JP3188070B2 - Thermoelectric generation module - Google Patents
Thermoelectric generation moduleInfo
- Publication number
- JP3188070B2 JP3188070B2 JP25175293A JP25175293A JP3188070B2 JP 3188070 B2 JP3188070 B2 JP 3188070B2 JP 25175293 A JP25175293 A JP 25175293A JP 25175293 A JP25175293 A JP 25175293A JP 3188070 B2 JP3188070 B2 JP 3188070B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric
- thermoelectric semiconductor
- generation module
- type
- power generation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 claims description 50
- 238000010248 power generation Methods 0.000 claims description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 15
- 150000004703 alkoxides Chemical class 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Hybrid Cells (AREA)
- Compositions Of Oxide Ceramics (AREA)
Description
【0001】[0001]
【産業上の利用分野】この発明は、熱を直接電気に変化
する熱電発電モジュールに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric generation module for converting heat directly into electricity.
【0002】[0002]
【従来の技術】従来、熱電発電モジュールとしては、図
3に示すものが知られている。この熱電発電モジュール
は、セラミック製等の絶縁性の集熱板1、電極2、p型
・n型の熱電半導体3、接着層4、放熱板5及び定電圧
装置6からなる。ここで、前記熱電半導体3及び電極2
により熱電半導体素子が構成される。こうした構成の熱
電発電モジュールにおいて、高温熱源7から低温熱源8
へ熱流9が流れるとき、p型熱電半導体では高温側から
低温側へ正の電荷を持つ正孔が拡散し、n型熱電半導体
では負の電荷を持つ電子が拡散する。そのため、p型・
n型の熱電半導体3を対にして連結することにより、電
力出力が発生し定電圧装置を通じて定電力装置を通じて
電力10を取り出すことができる。2. Description of the Related Art Conventionally, a thermoelectric power generation module shown in FIG. 3 is known. The thermoelectric power generation module includes an insulating heat collecting plate 1 made of ceramic or the like, electrodes 2, a p-type / n-type thermoelectric semiconductor 3, an adhesive layer 4, a heat radiating plate 5, and a constant voltage device 6. Here, the thermoelectric semiconductor 3 and the electrode 2
Constitutes a thermoelectric semiconductor element. In the thermoelectric generation module having such a configuration, the high-temperature heat source 7
When the heat flow 9 flows, positively-charged holes diffuse from the high-temperature side to low-temperature side in the p-type thermoelectric semiconductor, and negatively-charged electrons diffuse in the n-type thermoelectric semiconductor. Therefore, p-type
By connecting the n-type thermoelectric semiconductors 3 in pairs, a power output is generated, and the power 10 can be taken out through the constant power device through the constant voltage device.
【0003】[0003]
【発明が解決しようとする課題】ところで、従来の熱電
発電モジュールにおいては、高温部の電極部分では熱に
より、雰囲気の気圧が宇宙空間のように低い圧力では、
熱電半導体3は成分が蒸発し、熱電半導体3の性能(発
電出力)が低下する問題がある。By the way, in the conventional thermoelectric power generation module, when the pressure of the atmosphere is low as in outer space due to heat at the electrode part of the high temperature part,
The thermoelectric semiconductor 3 has a problem in that the components evaporate and the performance (power generation output) of the thermoelectric semiconductor 3 is reduced.
【0004】これを防ぐために、溶融シリカガラスをコ
ーティングしている。しかし、溶融シリカガラスの軟化
点は800℃以上であり、1000℃で使用する熱電半
導体では、成分が蒸発し、性能が劣化する問題があっ
た。[0004] To prevent this, a fused silica glass is coated. However, the softening point of the fused silica glass is 800 ° C. or higher, and the thermoelectric semiconductor used at 1000 ° C. has a problem that the components evaporate and the performance deteriorates.
【0005】この発明はこうした事情を考慮してなされ
たもので、アルミナアルコキシドをコーティングし、ア
ルミナ層を熱電半導体表面に形成させることにより、熱
電半導体の材料成分の蒸発を防ぐことができる熱電発電
モジュールを提供することを目的とする。The present invention has been made in view of such circumstances, and a thermoelectric power generation module capable of preventing evaporation of material components of a thermoelectric semiconductor by coating an alumina alkoxide and forming an alumina layer on the surface of the thermoelectric semiconductor. The purpose is to provide.
【0006】[0006]
【課題を解決するための手段】この発明は、高温の熱か
ら直接電気を取り出す熱電発電モジュールにおいて、側
面にアルミナアルコキシドをコーティングしたp型・n
型の熱電半導体及びこの熱電半導体の両側に接着層を介
して電極を有した熱電半導体素子と、この熱電半導体素
子の一端側に設けられた集熱板と、前記熱電半導体素子
の他端側に設けられた放熱板と、前記熱電半導体素子の
電極に電気的に接続された定電圧装置とを具備すること
を特徴とする熱電発電モジュールである。SUMMARY OF THE INVENTION The present invention is directed to a thermoelectric power generation module for extracting electricity directly from high-temperature heat.
