CN111372382A - Primary and secondary board pressing alignment design process method of PCB - Google Patents
Primary and secondary board pressing alignment design process method of PCB Download PDFInfo
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- CN111372382A CN111372382A CN202010293818.2A CN202010293818A CN111372382A CN 111372382 A CN111372382 A CN 111372382A CN 202010293818 A CN202010293818 A CN 202010293818A CN 111372382 A CN111372382 A CN 111372382A
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- daughter board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Abstract
The invention provides a primary-secondary board pressing and aligning design process method of a PCB, which comprises the following steps: and (3) processing a base sub-board: selecting any daughter board as a basic daughter board, and calculating the expansion and contraction coefficient of the basic daughter board; and (3) pressing the daughter board: selecting any daughter board as a press-fit daughter board, and calculating the expansion and contraction coefficient of the press-fit daughter board; and (3) pressing the secondary outer layer image of the daughter board: calculating a rivet target position design distance of the press-fit daughter board according to the designed rivet hole target size, the expansion and contraction coefficient of the basic daughter board and the expansion and contraction coefficient of the press-fit daughter board, adjusting a rivet target position design coordinate according to the rivet target position design distance, and processing an outer side image of the press-fit daughter board; and (3) contraposition press-forming: the base daughter board and the pressing daughter board prepared in the step are pressed into the mother board, and the design process method effectively improves the pressing alignment precision of the mother board and the daughter board, reduces the deviation of the pressing layer and meets the requirement of stable batch production.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a primary-secondary board pressing alignment design process method of a PCB.
Background
With the diversification and customization development of electronic products, the circuit board is required to be embedded and assembled in some subdivided fields, and high-density electronic mounting is met. The special board is usually produced by adopting a method of twice or even multiple times of pressing, namely, the board is split into two or more daughter boards for production, and then the daughter boards are pressed into a mother board finished product; due to the process design problem, the lamination often results in large layer deviation and alignment deviation, unstable quality and high scrap rate.
Disclosure of Invention
In view of the above, the present invention aims to avoid the disadvantages in the prior art and provide a method for designing the lamination and alignment of the mother and daughter boards of a PCB, which can effectively improve the lamination and alignment accuracy of the mother and daughter boards, reduce the quality rejection risk of the laminated layer, and meet the requirement of stable production in batches.
The embodiment of the invention provides a primary-secondary board pressing and aligning design process method of a PCB, which comprises the following steps:
and (3) processing a base sub-board: selecting any daughter board as a basic daughter board, and then marking the size omega according to the designxAnd ωyProcessing the secondary outer layer image of the foundation daughter board, then processing the foundation daughter board through a rivet hole drilling process, and actually measuring the target size a of the foundation daughter board2And b2Finally, the expansion and contraction coefficient ax of the basic daughter board is calculated according to the numerical values2＝a2÷ωy；ay2＝b2÷ωy；
And (3) pressing the daughter board: selecting any daughter board as a pressing daughter board, and then marking the size omega according to the designxAnd ωyThe method comprises the steps of carrying out foundation processing on the press-fit daughter board, then processing the press-fit daughter board through a rivet hole drilling process, and actually measuring the target size a of the foundation daughter board1And b1Finally, calculating the expansion and contraction coefficient ax of the laminated daughter board according to the numerical values1＝a1÷ωx；ay1＝b1÷ωy；
Processing step for pressing secondary outer layer image of daughter boardThe method comprises the following steps: rivet hole target size omega as designedxAnd ωyAnd the coefficient of expansion and contraction ax of the basic daughter board calculated in the above step2And ay2Expansion and contraction coefficient ax of laminated sub-board1And ay1Calculating the design distance dx of the rivet target position of the press-fit daughter board to be omegax×ax2÷ax1，dy＝ωy×ay2÷ay1Then, adjusting the design coordinate of the rivet target position according to the design distance of the rivet target position of the pressed daughter board, and processing the outer side image of the pressed daughter board;
and (3) contraposition press-forming: and pressing the basic daughter board prepared in the basic daughter board processing step and the pressed daughter board obtained in the pressed daughter board secondary outer layer image processing step into a mother board.
Further, the sub-outer layer image processing in the base daughter board processing step includes the following sub-steps: the method comprises the following steps: inner layer dry film; step two: inner layer AOI; step three: drilling a rivet hole; step four: pressing; step five: drilling; step six: copper deposition/plate electroplating; step seven: turning a next outer layer; step eight: and etching the secondary outer layer.
