CN101155474B - High-precision contra-position overlapping film method in FPC field and its special partition board - Google Patents
High-precision contra-position overlapping film method in FPC field and its special partition board Download PDFInfo
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- CN101155474B CN101155474B CN2006100629269A CN200610062926A CN101155474B CN 101155474 B CN101155474 B CN 101155474B CN 2006100629269 A CN2006100629269 A CN 2006100629269A CN 200610062926 A CN200610062926 A CN 200610062926A CN 101155474 B CN101155474 B CN 101155474B
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- coverlay
- division board
- copper foil
- cover layer
- pin
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Abstract
The invention discloses a method of high precision counterpoint cover layer in FPC territory and special isolation board thereof. The size of the isolation board of the invention is adapted to the cover layer. Evading and point location holes and laser contraposition marker which are disposed on the isolation board locate a cover layer and a copper foil and extract evading pin of the isolation board conveniently. The method mainly includes: the copper foil covered with the isolation board, the isolation board covered with the cover layer, photoetching achieved by lithography tool, extracting the isolation board, retrograding pin, hot pressing product and the cover layer. The method utilizes totally converse thought comparing with the tradition technology which includes processing the cover layer first and then attaching it to the copper foil: attaching the cover layer to the copper foil first and then processing fenestration graph of the cover layer, so that can reduce the attaching error of the cover layer and the copper foil and enhance precise location.
Description
Technical field
The present invention relates to method, especially coverlay and the pinpoint method of wiring board and the special partition board thereof of a kind of FPC location.
Background technology
FPC, promptly flexible print circuit board (Flexible Printed Circuit) under the trend of current electronic product portability development, occupies the status that becomes more and more important in printed substrate PCB field.In traditional handicraft; the contraposition of the welding resistance diaphragm of the required covering of FPC is fitted and is finished by manual directly applying or in conjunction with simple and easy fixture, and precision is low, generally can be controlled between the 0.1---0.2mm; be used for finishing the product of some low sides, but be not suitable for high-end product.
In the traditional handicraft, coverlay is windowed according to certain figure and size with means such as die-cut earlier, and then fits with Copper Foil.The method of traditional applying coverlay in the FPC field:
1, on the covering mould, goes out fine pattern with the mould that designs, and need produce the circular hole of diameter 1.5mm;
2, in the clean room, be ready to Copper Foil (the square marks hole that has length of side 1.7mm) after the etching;
3, with the square opening of 1.7mm on the circular hole contraposition Copper Foil that covers the 1.5mm on the mould, artificial contraposition is not as long as even if circular hole exceeds square marks ok;
4, hotly join edge with flatiron;
5, hot pressing.
Above-mentioned method can have the following disadvantages:
1, in the process of wait for fitting with the temperature and humidity change in size, cause the applying error;
2, in the copper foil circuit forming process, Copper Foil can produce uncertain change in size (0.4 ‰-1.5 ‰), causes the applying error;
3, in the artificial contraposition process, the human eye limitation will cause ± error of 0.1mm.Utilize in the tool applying process, pin causes coverlay deformation to pullling of coverlay, brings the applying error.
Summary of the invention
One of technical problem to be solved by this invention provides a kind of high accuracy contraposition coverlay method in the FPC field that can reduce the applying error.
Method of the present invention may further comprise the steps:
One, division board is covered on the Copper Foil;
Two, take away centrifugal paper on the coverlay, and its glue face is covered on the division board;
Three, coverlay is contacted fully with division board;
Four, the location hole of dodging on division board hammers into pin to coverlay and Copper Foil location;
Five, mask aligner carries out photoetching after utilizing laser alignment mark on the division board to dodge the accurate contraposition of laser alignment mark on the Copper Foil of seeing in the hole;
Six, extract division board;
Seven, with coverlay with after Copper Foil contacts fully, with coverlay and four jiaos of false applyings of product;
Eight, move back pin;
Nine, hot pressing product and coverlay.
Described division board is two, and two continuous edge's correspondences of division board are provided with breach, and the breach of two division boards is dodged location hole to form together, and described step 6 is to extract division board from two ends.Such design of division board can conveniently be extracted two division boards out respectively from two ends.
Described step 6 is to extract division board simultaneously from two ends, and pin place epiphragma is depressed, and it is contacted fully with Copper Foil.Can make like this that coverlay and Copper Foil are more abundant to be contacted contiguously.
Laser alignment mark on the Copper Foil described in the described step 5 is " ten " word line mark.This laser alignment mark is simple, practical.
