KR19980041644A - Carrier to mount boards for printed wiring circuits of various sizes - Google Patents

Abstract

end. The technical field to which the invention described in the claims belongs:

The present invention relates to a carrier capable of mounting a substrate for printed wiring circuits of various sizes.

I. The technical problem the invention is trying to solve:

Conventional factory automation assembly system has to adjust the width of the conveyor belt according to the size of various printed wiring circuit boards of the supplied model, so it is not suitable for the small quantity production system of many kinds, and it causes a lot of manpower and time loss.

All. The gist of the solution of the invention:

The present invention is implemented to fix the substrate for the printed wiring circuit of a different size that the positioning bar is moved to the front and rear direction through the guide groove formed on the frame according to the size of the printed wiring circuit to be mounted in the process. .

la. Important uses of the invention:

Board-mount carrier for printed wiring circuits.

Description

Carrier to mount boards for printed wiring circuits of various sizes

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for mounting a printed circuit board (PCB), and more particularly, to a carrier implemented to be mounted regardless of the size of a printed circuit board (PCB). will be.

Typically, factory automated assembly systems use conveyor belts to fabricate printed wiring circuit boards used in electronic devices, either manually or automatically, using a conveyor belt, depending on the work process. It is a system for assembling by soldering after inserting into a circuit board. However, as technology changes rapidly in recent years, it is necessary to produce new products that meet consumer demand for product diversification in response to technological changes. When producing such products, consumers demand high quality and low price products, so the cost of production must be reduced to lower the price. It can be said that it depends on how the factory automation system is designed to put the minimum number of people in the right place in order to reduce the production cost in order to simplify the manufacturing process or reduce the man-hour, and increase productivity.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows schematically the process of the assembly system of the board | substrate for conventional printed wiring circuits.

As shown in FIG. 1, the board | substrate loading box for printed wiring circuits carries the board | substrate for printed wiring circuits. The operator takes out the printed wiring board and puts it on the conveyor belt, and inserts the corresponding parts indicated in the insert guide while the printed wiring board is moving slowly. Many workers insert only the assigned parts into the printed wiring board, and when the insertion of the parts is completed, the next worker removes the parts indicated in the insert guide on the printed wiring circuit board transferred to the conveyor belt, and then prints them. Insert into the wiring circuit board. As such, the plurality of workers insert only the parts assigned to them among the various parts, and then pass the conveyor belt to the next worker to complete the assembly work. When the components are inserted into the printed circuit board by a number of workers, they are transferred through the conveyor belt to the spray flux. In the spray flux, the flux is applied to the transferred printed wiring circuit board and transferred to the soldering apparatus. The soldering apparatus transfers the solder by soldering the flux-coated printed wiring circuit board from the spray flux. The board for the printed wiring circuit transferred through the soldering apparatus is cooled by a cooling fan. After soldering, the operator moves the cooled printed circuit board to the cutting device and cuts it. When the cutting is completed, it is passed to the next worker, and the next worker uses a component insertion detector to check whether the component is misinserted. This operation is repeated to assemble the board for the printed wiring circuit.

However, since the PCB assembly system for the printed wiring circuit proceeds as described above, only one product can be produced, every time the item of the product is changed, all the parts loaded in the container are removed and then the assembled product is assembled. Production of new product changes by loading parts, attaching new part insert instructions, adjusting the width of conveyor belt to the size of the printed circuit board, and training the workers according to new work. During the preparation of the line, a number of workers rested, resulting in a problem of waste of manpower and productivity.

In order to solve this problem, it is disclosed in detail in 'multi-type mixed flow print board assembly production system and method' filed November 25, 1996.

Such a system is a system capable of assembling various types of printed wiring circuit boards into one production line (the horizontal and vertical sizes of the printed wiring circuit boards are different from each other). same.

The mixed flow production system transfers a plurality of substrates for printed wiring circuits in which components are assembled in each cell at the same time according to the component insertion instruction information using a computer through an upper conveyor. It is then passed through the upper conveyor line to the spray flux and soldering device. Subsequently, the carrier on which the soldered printed circuit board is mounted is transferred to the lower conveyor by an elevator, and the transferred carrier is transferred to the lower conveyor of each work station through the lower conveyor line. Subsequently, the process is returned to the corresponding cell by the carrier type recognition unit and the lifter.