Type thermoelectric semiconductor and a thermoelectric semiconductor element having electrodes on both sides of the thermoelectric semiconductor via an adhesive layer, a heat collecting plate provided at one end of the thermoelectric semiconductor element, and a thermoelectric semiconductor element at the other end of the thermoelectric semiconductor element. A thermoelectric power generation module comprising: a heat sink provided; and a constant voltage device electrically connected to an electrode of the thermoelectric semiconductor element.
【0007】[0007]
【作用】この発明においては、p型・n型の熱電半導体
の側面にアルミナアルコキシドをコーティングすること
により、熱電半導体の材料成分の蒸発を防ぐことができ
る。In the present invention, the evaporation of the material components of the thermoelectric semiconductor can be prevented by coating the side surfaces of the p-type / n-type thermoelectric semiconductor with alumina alkoxide.
【0008】[0008]
【実施例】以下、この発明の一実施例を図面を参照して
説明する。 (実施例1)図1を参照する。図中の符号21は、複数の
p型あるいはn型の熱電半導体である。これらの熱電半
導体21の側面には、アルミナアルコキシド(アルミナ
層)22がコーティングされている。前記各熱電半導体21
の高温熱源側には、接着層23を介して電極24が隣り合う
p型の熱電半導体とn型の熱電半導体とを対にして複数
個設けられている。これらの電極24には、セラミック製
等の絶縁性の集熱板25が接続されている。前記熱電半導
体21の低温熱源側には、接着層23を介して電極26が任意
のp型の熱電半導体,n型の熱電半導体,及び所定のp
型の熱電半導体とn型の熱電半導体とを対にして複数個
設けられている。これらの電極26には、放熱板27が接続
されている。前記電極26の内、任意のp型の熱電半導体
21とn型の熱電半導体21には定電圧装置28が接続されて
いる。An embodiment of the present invention will be described below with reference to the drawings. Embodiment 1 Referring to FIG. Reference numeral 21 in the figure denotes a plurality of p-type or n-type thermoelectric semiconductors. The side surfaces of these thermoelectric semiconductors 21 are coated with alumina alkoxide (alumina layer) 22. Each thermoelectric semiconductor 21
On the high-temperature heat source side, a plurality of electrodes 24 are provided as pairs of adjacent p-type and n-type thermoelectric semiconductors with an adhesive layer 23 interposed therebetween. An insulating heat collecting plate 25 made of ceramic or the like is connected to these electrodes 24. On the low-temperature heat source side of the thermoelectric semiconductor 21, an electrode 26 is formed with an arbitrary p-type thermoelectric semiconductor, an n-type thermoelectric semiconductor, and a predetermined p-type via an adhesive layer 23.
Plural thermoelectric semiconductors and n-type thermoelectric semiconductors are provided in pairs. A radiator plate 27 is connected to these electrodes 26. Any p-type thermoelectric semiconductor among the electrodes 26
A constant voltage device 28 is connected to the thermoelectric semiconductor 21 and the n-type thermoelectric semiconductor 21.
【0009】こうした構成の熱電発電モジュールにおい
て、熱電半導体21へのアルミナ層22の形成は図2のよう
にして行なう。まず、熱電半導体21の表面をアセトンで
脱脂洗浄し、不必要なコーティング面がないようにマス
キングする(図2(A)参照)。次に、熱電半導体21
を、アルミナアルコキシドとCH3 OHを1:4で混合
した溶液に浸し、引き上げる(図2(B)参照)。つづ
いて、取り出した後、真空炉で500℃30分加熱し、
硬化処理を行なう(図2(C)参照)。In the thermoelectric power generation module having such a configuration, the alumina layer 22 is formed on the thermoelectric semiconductor 21 as shown in FIG. First, the surface of the thermoelectric semiconductor 21 is degreased and washed with acetone, and masked so as not to have an unnecessary coating surface (see FIG. 2A). Next, the thermoelectric semiconductor 21
Is immersed in a solution in which alumina alkoxide and CH 3 OH are mixed at a ratio of 1: 4, and pulled up (see FIG. 2B). Then, after taking out, it is heated at 500 ° C for 30 minutes in a vacuum furnace,
A hardening process is performed (see FIG. 2C).
【0010】上記実施例に係る熱電発電モジュールによ
れば、p型あるいはn型の熱電半導体21の側面に、アル
ミナ層22をコーティングした構成になっているため、熱
電半導体21の材料成分の蒸発を防ぐことができる。事
実、真空中で高温源を1000℃に、低温源を0℃に維
持して1000時間、アルミナアルコキシドを使ってコ
ーティングした発電モジュール(本発明)とコーティン
グ処理を行わない場合(従来)の発電出力を下記「表
1」に示す。According to the thermoelectric power generation module according to the above embodiment, since the p-type or n-type thermoelectric semiconductor 21 has a configuration in which the side surface of the thermoelectric semiconductor 21 is coated with the alumina layer 22, the evaporation of the material component of the thermoelectric semiconductor 21 is prevented. Can be prevented. In fact, a power generation module coated with alumina alkoxide (invention) for 1000 hours while maintaining the high temperature source at 1000 ° C. and the low temperature source at 0 ° C. in vacuum, and the power generation output without coating treatment (conventional) Is shown in Table 1 below.