Described pin diameter range is between 0.1-2mm.The locating effect of the pin of this diameter range is better.
The working roller partial-length of described dedusting roller is greater than whole plate FPC width.Can make whole plate FPC all pass through the rolling of working roller like this.
Fit with Copper Foil with the coverlay of processing earlier of traditional handicraft again and to compare, this method has adopted antipodal thought: coverlay is fitted earlier with Copper Foil, reprocesses the coverlay figure of windowing.This has directly caused following advantage:
Though 1, coverlay produces change in size in the wait process, epiphragma is windowed figure in just processing after this, and the figure of therefore windowing can not produce change in size.This has eliminated the error that the coverlay change in size causes.
2, photoetching process software-controllable can be carried out change in size according to laser contraposition sign and be judged, and can be to less than the automatic revisal lithographic procedures of 0.2% change in size.This has directly eliminated the bit errors that causes because of the Copper Foil contraction.
3, all nonessential step of manual operation in this method proves and can not introduce than mistake in theory with in the practice.This just is converted into artificial aligning accuracy the lithographic accuracy of laser machine cleverly.
Two of technical problem to be solved by this invention provides a kind of special partition board of said method.
The size and the coverlay of described division board adapt, division board be provided with not only can be conveniently to coverlay and Copper Foil location, but also can conveniently extract division board dodge pin dodge location hole and the laser alignment mark is dodged the hole.
Described division board is two, and two continuous edge's correspondences of division board are provided with breach, and the breach of two division boards is dodged location hole to form together.Design can be extracted two division boards out respectively from two ends like this.
Described laser alignment mark is dodged the hole and is located at four jiaos of division board, and its position is corresponding with laser alignment mark on the Copper Foil.Can use the accurate contraposition of mask aligner like this.
Described division board is smooth surface, the uniform thin plate of thickness.Coverlay and Copper Foil are fitted.
Described division board is the special partition board of high accuracy contraposition coverlay method of the present invention, and such division board promptly can allow pin dodge the location hole place to coverlay and Copper Foil location, and don't division board is positioned.This division board had both played and had prevented mask aligner to the hurtful effect of Copper Foil, after photoetching, can extract division board again easily coverlay and Copper Foil are fitted.
Description of drawings
Fig. 1 is thin division board shape schematic diagram.
Fig. 2 is the Product Status schematic diagram in the course of processing of the present invention.
Among the figure: 1, division board, 2, dodge location hole, 3, the laser alignment mark dodges the hole, 4, the laser alignment mark, 5, laser, 6, pin, 7, coverlay, 8, Copper Foil, 9, supporting bracket.
The invention will be further described below in conjunction with the drawings and specific embodiments for embodiment.
As shown in Figure 1:
Referring to the product cross section schematic diagram among Fig. 2, high accuracy contraposition coverlay method is done comparatively detailed description:
1. after the Copper Foil after the etching being carried out clean, be put on the supporting bracket 9;
2. division board 1 is covered on the Copper Foil 8;
3. take away the centrifugal paper on the coverlay 7, and its glue face is covered on the division board 1 gently;
4. roll gently on face with the dedusting roller, drive air away, coverlay 7 is fully contacted with division board 1; Described dedusting roller requires clean, and is level and smooth, and the working roller partial-length is larger than whole plate FPC width.
5. hammer into pin 6 with the pin machine at division board 1 circular hole place.Pin is preferably sharp, in order to avoid the coverlay fold; Described confidential the vertically effective of pin nail of asking of shadowing, diameter is the smaller the better is preferably 0.5-1.2mm at this for institute's pin nail.
6. send laser 5 with the laser machine and carry out photoetching, four cross hairs are done laser alignment mark 4;
7. brush coverlay 7 gently with the room temperature air pressure gun, to drive the epiphragma chip away;
8. after slowly extracting division board 1 simultaneously from two ends, pin 6 place's epiphragmas are depressed, it is fully contacted with Copper Foil 8;
Once more with roller with coverlay 7 with after Copper Foil 8 fully contacts, with four jiaos of coverlay 7 and products false fit (available flatiron hotly joins);
10. move back pin 6;
11. hot pressing product and coverlay 7.
Utilize the mask aligner precision can be controlled at 25 microns in the embodiment, aligning accuracy has improved nearly order of magnitude than traditional handicraft in theory.This method is applicable to the scale of mass production of high-end product.
