KR19980047434A - Guide Mark Formation Method of Printed Circuit Board - Google Patents

Abstract

A method of forming a guide mark on a printed circuit board.

The present invention provides a guide mark forming method of a printed circuit board having a sensor which secures a diameter of 0.2 mm to 2.0 mm to a sensing area to form a guide hole. A first area secured, a second area including the first area and having a diameter of 2.00 mm or less around the origin of the first area, and a second area including the second area and the origin of the first area It characterized in that it comprises a third region that is secured to be larger within the range of 0.40mm than the diameter including the second region.

Therefore, there is an effect that the productivity is improved by setting the range of the guide mark accurately and reducing defects and increasing the accuracy during the process.

Description

Guide Mark Formation Method of Printed Circuit Board

The present invention relates to a method of forming a guide mark on a printed circuit board, and more particularly, to a method of forming a guide mark on a printed circuit board, which improves a defect due to sensing during processing of a guide hole by setting an accurate range of a sensing area. A guide mark forming method.

In general, a printed circuit board (PCB) laminates a copper plate on a substrate made of a material such as paper-phenol resin or glass epoxy resin, and prints and etches patterns. ), A copper foil for wiring is completed into a figure.

In the manufacture of a printed circuit board, a trial is first performed, followed by a printing process such as a pattern, solder resist, and marking.

The printed circuit board performs a guide drill process for processing a guide hole as a preparatory process for performing a punching process for determining a hole and an outer shape into which a component is inserted.

Here, the guide hole is a hole which is generally processed to exactly match a guide pin of a press machine in which a punching process is performed, but the guide hole must be matched with the guide pin to perform an accurate punching process.

Since the processing of the guide hole is severely affected by the accuracy of the guide hole, it is generally performed after the guide mark is formed to accurately sense the position.

And the guide mark is mainly used by printing a circular shape having a predetermined diameter.

In general, a sensor for sensing a guide mark uses a sensor having a sensing range of 0.2 mm to 2.0 mm in diameter.

However, despite the sensing range, the conventional guide mark is formed without considering the exact position deviation.

That is, the range of the conventional guide mark may vary according to a user's request. In general, as the sensing area of the sensor, a first area in which a guide hole is formed is formed to a diameter of 0.92 mm, and the first area is formed. Including a second region having a diameter of 1.90 mm around the origin of the first region.

Then, a third region including first and second regions having a diameter of 2.40 mm was formed around the origin of the first region, and a fourth region was formed outside the fourth region.

In the conventional guide mark, the region where the guide hole is formed is slightly different depending on the diameter of the drill of the guide drill apparatus, but mainly includes the first region and the second region.

Therefore, the third area of the guide mark is the remaining area except for the diameters of the first and second areas, and the conventional guide mark has a sensing range of about 0.25 mm when considering the origin of the first area. .

Such an area is an area included in the sensing range of the sensor, and always includes a problem that the sensor can recognize the third area as an area in which the guide hole is processed.

In other words, the guide hole is formed into a region including the third region, and the guide mark is formed without considering the exact positional deviation according to the sensing range of the sensor, thereby causing a malfunction of the sensor.

Therefore, not only the failure of the machining position of the guide hole caused a loss of working time, but also reduced the efficiency of the equipment.

Therefore, the conventional guide hole formation has a problem that the productivity is reduced during the process performance due to the positional deviation of the guide mark formation.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of forming a guide mark on a printed circuit board for improving productivity by forming guide marks in which the range of the sensing region is set accurately.

1 is a view showing an area where a guide mark of a printed circuit board is formed.

2 is a plan view showing an embodiment of a method for forming guide marks on a printed circuit board according to the present invention.

※ Explanation of symbols for main parts of drawing

10: circuit board 12: guide mark

Guide mark forming method of a printed circuit board according to the present invention for achieving the above object, guide mark formation of a printed circuit board having a sensor for securing a diameter of 0.2mm to 2.0mm in the sensing area in order to form a guide hole A method, comprising: a first region in which a diameter of the sensor can be sensed, a second region in which the diameter is smaller than a diameter of a drill including the first region, and the drill hole forming the guide hole. And a third region including the second region and larger than a diameter including the second region around the origin of the first region.