【0011】[0011]
【表1】 表1から明らかのように、アルミナアルコキシドによる
コーティング処理を行なった熱電発電モジュールの発電
出力が従来の場合と比べて発電出力の低下が少な意個と
が確認された。この原因は、熱電半導体成分の蒸発が防
止されているためである。[Table 1] As is clear from Table 1, it was confirmed that the power generation output of the thermoelectric power generation module subjected to the coating treatment with alumina alkoxide did not decrease much less than the conventional case. This is because evaporation of the thermoelectric semiconductor component is prevented.
【0012】[0012]
【発明の効果】以上詳述したようにこの発明によれば、
アルミナアルコキシドをコーティングし、アルミナ層を
熱電半導体表面に形成させることにより、熱電半導体の
材料成分の蒸発を防ぐことができる熱電発電モジュール
を提供できる。As described in detail above, according to the present invention,
By coating with an alumina alkoxide and forming an alumina layer on the surface of the thermoelectric semiconductor, a thermoelectric power generation module capable of preventing evaporation of material components of the thermoelectric semiconductor can be provided.
【図1】この発明の実施例1に係る熱電発電モジュール
の説明図。FIG. 1 is an explanatory diagram of a thermoelectric power generation module according to a first embodiment of the present invention.
【図2】図1の熱電発電モジュールにおける熱電半導体
表面にアルミナ層を形成する方法の説明図。FIG. 2 is an explanatory view of a method of forming an alumina layer on a thermoelectric semiconductor surface in the thermoelectric power generation module of FIG.
【図3】従来の熱電発電モジュールの説明図。FIG. 3 is an explanatory diagram of a conventional thermoelectric power generation module.
【符号の説明】 21…熱電半導体、 22…アルミナ層、
23…接着層、24,26…電極、 25…集熱板、
27…放熱板、28…定電圧装置。[Explanation of symbols] 21: thermoelectric semiconductor, 22: alumina layer,
23 ... adhesive layer, 24,26 ... electrode, 25 ... heat collecting plate,
27: heat sink, 28: constant voltage device.
Claims (1)
電モジュールにおいて、側面にアルミナアルコキシドを
コーティングしたp型・n型の熱電半導体及びこの熱電
半導体の両側に接着層を介して電極を有した熱電半導体
素子と、この熱電半導体素子の一端側に設けられた集熱
板と、前記熱電半導体素子の他端側に設けられた放熱板
と、前記熱電半導体素子の電極に電気的に接続された定
電圧装置とを具備することを特徴とする熱電発電モジュ
ール。1. A thermoelectric power module for directly extracting electricity from high-temperature heat, comprising a p-type / n-type thermoelectric semiconductor having an alumina alkoxide coated on a side surface, and a thermoelectric semiconductor having electrodes on both sides of the thermoelectric semiconductor via an adhesive layer. A semiconductor element, a heat collecting plate provided on one end side of the thermoelectric semiconductor element, a heat radiating plate provided on the other end side of the thermoelectric semiconductor element, and a constant current electrically connected to an electrode of the thermoelectric semiconductor element. A thermoelectric power generation module comprising a voltage device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25175293A JP3188070B2 (en) | 1993-10-07 | 1993-10-07 | Thermoelectric generation module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25175293A JP3188070B2 (en) | 1993-10-07 | 1993-10-07 | Thermoelectric generation module |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07106642A JPH07106642A (en) | 1995-04-21 |
JP3188070B2 true JP3188070B2 (en) | 2001-07-16 |
Family
ID=17227401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25175293A Expired - Fee Related JP3188070B2 (en) | 1993-10-07 | 1993-10-07 | Thermoelectric generation module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3188070B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000164942A (en) * | 1998-11-25 | 2000-06-16 | Matsushita Electric Works Ltd | Thermoelectric module |
WO2006006884A1 (en) * | 2004-07-08 | 2006-01-19 | Gennadiy Gusamovich Gromov | Thermoelectric module |
DE102009009586A1 (en) | 2009-02-19 | 2010-08-26 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Thermoelectric device |
CN101969094B (en) * | 2009-07-27 | 2012-08-29 | 中国科学院上海硅酸盐研究所 | Coating for thermoelectric material and device with same |
CN103250262B (en) * | 2010-10-27 | 2017-04-05 | 巴斯夫欧洲公司 | Electrothermal module and its manufacture method |
DE102013202785A1 (en) | 2013-02-20 | 2014-08-21 | Behr Gmbh & Co. Kg | Thermoelectric module |
-
1993
- 1993-10-07 JP JP25175293A patent/JP3188070B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07106642A (en) | 1995-04-21 |
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Legal Events
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A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20010403 |
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LAPS | Cancellation because of no payment of annual fees |