As described above, there has been provided a carrier which is a device on which a substrate for printed wiring circuit is mounted so that various substrates for printed wiring circuit can be simultaneously conveyed through a conveyor belt having the same width.

As described above, the conventional factory automation assembly system is suitable for mass production because the width of the conveyor belt, spray flex, soldering device, cutting device, etc. must be adjusted according to the size of various printed wiring circuit boards of the supplied model. It was not suitable for the system, and there was a problem that a lot of manpower and time were lost.

Accordingly, an object of the present invention for solving the above problems is to provide a carrier that can be mounted to the substrate for a printed wiring circuit having a variety of sizes depending on the model when different products are simultaneously put into the manufacturing process.

Another object of the present invention is to provide a carrier incorporating a solder preventing frame that blocks solder from flowing to an upper portion of a substrate for a printed wiring circuit during a soldering process.

Still another object of the present invention is to provide a carrier which can be transported through a roller chain conveyor having the same width regardless of the size of a printed wiring circuit board to be mounted.

It is still another object of the present invention to provide a carrier having a latching jaw and a leaf spring which prevents warping of a substrate for a printed wiring circuit generated by heat during soldering.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic diagram which showed the structure of the board | substrate assembly system for conventional printed wiring circuits.

2 is a perspective view of a carrier that can be mounted on a substrate for a printed wiring circuit of various sizes according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of the carrier of FIG. 2 taken along the line AA ′. FIG.

4 is a cross-sectional view of the portion B in FIG.

5 is a state diagram of a carrier mounted with a substrate for a printed wiring circuit according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used for the same components, even if displayed on different drawings. In describing the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.

2 is a perspective view of a carrier that can be mounted on a substrate for a printed wiring circuit of various sizes according to an embodiment of the present invention.

Referring to the configuration of the carrier with reference to Figure 2, the frame 10 having a square frame shape is formed with a square space therein, along the upper side of the frame facing the front and rear sides? Quot; Shaped guide grooves 14a and 14b are formed. On the other hand, the guides 16a and 16b are fitted in the guide grooves 14a and 14b, respectively, and perform a linear relaxation motion in the front (50) and rear (60) directions along the guide grooves 14a and 14b. The guides 16a and 16b are inserted into grooves formed in the shape of c at both ends of the positioning bar 12 and fastened by screws. The guides 14a and 14b are fixed to the upper surfaces of the guide grooves 14a and 14b by fixing screws 18a and 18b formed at both ends of the positioning bar 12. . The heads of the fixing screws 18a and 18b for fixing the guides 16a and 16b protrude upwards of the positioning bar 12, and the screw portions are formed on the upper surfaces of the guide grooves 14a and 14b through holes formed in the positioning bar 12 and the guides 16a and 16b. It is formed to support. Coupling grooves 32a and 32b are formed on the inner surface of the frame 10 in which the guide grooves 14a and 14b are formed to fit the lower ends of the c-shaped grooves formed at both ends of the positioning bar 12.

In addition, the left side of the front frame of the frame 10 is fastened to the frame 10 by a screw so that the solder bumps 28 protrude downward and bent inwardly along the bottom surface. On the other hand, on the left frame (corner surface) of the symmetrical front and rear of the frame 10, two screw holes are formed to which the cell recognition pin 30 for detecting the worktable position is fastened. The cell recognition pin 30 is fastened to the screw hole by screws, and the fastening position and direction are determined by the position of the workbench on which the substrate for the printed wiring circuit is worked.

The stop grooves 34a and 34b are formed in the center of the outer surface of the left and right frames of the frame 10, and the locking jaws 22a and 22b of the B shape are formed at predetermined intervals (the spacing becomes wider from the front to the rear) on the bottom of the right frame of the frame 10. And 22c and 22d are fastened inwardly. In addition, the locking bar 20a, 20b, 20c, and 20d are fastened to protrude while facing the locking bar 22a, 22b, 22c, and 22d on the bottom surface of the positioning bar 12, so as to correspond to the engaged locking step 20a, 20b, 20c, and 20d. One side of the leaf springs 24a, 24b, 24c and 24d is fastened to the upper side of the positioning bar 12 by the fastening screws 26a, 26b, 26c and 26d. The plate springs 24a, 24b, 24c, and 24d fastened to the upper side of the positioning bar 12 are not bent at an angle (90 ° or less) at the corners of the positioning bar 12 so as to form a space with the side of the positioning bar 12. The other side is formed so as not to touch the left and right sides of the groove formed in the protruding engaging projection 20a, 20b, 20c, 20d.