Claims (7)
1. one kind in FPC field contraposition coverlay method, may further comprise the steps:
One, division board is covered on the Copper Foil;
Two, take away centrifugal paper on the coverlay, and its glue face is covered on the division board;
Three, coverlay is contacted fully with division board;
Four, the location hole of dodging on division board hammers into pin to coverlay and Copper Foil location;
Five, mask aligner carries out photoetching after utilizing laser alignment mark on the division board to dodge the accurate contraposition of laser alignment mark on the Copper Foil of seeing in the hole;
Six, extract division board;
Seven, with coverlay with after Copper Foil contacts fully, with coverlay and four jiaos of false applyings of product;
Eight, move back pin;
Nine, hot pressing product and coverlay.
2. according to claim 1 a kind of in FPC field contraposition coverlay method, it is characterized in that: described division board is two, two continuous edge's correspondences of division board are provided with breach, the breach of two division boards is dodged location hole to form together, and described step 6 is to extract division board from two ends.
3. according to claim 2 a kind of in FPC field contraposition coverlay method, it is characterized in that: described step 6 is to extract division board simultaneously from two ends, and pin place epiphragma is depressed, and it is contacted fully with Copper Foil.
4. according to claim 1 a kind of in FPC field contraposition coverlay method, it is characterized in that: the laser alignment mark on the Copper Foil described in the described step 5 is " ten " word line mark.
5. according to claim 1 a kind of in FPC field contraposition coverlay method, it is characterized in that: described pin diameter range is between 0.1-2mm.
6. special partition board in FPC field contraposition coverlay method, it is characterized in that: the size and the coverlay of described division board adapt, division board be provided with not only can be conveniently to coverlay and Copper Foil location, but also can conveniently extract division board dodge pin dodge location hole and the laser alignment mark is dodged the hole.
7. a kind of special partition board according to claim 6 in FPC field contraposition coverlay method, it is characterized in that: described division board is two, two continuous edge's correspondences of division board are provided with breach, and the breach of two division boards is dodged location hole to form together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100629269A CN101155474B (en) | 2006-09-28 | 2006-09-28 | High-precision contra-position overlapping film method in FPC field and its special partition board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100629269A CN101155474B (en) | 2006-09-28 | 2006-09-28 | High-precision contra-position overlapping film method in FPC field and its special partition board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101155474A CN101155474A (en) | 2008-04-02 |
| CN101155474B true CN101155474B (en) | 2011-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100629269A Expired - Fee Related CN101155474B (en) | 2006-09-28 | 2006-09-28 | High-precision contra-position overlapping film method in FPC field and its special partition board |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421253A (en) * | 2011-08-12 | 2012-04-18 | 东莞康源电子有限公司 | Method for manufacturing flexible circuit board |
| CN105072809A (en) * | 2015-07-13 | 2015-11-18 | 苏州市华扬电子有限公司 | Method for improving line alignment precision of single-face double-contact type FPC board |
| CN105458628A (en) * | 2015-12-14 | 2016-04-06 | 谢兴龙 | Hole-drilling and automatic-adhesive-tape-wrapping production method of circuit board |
| KR20190110442A (en) * | 2018-03-20 | 2019-09-30 | 오르보테크 엘티디. | System for removal of debris from a substrate in an optical processing system |
| CN110636702B (en) * | 2018-06-21 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5150787A (en) * | 1991-02-21 | 1992-09-29 | Minnesota Mining And Manufacturing Company | Component carrier tape |
| CN1366445A (en) * | 2000-12-21 | 2002-08-28 | 索尼化学株式会社 | Manufacturing method of multilayer flexible wiring plate |
| CN1398153A (en) * | 2001-07-17 | 2003-02-19 | 三洋电机株式会社 | Mfg. method of circuit device |
-
2006
- 2006-09-28 CN CN2006100629269A patent/CN101155474B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5150787A (en) * | 1991-02-21 | 1992-09-29 | Minnesota Mining And Manufacturing Company | Component carrier tape |
| CN1366445A (en) * | 2000-12-21 | 2002-08-28 | 索尼化学株式会社 | Manufacturing method of multilayer flexible wiring plate |
| CN1398153A (en) * | 2001-07-17 | 2003-02-19 | 三洋电机株式会社 | Mfg. method of circuit device |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平8-27966A 1996.01.30 |
| JP特开平8-32194A 1996.02.02 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 contract change Contract record no.: 2008440000067 Denomination of invention: High-precision contra-position overlapping film method in FPC field and its special partition board License type: Exclusive license Record date: 2008.5.4 |
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Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150902 |
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Effective date of registration: 20150902 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
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Granted publication date: 20110824 Termination date: 20160928 |
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