Further, the processing of the pressfitting daughter board through the rivet hole drilling process in the pressfitting daughter board processing step specifically comprises: selecting a drilling machine to drill a positioning target and process an outer layer image rotating positioning target on the press-fit paperboard, and actually measuring the distance a between 4 targets of the press-fit daughter board1And b1。
Further, it specifically is to handle the pressfitting daughter board through boring rivet hole process: selecting an X-ray drilling machine to drill 7 targets on the press-fit daughter board, wherein 3 targets are used for positioning drill holes, 4 targets are used for outer layer image rotation positioning, and meanwhile, actually measuring the distance a between 4 targets of the press-fit daughter board1And b1。
Further, the basic processing in the processing step of the press-fit daughter board comprises the following substeps: the method comprises the following steps: an inner layer; step two: inner layer AOI; step three: and (6) pressing.
Further, in the processing step of the secondary outer layer image of the press-fit daughter board, the standard rivet target distance values ω x and ω y satisfy the following relations: 304.8mm < omega x < 584.2mm, 304.8mm < omega y < 584.2 mm.
Further, the para-position press-forming step specifically comprises: and applying high temperature and high pressure to the PCB by a special press to heat and melt the bonding sheet, and pressing the basic daughter board prepared in the basic daughter board processing step and the pressed daughter board obtained in the secondary outer image processing step of the pressed daughter board into a mother board.
Further, the temperature range of the high temperature of the press special for the PCB board is as follows: the high pressure of the PCB special press ranges from 400 psi to 450psi under the temperature of 20 ℃ to 250 ℃.
Compared with the prior art, the invention has the following beneficial effects: the design method for the lamination alignment of the primary and secondary boards of the PCB comprises the steps of firstly calculating the expansion and contraction coefficient ax of the basic daughter board through the processing steps of the basic daughter board in the lamination process2And ay2And processing the secondary outer layer image of the basic daughter board, and then calculating the harmomegathus coefficient ax of the pressed daughter board through the processing step of the pressed daughter board1And ay1And target size ω of designxAnd ωyThen calculating the designed rivet target distance dx of the pressed sub-plate as omega through the coefficientx×ax2÷ax1，dy＝ωy×ay2÷ay1And finally, the design coordinates of the target position of the rivet are adjusted through dx and dy obtained by calculation, and the outside image processing is carried out on the press-fit daughter board, so that the alignment between the outside image on the basic daughter board and the outside image on the press-fit daughter board is more accurate, the problem of large layer offset alignment deviation caused by press-fit is avoided due to the process design problem, the problem of large layer offset alignment deviation caused by press-fit is solved, the process of PCB reproduction is further ensured, the press-fit alignment of the mother-son board is more accurate, the risk of scrapping of the offset quality of the press-fit layer is greatly reduced, and.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic process flow diagram of a primary-secondary board lamination alignment design process method of a PCB of the present invention.
Fig. 2 is a front view of a laminated daughter board in the mother-daughter board lamination alignment design process of the PCB of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person skilled in the art without making any inventive step are within the scope of the present invention.
As shown in fig. 1-2, an embodiment of the present invention provides a method for a mother-daughter board lamination alignment design process of a PCB, including the following steps:
the method comprises the following steps: the PCB is reasonably split into 2 or more daughter boards according to the laminated structure of the PCB, so that the fool-proofing effect can be realized, and an operator can directly and correctly complete correct operation without paying attention and without experience and professional knowledge;
step two: putting the basic daughter board into production, selecting any one daughter board as the basic daughter board, and then designing the rivet target distance standard value size omega according to the requirementxAnd ωyAnd processing the outer layer graph of the foundation sub-board, wherein the processing of the outer layer graph specifically comprises the following steps: the method comprises the steps of (1) adhering a layer of photosensitive material on a copper foil on a board surface, then carrying out alignment exposure and etching after development through a black film to form a circuit) → inner layer AOI (automatic Optical Inspection, namely, automatic Optical Inspection.
Step three: then, a rivet hole drilling tool is used for drillingProcessing the foundation daughter board in sequence, and actually measuring the target size a after drilling of the foundation daughter board2And b2Comparison of the target size ωxAnd ωyValue, calculate the coefficient of expansion and contraction ax of the base daughter board2＝a2÷ωy；ay2＝b2÷ωy；
Wherein, the expansion and contraction coefficient is the measured value of the target and the designed target size;
the distance between target patterns (rivet holes) drawn by PCB design software Genesis 2000 is a standard value, which is called the designed target size or cam value; the distance between the actual measurement targets is referred to as the target actual measurement value.
