Paste), and the necessary pattern on the surface of the copper foil using the adhesive strength of the insulating film to etch the metal substrate (A-1, A-2) ) And a thermoelectric cold / heat element (A) having a structure in which an N-type semiconductor chip (A-3) and a P-type semiconductor chip (A-4) are sandwiched between the two metal plates. .
상기의 고성능 필터부는 종래에 사용되는 정수기의 필터이므로 필터를 거친 정화된 물의 공급부터 도시하였다.Since the high performance filter unit is a filter of a water purifier used in the related art, the filter has been shown from the supply of purified water passed through the filter.
먼저, 냉수기의 단열케이스(10)의 내외측에 각각 장착되어 있는 내장히트파이프(50)와 외장히트파이프(80) 사이에 다수개의 열전냉온소자(A)가 캐스케이드 (Cascade) 방식으로 결합·장착되어 있는데, 냉각부로 사용되는 제1열전냉온소자 (A-1)가 내장히트파이프(50)와 제1전도부(90)사이에 장착되어 있으며, 방열부로 사용되는 제2 및 제3열전냉온소자(A-2,A-3)가 상기 제1전도부(90)와 외장히트파이프 (80)의 하부를 감싸고 있는 제2전도부(100)사이에 장착되어 있다.First, a plurality of thermoelectric cold / heat elements A are coupled and cascaded between the internal heat pipe 50 and the external heat pipe 80 mounted on the inner and outer sides of the heat insulating case 10 of the cold water machine. The first thermoelectric cold / heat element A-1, which is used as a cooling unit, is mounted between the built-in heat pipe 50 and the first conductive unit 90, and the second and third thermoelectric cold / temperature elements used as a heat dissipation unit. A-2 and A-3 are mounted between the first conductive portion 90 and the second conductive portion 100 surrounding the lower portion of the outer heat pipe 80.
한편, 상기 제1 내지 제3열전냉온소자(A-1,A-2,A-3)에는 이 열전냉온소자에 전원을 공급할 뿐만 아니라 열전냉온소자의 동작을 제어하는 제어회로부가 결합되어 있는데, 상기 제어회로부는 도 3에 도시된 바와 같이 상용전원을 정류하여 상기 열전소자(A-1,A-2,A-3)로 공급하는 정류회로부(150, 160)와, 상기 정류회로부(150, 160)에서 공급된 전원에 의해 구동되는 열전냉온소자(A-1,A-2,A-3)의 냉각 및 방열측 온도를 검출하는 온도검출부(140)와, 상기 온도검출부(140)의 출력신호에 따라 상기 제2 및 제3열전냉온소자(A-2,A-3)로 인가되는 전원의 극성을 전환하여 열전도방향을 역방향으로 전환시키는 제어부(170)로 구성되어 있다.On the other hand, the first to third thermoelectric cold elements (A-1, A-2, A-3) is coupled to a control circuit unit for controlling the operation of the thermoelectric elements, as well as supplying power to the thermoelectric elements. As shown in FIG. 3, the control circuit unit rectifies commercial power and supplies the rectifier circuits 150 and 160 to the thermoelectric elements A-1, A-2, and A-3, and the rectifier circuits 150, The temperature detector 140 detects the cooling and heat dissipation side temperatures of the thermoelectric cold elements A-1, A-2, and A-3 driven by the power supplied from the 160 and the output of the temperature detector 140. The controller 170 is configured to switch the polarity of the power applied to the second and third thermoelectric cold / hot elements A-2 and A-3 according to the signal to reverse the heat conduction direction.
상기와 같이 구성된 본 고안은, 수입구(30)를 통해 단열케이스(10)의 내측으로 식수가 공급되면 냉각핀을 통해 내장히트파이프(50)가 식수의 잠열을 흡수하게 된다. 이에 따라, 냉각부로 사용되는 제1열전소자(A-1)가 내장히트파이프(50)에서 흡수한 식수의 잠열을 제1전도부(90)로 전도시킨다.According to the present invention configured as described above, when drinking water is supplied into the heat insulation case 10 through the import port 30, the internal heat pipe 50 absorbs the latent heat of the drinking water through the cooling fins. Accordingly, the latent heat of drinking water absorbed by the built-in heat pipe 50 by the first thermal element A-1 used as the cooling unit is conducted to the first conductive unit 90.
한편, 제2 및 제3열전냉온소자(A-2,A-3)는 제1전도부(90)로 전도된 식수의 잠열을 제2전도부(100)을 통해 외장히트파이프(80)로 전도시킨다. 따라서, 외장히트파이프(80)는 전도된 식수의 잠열을 방열핀(60)을 통해 외부로 방출하여 식수를 냉각시키게 된다.Meanwhile, the second and third thermoelectric cooler elements A-2 and A-3 conduct latent heat of drinking water conducted to the first conductive portion 90 to the external heat pipe 80 through the second conductive portion 100. . Accordingly, the external heat pipe 80 cools the drinking water by discharging the latent heat of the conductive drinking water to the outside through the heat dissipation fin 60.
상기와 같이 동작중에 온도검출부(140)에서 검출된 제2 및 제3열전냉온소자 (120, 130)의 방열측 온도가 기준온도, 예를 들어 25℃ 이상으로 상승하게 되면 방열핀(60)에서의 열교환이 원활하게 이루어지지 않음에 따라 제어부(170)는 제2 및 제3열전냉온소자(A-2,A-3)로 인가되는 전원의 극성을 전환하기 위한 제어신호를 정류회로부(160)로 인가하게 된다.When the heat radiation side temperature of the second and third thermoelectric cold elements 120 and 130 detected by the temperature detector 140 during operation as described above rises to a reference temperature, for example, 25 ° C. or more, As the heat exchange is not performed smoothly, the controller 170 transmits a control signal for switching the polarity of the power applied to the second and third thermoelectric cold elements A-2 and A-3 to the rectifier circuit unit 160. Will be authorized.