3 is a cross-sectional view of the carrier of FIG. 2 taken along the line AA ′.

Referring to the configuration of the cross section with reference to Figure 3, the engaging inner surface of the locking jaw 20c is fastened by a screw to be in line with the inner surface of the positioning bar 12, the protrusion of the locking jaw 20c and the protrusion of the solder bumps 28 It is formed at the same height. In addition, the leaf spring 24c fastened by the fastening screw 26c on the upper side of the positioning bar 12 is refracted at a predetermined angle (90 ° or less) at the corner of the positioning bar 12 to form a space with the side of the positioning bar 12. At the lower end, the side of the positioning bar 12 is refracted at a predetermined angle. The leaf spring 24c is double-refractive at the corners and the lower end so that the other side which is not fastened to the positioning bar 12 does not touch the left and right sides of the groove formed in the locking step 20c. The leaf spring 24c is formed to be refracted in two stages in order to form a space between the side of the positioning bar 12 and the leaf spring 24c so that the leaf spring 24c can be tensioned.

On the other hand, the engaging inner surface of the locking jaw 22c is fastened by a screw to be in line with the inner surface of the frame 10, the protrusion of the locking jaw 22c is formed to the same height as the protrusion of the solder bumps 28 is formed to face the locking jaw 20c .

FIG. 4 is a cross-sectional view for showing a coupling relationship of the portion B shown in FIG. 2.

Referring to FIG. 4, the cross-sectional structure of part B is described. The guide 16a is inserted into the guide groove 14a formed on the frame 10, and the upper protrusion of the c-shaped groove formed at the end of the positioning bar 12 is an upper side surface of the frame 10. And guide 16a and the lower protrusion is fitted to the lower side of frame 10. Guide 16a is fastened by a covering positioning bar 12 and two screws. The guide 16a and the positioning bar 12 fastened by screws have a head protruding upward of the positioning bar 12, and the screw portion is formed to support the upper surface of the guide groove 14a through the holes formed in the positioning bar 12 and the guide 16a. The lowering action of the screw 18a accompanies the synergism of the positioning bar 12 and is fixed to the frame 10. In addition, on the lower side of the frame 10, the anti-storage jaw 28 protrudes downward to the same depth as that of the locking jaw 20a, 20b, 20c, 20d and the locking jaw 22a, 22b, 22c, 22d, and is formed in an inwardly bent shape. It is fastened to the lower surface of the frame 10 by the.

FIG. 5 is a state diagram in which a printed circuit board (PCB) is mounted on a carrier having the form shown in FIG. 2.

Hereinafter, an operation of mounting a printed circuit board (PCB) on a carrier will be described with reference to FIG. 5.

When the operator loosens the set screws 18a and 18b by turning them counterclockwise, the guides 16a and 16b move along the guide grooves 14a and 14b in the forward (50) and rear (60) directions. The spacing of the lower protrusions of the grooves formed at both ends of the determination bar 12 is widened. When the fixing is released, the operator moves the positioning bar 12 indicated by the arrow so that the space between the right frame of the frame 10 where the locking step 22a, 22b, 22c, 22d is fastened and the positioning bar 12 is wide enough for the PCB to be inserted. Direction in 50 directions. When the positioning bar 12 is moved by the operator, the guides 16a and 16b which are screwed to both ends of the positioning bar 12 move in 50 directions along the guide grooves 14a and 14b.