Step four: putting into production the pressfitting daughter board, selecting any one or more daughter boards as the pressfitting daughter board, and then marking the size omega of the target according to the designxAnd ωyAnd carrying out basic processing on the press-fit daughter board, wherein the basic processing steps specifically comprise: and the inner layer → the inner layer AOI (automatic Optical Inspection), namely, the automatic Optical Inspection, the image of the PCB is scanned out through optics by utilizing the different light reflection effect of the copper surface of the circuit of the PCB and the epoxy resin base material, and the image of the PCB is compared with a standard board (the defect in the circuit pattern of the PCB is detected) → pressing (high temperature and high pressure are applied through a special press for the PCB, and pressing and fixing are carried out), so that the pressed daughter board is prepared.
Step five: the rivet hole processing procedure is drilled to the pressfitting daughter board, specifically: and (3) carrying out 7-target treatment on the pressed daughter board drilling by using an X-ray drilling machine, wherein 3 targets are used for drilling positioning, 4 targets are used for outer layer image rotation positioning, and meanwhile, measuring the distance between 4 targets on the pressed daughter board and comparing the distance with the designed target size omegaxAnd ωyValue, calculating the heating expansion coefficient ax of the laminated daughter board1、ay1；
Step six: rivet hole target size omega as designedxAnd ωyAnd the coefficient of expansion and contraction ax of the basic daughter board calculated in the above step2And ay2Expansion and contraction coefficient ax of laminated sub-board1And ay1Calculating the design distance of the rivet target position of the press fit daughter board:
dx＝ωx×ax2÷ax1，dy＝ωy×ay2÷ay1；
and calculating the expansion and contraction coefficients dx and dy of the press sub-board.
Step seven: and calculating the design distances dx and dy of the rivet target positions of the press-fit daughter board through the calculation formula of the step six, and simultaneously adjusting the design coordinates of the rivet target positions to obtain the sub-outer layer graph-to-graph data of the press-fit daughter board.
Step eight: and pressing the sub-outer layer graph of the sub-board according to the adjusted sub-outer layer graph-to-graph data of the pressed sub-board.
Step nine: and applying high temperature and high pressure to the PCB by a special press to heat and melt the bonding sheet, and pressing the basic daughter board prepared in the basic daughter board processing step and the pressed daughter board obtained in the secondary outer image processing step of the pressed daughter board into a mother board. The temperature range of the high temperature of the special press for the PCB is as follows: the high pressure of the PCB special press ranges from 400 psi to 450psi under the temperature of 20 ℃ to 250 ℃.
Compared with the prior art, the invention has the following beneficial effects: the design method for the lamination alignment of the primary and secondary boards of the PCB comprises the steps of firstly calculating the expansion and contraction coefficient ax of the basic daughter board through the processing steps of the basic daughter board in the lamination process2And ay2And processing the secondary outer layer image of the basic daughter board, and then calculating the harmomegathus coefficient ax of the pressed daughter board through the processing step of the pressed daughter board1And ay1And target size ω of designxAnd ωyThen calculating the designed rivet target distance dx of the pressed sub-plate as omega through the coefficientx×ax2÷ax1，dy＝ωy×ay2÷ay1And finally, the design coordinates of the target position of the rivet are adjusted through dx and dy obtained by calculation, and the outside image processing is carried out on the press-fit daughter board, so that the press-fit position between the outside image on the basic daughter board and the outside image on the press-fit daughter board is more accurate, the problem of large layer deviation caused by press-fit due to process design problems is avoided, the process of further PCB reproduction is ensured, the press-fit alignment of the mother-son boards is more accurate, the quality scrap risk of the press-fit layer deviation is greatly reduced, and the requirement of batch production is metThe production requirement is stable.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. A primary and secondary board pressing and aligning design process method of a PCB is characterized in that: the method comprises the following steps:
and (3) processing a base sub-board: selecting any daughter board as a basic daughter board, and then marking the size omega according to the designxAnd ωyProcessing the secondary outer layer image of the foundation daughter board, then processing the foundation daughter board through a rivet hole drilling process, and actually measuring the target size a of the foundation daughter board2And b2Finally, the expansion and contraction coefficient ax of the basic daughter board is calculated according to the numerical values2＝a2÷ωy；ay2＝b2÷ωy；
And (3) pressing the daughter board: selecting any daughter board as a pressing daughter board, and then marking the size omega according to the designxAnd ωyThe method comprises the steps of carrying out foundation processing on the press-fit daughter board, then processing the press-fit daughter board through a rivet hole drilling process, and actually measuring the target size a of the foundation daughter board1And b1Finally, calculating the expansion and contraction coefficient ax of the laminated daughter board according to the numerical values1＝a1÷ωx；ay1＝b1÷ωy；
And (3) pressing the secondary outer layer image of the daughter board: rivet hole target size omega as designedxAnd ωyAnd the coefficient of expansion and contraction ax of the basic daughter board calculated in the above step2And ay2Expansion and contraction coefficient ax of laminated sub-board1And ay1Calculating the design distance dx of the rivet target position of the press-fit daughter board to be omegax×ax2÷ax1，dy＝ωy×ay2÷ay1Then, adjusting the design coordinate of the rivet target position according to the design distance of the rivet target position of the pressed daughter board, and processing the outer side image of the pressed daughter board;
and (3) contraposition press-forming: and pressing the basic daughter board prepared in the basic daughter board processing step and the pressed daughter board obtained in the pressed daughter board secondary outer layer image processing step into a mother board.
