KR19980058437A - Semiconductor Package Manufacturing Method - Google Patents

Abstract

The present invention relates to a method for manufacturing a semiconductor package, comprising: applying a conductive adhesive to a die bond pad portion using a mask plate; Thermally compressing a lead frame to a die bonding pad portion coated with the conductive adhesive; And forming a package body by molding the die and a portion of the lead frame attached to the die by a conductive adhesive into a molding compound.

Description

Semiconductor package manufacturing method.

TECHNICAL FIELD This invention relates to the manufacturing method of a semiconductor package. Specifically, It is related with the die bonding which adheres a die bonding pad part and a lead frame using a conductive adhesive.

Generally, a semiconductor chip having an integrated circuit is sent to an assembly process and packaged through a sequence of chip cutting, chip attachment, wire bonding, mold, forming, trimming, and the like.

In detail, the semiconductor package manufacturing process according to the prior art will be described with reference to FIG. 1.

An adhesive such as epoxy is applied to the paddle 2a of the lead frame, and a die 1 sawed on the wafer by the epoxy is attached to the paddle 2a of the epoxy applied lead frame. Then, the inner lead 2b of the lead frame forming the electrical signal transmission path to the die 1 and to the outside is bonded by the metal wire 3.

Then, a predetermined area including the die 1 and the inner lead 2b wire-bonded thereto by the molding compound is sealed so that the package body 4 is tangled, and then the forming / trimming process of the lead frame The out lead 2c has a predetermined shape.

However, the prior art as described above has a limitation in reducing the thickness of the package due to the height due to the paddle and the metal wire, and since the inner lead and the die are bonded using the metal wire, the metal wire is corroded and damaged by external impact. By disconnection, there was a problem that the package is electrically shorted to the outside.

Accordingly, the present invention applies a conductive adhesive to the die bonding pad portion, adheres the inner lead of the lead frame to the portion coated with the conductive adhesive, and then seals with a molding compound, thereby minimizing the package size. The purpose is to provide.

1 is a cross-sectional view for explaining a semiconductor package manufacturing method according to the prior art.

2A and 2B are cross-sectional views for explaining the die bonding step of the present invention.

3 is a cross-sectional view illustrating a semiconductor package according to the present invention.

Explanation of symbols on the main parts of the drawings

11: die, 12: polyimide, 13: mask plate, 14: conductive adhesive, 15a: lower heater block, 15b: upper heater block, 16: lead frame

An object of the present invention as described above, the step of applying a conductive adhesive to the die bonding pad portion using a mask plate; Thermally compressing a lead frame to a die bonding pad portion coated with the conductive adhesive; The die and a portion of the lead frame attached to the die by a conductive adhesive is formed by a molding compound to achieve a semiconductor package manufacturing method according to the invention characterized in that it comprises a step of forming a package body.

Since the semiconductor package according to the present invention adheres the inner lead of the lead frame to the die bonding pad portion using a conductive adhesive, the size of the package can be minimized.

EXAMPLE

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

Referring to FIG. 2A, a mask plate 13 is used for a predetermined portion of a die 11 sawed from a wafer, that is, a portion of a die bonding pad not coated with polyimide 12, which is a protective film applied to protect the die. Then, the conductive adhesive 14 is applied. Here, the mask plate 13 is manufactured to fit the size of the die 11 so that the conductive adhesive 14 is injected only to the die bonding pad in a certain outline standard, and the mask plate 13 is formed at least 2 mm from the surface of the die 11. You have to let go.

Referring to FIG. 2B, the lower heater block 15a is positioned on the bottom of the die 11 to which the conductive adhesive 14 is applied, and the upper heater block 15b is also positioned on the die 11. In addition, the lead frame 16 is positioned between the upper heater block 15a and the die 11. At this time, the lead frame is positioned on the die bonding pad to which the conductive adhesive 14 is applied. Here, the lower heater block 15a placed on the bottom of the die 11 should be manufactured to fit the size of the die 11, and the upper heater block 15b on the top of the die 11 may be moved up and down to apply pressure. It is designed to be movable. On the other hand, the temperature range of heat that can be applied to the heater block is 0 to 400 ℃, pressurization is 0 to 5kgf / ㎠.

Then, the lead frame 16 is attached to the die bonding pad portion to which the conductive adhesive 14 is applied at an appropriate pressure and heat by using the upper and lower heater blocks 15a and 15b to be electrically conductive.

Subsequently, the subsequent process proceeds to produce a semiconductor package in which the lead frame 16, as shown in FIG. 3, is attached to the die 11 by a conductive adhesive 14.

As described above, in the method of manufacturing a semiconductor package of the present invention, by applying a conductive adhesive to a die bonding pad portion and then attaching a lead frame to the portion, the size of the package can be minimized and the wire bonding process is omitted. There is an economic advantage. In addition, since the bonding and curing are performed at the same time by the heater block, no separate curing process is required.

Meanwhile, although specific embodiments of the present invention have been described and illustrated herein, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.

Claims (5)

Applying a conductive adhesive to the die bond pad portion using the mask plate; Thermally compressing a lead frame to a die bonding pad portion coated with the conductive adhesive; Forming a package body by molding the die and a portion of a lead frame attached to the die by a conductive adhesive to a molding compound. The method of claim 1, wherein the mask plate is installed at least 2 mm above the die surface. The method of manufacturing a semiconductor package according to claim 1, wherein a heater block is used to attach the lead pad and the bonding pad portion of the die coated with the conductive adhesive. The method of claim 3, wherein the pressure of the heater block is 0 to 5 kgf / cm 2. The method of claim 3, wherein the heating temperature of the heater block is 0 to 400 ° C. 5.