이에 따라, 정류회로부(160)가 극성이 뒤바뀐 전원을 제2 및 제3열전냉온소자(120, 130)로 인가함에 따라 제2 및 제3열전냉온소자(A-2,A-3)의 열전도방향이 역방향으로 전환된다. 즉, 제1전도부(90)의 열을 흡수하여 외장히트파이프(80)로 전도시키는 방열부로 사용되는 제2 및 제3열전냉온소자(A-2,A-3)는 외장히트파이프 (80)의 열을 흡수하여 제1전도부(90)로 전도시키는 냉각부로 기능이 전환된다.Accordingly, as the rectifier circuit 160 applies power having reversed polarity to the second and third thermoelectric cold / heat elements 120 and 130, the thermal conduction of the second and third thermoelectric cold / heat elements A-2 and A-3. The direction is reversed. That is, the second and third thermoelectric cold / heat elements A-2 and A-3 used as the heat dissipation part absorbing heat from the first conductive part 90 and conducting the conductive heat pipe 80 to the external heat pipe 80 are the external heat pipe 80. The function is switched to a cooling unit that absorbs heat and conducts it to the first conductive unit 90.
상기와 같이 제2 및 제3열전냉온소자가 냉각부로 기능전환되면 외장히트파이프(80)의 열을 흡수하여 제1전도부(90)로 전도함에 따라 온도는 강하된다.As described above, when the second and third thermoelectric cold / heat elements are switched to the cooling unit, the temperature is lowered by absorbing heat from the external heat pipe 80 and conducting the heat to the first conductive unit 90.
한편, 상기와 같이 외장히트파이프(80)의 온도가 강하되어 외장히트파이프 (80)의 온도가 25℃ 이하로 강하되면, 제어부(170)는 제2 및 제3열전냉온소자(A-2,A-3)로 인가되는 전원의 극성을 전환하기 위한 제어신호를 정류회로부(160)로 출력한다.On the other hand, as described above, when the temperature of the external heat pipe 80 is lowered and the temperature of the external heat pipe 80 drops to 25 ° C. or less, the controller 170 controls the second and third thermoelectric cold / heat elements A-2, A control signal for switching the polarity of the power applied to A-3) is output to the rectifier circuit unit 160.
이에 따라, 정류회로부(160)가 극성이 뒤바뀐 전원을 제2 및 제3열전냉온소자(120, 130)로 인가함에 제2 및 제3열전냉온소자(A-2,A-3)의 열전도방향이 역방향으로 전환되어 제1전도부(90)의 열을 외장히트파이프(80)를 통해 외부로 방출하게 된다.Accordingly, the rectifying circuit 160 applies the reversed power to the second and third thermoelectric elements 120 and 130 so that the second and third thermoelectric elements A-2 and A-3 are in thermal conduction directions. In this reverse direction, the heat of the first conductive portion 90 is discharged to the outside through the external heat pipe 80.
상기와 같이 본 고안은, 방냉부의 금속판의 두께를 높일 수 있으므로 내장히트파이프의 온도를 급격히 낮출 수 있으므로 외장히트파이프 사이에 냉각부로 사용되는 서로 겹착방식으로 방열부로 사용되는 열전냉온소자를 냉각부로 기능전환함에 따라 냉수기의 냉각효율을 극대화시킬 뿐만 아니라, 온도변환에 따른 소자의 손상이 없어 기능이 저하되지 않은 효과가 있으므로 정수기산업상 매우 유용한 고안인 것이다.As described above, the present invention can increase the thickness of the metal plate of the cooling part, so that the temperature of the built-in heat pipe can be drastically lowered, so that the thermoelectric cold / war element used as the heat dissipation part as a cooling part is used as a cooling part between the external heat pipes. In addition to maximizing the cooling efficiency of the water cooler as well as switching, there is no damage to the device due to the temperature conversion function has the effect that does not degrade is a very useful design in the water purifier industry.
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KR2019990018648U KR200168479Y1 (en) | 1999-09-03 | 1999-09-03 | Water purifier using peltier device of metal substrate |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030024532A (en) * | 2001-09-18 | 2003-03-26 | 박대흠 | Cold and hot water heater for water purifier |
KR100890602B1 (en) * | 2007-03-19 | 2009-03-25 | 최병규 | Heat exchanging module using an electronic heat exchanging device and a water purifier using the module |
KR20220166669A (en) | 2021-06-10 | 2022-12-19 | 코웨이 주식회사 | Apparatus for making cold water and water purifier including the same |
-
1999
- 1999-09-03 KR KR2019990018648U patent/KR200168479Y1/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030024532A (en) * | 2001-09-18 | 2003-03-26 | 박대흠 | Cold and hot water heater for water purifier |
KR100890602B1 (en) * | 2007-03-19 | 2009-03-25 | 최병규 | Heat exchanging module using an electronic heat exchanging device and a water purifier using the module |
KR20220166669A (en) | 2021-06-10 | 2022-12-19 | 코웨이 주식회사 | Apparatus for making cold water and water purifier including the same |
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