2. The primary-secondary board pressing alignment design process method of the PCB as claimed in claim 1, wherein: the processing of the secondary outer layer image in the basic daughter board processing step comprises the following substeps: the method comprises the following steps: inner layer dry film; step two: inner layer AOI; step three: drilling a rivet hole; step four: pressing; step five: drilling; step six: copper deposition/plate electroplating; step seven: turning a next outer layer; step eight: and etching the secondary outer layer.
3. The primary-secondary board pressing alignment design process method of the PCB as claimed in claim 1, wherein: the processing of pressfitting daughter board is handled the pressfitting daughter board through boring rivet hole process in the pressfitting daughter board processing step specifically does: selecting a drilling machine to drill a positioning target and process the outer layer image rotating positioning target on the press-fit paperboard, and actually measuring the distance a between the outer layer image rotating positioning targets of the press-fit daughter board1And b1。
4. The primary-secondary board pressing alignment design process method of the PCB as claimed in claim 3, wherein: the processing of the pressfitting daughter board through the rivet hole drilling process specifically comprises the following steps: selecting an X-ray drilling machine to drill 7 targets on the press-fit daughter board, wherein 3 targets are used for positioning drill holes, 4 targets are used for positioning outer layer images, and the distance a between the outer layer images of the press-fit daughter board and the positioning positions is actually measured1And b1。
5. The primary-secondary board pressing alignment design process method of the PCB as claimed in claim 1, wherein: the basic processing in the step of processing the press-fit daughter board comprises the following substeps: the method comprises the following steps: an inner layer; step two: inner layer AOI; step three: and (6) pressing.
6. The primary-secondary board pressing alignment design process method of the PCB as claimed in claim 1, wherein: in the processing step of the secondary outer layer image of the press-fit daughter board, the distance standard value of the rivet target position is omegaxω y satisfies the following relationship: omega is more than 304.8mmx＜584.2mm、304.8mm＜ωy＜584.2mm。
7. The primary-secondary board pressing alignment design process method of the PCB as claimed in claim 1, wherein: the para-position press-forming step specifically comprises the following steps: and applying high temperature and high pressure to the PCB by a special press to heat and melt the bonding sheet, and pressing the basic daughter board prepared in the basic daughter board processing step and the pressed daughter board obtained in the secondary outer image processing step of the pressed daughter board into a mother board.
8. The primary-secondary board pressing alignment design process method of the PCB as claimed in claim 7, wherein: the temperature range of the high temperature of the special press for the PCB is as follows: the high pressure of the PCB special press ranges from 400 psi to 450psi under the temperature of 20 ℃ to 250 ℃.
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| CN112165779A (en) * | 2020-10-20 | 2021-01-01 | 江西强达电路科技有限公司 | High-precision inner layer laminating method for multilayer PCB |
| CN112261787A (en) * | 2020-10-22 | 2021-01-22 | 江门崇达电路技术有限公司 | Drilling method for large-size printed board |
| CN113873761A (en) * | 2021-09-14 | 2021-12-31 | 景旺电子科技(龙川)有限公司 | Manufacturing method of printed circuit board and printed circuit board |
| CN114189991A (en) * | 2021-10-25 | 2022-03-15 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improved coil plate |
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