And a fourth region including the third region and having a diameter larger than a diameter of the third region around the origin of the first region by a predetermined range.

Preferably, the first area and the second area are formed so that the sensor can distinguish the area.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing an area where a guide mark of a printed circuit board is formed, and FIG. 2 is a plan view showing an embodiment of a method of forming a guide mark of a printed circuit board according to the present invention.

First, FIG. 1 shows a region Z in which a circuit board 10 is provided to form a guide mark 12 to form a guide hole, and FIG. 2 shows each region forming such a guide mark.

In FIG. 2, first, a first region A formed within a range of a diameter that can be sensed by a sensor is secured as a center region in which the guide hole is formed, and includes a first region A and a first region. The 2nd area | region B is ensured by the area | region which is about 0.30 mm-about 0.35 mm larger than the diameter of the 1st area | region A centering on the origin of (A).

Here, the first region (A) and the second region (B) may be slightly different depending on the diameter of the drill of the guide drill device, but in general, the guide hole is formed in the present invention, the present invention forms the guide hole It is secured to an area having a diameter in a range smaller than that of the drill.

And a third area including the first and second areas A and B and secured to an area not larger than 0.40 mm larger than the diameter including the second area B about the origin of the first area A. (C) is formed, and the fourth area D that provides the boundary of the sensing range is secured to the outside thereof.

Here, the third region C is a region including the first region A and the second region B as well as providing an accurate sensing position of the guide hole, and is secured as an area for performing inspection when the guide hole is formed. do.

In the range of each region of the present invention, first, the first region A can be secured as the sensing range of the sensor, and the embodiment forms the diameter of 1.3 mm.

And the second area (B) can be secured to the area of 0.30mm to 0.35mm larger than the first area (A), the embodiment is formed of 1.95mm, the diameter is 0.65mm larger, where The drill uses the larger than the diameter of the second area to form the guide hole.

In addition, the third region C is formed to be larger than the second region B in the range of 0.40 mm around the origin of the first region A, and the embodiment is formed to be 2.2 mm larger by 0.25 mm. Outside, the fourth area D is formed to have a predetermined diameter to provide a sensing position.

In the embodiment, the first area A and the second area B may be formed so as to distinguish the sensor from each other, and the first area A and the second area B may be distinguished with or without etching during the printing process.

According to the present invention having such a configuration, when performing guide mark sensing for guide hole processing, the range of the third region C is smaller than the sensing range of the sensor, so that sensing is performed using only the first region A. FIG.

Thus, the guide hole is formed only in the correct position, and in the embodiment, the range of the second region B including the first region A is formed to be somewhat smaller than the drill diameter of the guide drill apparatus for performing the guide hole process. It prevents burr phenomenon, etc., in which copper foil flakes are generated during guide hole processing.

Therefore, the guide hole can be formed in the correct position to prevent the defect caused by the guide hole can increase the efficiency of the work and the efficiency of the equipment.

In addition, when the guide hole is formed by processing as a side effect, it can be confirmed that the third region (C) is accurately secured, so that the accuracy can be increased during visual inspection after the guide hole processing.

In addition, due to the reduction in the sensing range of the third region C, the position deviation can be ensured within 0.20 mm, thereby improving the precision of the guide hole machining.

Therefore, according to the present invention, it is possible to accurately set the range of the guide mark, thereby improving productivity by reducing defects and increasing accuracy during the process.

Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (3)

In the method of forming a guide mark of a printed circuit board having a sensor for securing a diameter of 0.2mm to 2.0mm as a sensing area in order to form a guide hole, A first area in which a diameter thereof is secured to an area that the sensor can sense; A second region including the first region and secured to a diameter in a range smaller than a diameter of a drill for forming the guide hole; And A third region including the second region and larger than a diameter including the second region about an origin of the first region within a range of 0.40 mm; Guide mark forming method of a printed circuit board comprising a. The method of claim 1, And the fourth region including the third region and having a diameter that is secured to a region larger than a diameter of the third region by a center around the origin of the first region. Guide mark formation method of a board | substrate. The method of claim 1, And the first area and the second area are formed so that the sensor can distinguish the area.