When the operator determines that the positioning bar 12 is moved enough to insert the PCB, the operator places it on the protrusions of the latching jaws 22a, 22b, 22c, 22d fastened to the frame 10 and the solder bumps 28 formed on the frame 10 so that the PCB is supported by the carrier. When the PCB is placed on the projections of the latching jaws 22a, 22b, 22c, and 22d and the solder bumps 28, the operator should contact the plate springs 24a, 24b, 24c and 24d where the unsupported side of the PCB is fastened to the positioning bar 12 and then apply a constant tension. The guides 16a and 16b are moved along the guide grooves 14a and 14b in the rear direction until they have a 60 direction. If the operator determines that the sides of the PCB are in close contact with the leaf springs 24a, 24b, 24c, and 24d until they have a constant tension, then the fixing screws 18a and 18b are turned clockwise to fix the guides 16a, 16b and the positioning bar 12 to the frame 10. Turn to When the fixing screws 18a and 18b are turned clockwise, the ends of the fixing screws 18a and 18b press the upper surfaces of the guide grooves 14a and 14b, and the positioning screws 18a and 18b press the upper surfaces of the guide grooves 14a and 14b. Bar 12 rises up. As the positioning bar 12 rises upward, the lower protrusions of the grooves formed at both ends of the positioning bar 12 are brought into close contact with the underside of the frame 10, and the guides 16a, 16b and the positioning bar 12 are fixed to the frame 10 by being forced upward.

If, by the above operation, the side of the PCB is in close contact with the plate springs 24a, 24b, 24c, and 24d to have a certain elasticity, but it is not correctly mounted on the latching jaw 20a, 20b, 20c, 20d fastened to the positioning bar 12 The operator presses the PCB from above to allow the PCB to be accurately seated on the latching jaws 20a, 20b, 20c, and 20d by the elasticity of the leaf springs 24a, 24b, 24c and 24d. The PCB is securely seated on the latching jaws 20a, 20b, 20c, and 20d in order to prevent bending of the PCB during the soldering process because the side surfaces of the PCB are fixed by refractive gaps formed at the lower ends of the plate springs 24a, 24b, 24c, and 24d.

The operation of mounting the PCB to the carrier by the above-described operation is performed only for the carrier which is inserted into the carrier for the first time into the factory automated assembly system until the process is completed and returned. Since the returned carrier has been adjusted to the width of the PCB to be assembled, it is necessary to detach the mounted PCB using the tension of the leaf springs 24a, 24b, 24c, and 24d without the need to mount the PCB to the carrier according to the above operation. PCB can be mounted.

In order to attach and detach the positioning bar 12 from the frame 10, the lower protrusions of the grooves formed at both ends of the positioning bar 12 can be positioned and detached from the engaging grooves 32a and 32b.

As described above, the present invention enables mounting of printed circuit boards of various sizes on a carrier, thereby enabling transfer between processes through conveyor belts regardless of the type of product, enabling a small quantity production system of various types, and inevitable manpower. It is possible to prevent the loss of time, thereby reducing the cost of the product.

Claims (12)

In the carrier which can mount the board | substrate for printed wiring circuits of various sizes, Guide grooves 14a and 14b are formed on opposite frames of the square frame 10, and one side bottom surface of the positioning bar 12 horizontally moves forward and backward along the guide grooves 14a and 14b. Locking jaw (20a, 20b, 20c, 20d) is formed in, and the locking step (22a, 22b, 22c, on the bottom side of one side of the frame 10 to face the locking jaw (20a, 20b, 20c, 20d), A carrier capable of mounting a substrate for printed wiring circuits of various sizes, characterized in that 22d) is formed. The method of claim 1, The leaf springs 24a, 24b, 24c, and 24d are fastened to the upper surface of the positioning bar 12 so as to correspond to the locking jaw 20a, 20b, 20c, and 20d, and formed from top to bottom along the side surface. Carrier for mounting boards for printed wiring circuits of various sizes. The method of claim 1, A carrier capable of mounting a substrate for a printed wiring circuit of various sizes, characterized in that a solder bump (28) having a shape in which the guide groove (14a) is formed is refracted in two stages from the bottom left to the right side of the frame (10). The method of claim 1, Guides 16a and 16b are inserted into the guide grooves 14a and 14b, and both sides of the positioning bar 12 are fastened to the guides 16a and 16b. Carrier which we can attach. The method of claim 4, wherein The guide grooves 14a and 14b are provided at both sides of the positioning bar 12 fastened to the guides 16a and 16b through screw grooves formed to penetrate the positioning bar 12 and the guides 16a and 16b. Fixing screws (18a, 18b) is formed to support the upper surface of the carrier that can be mounted substrate for a printed wiring circuit of various sizes. The method according to claim 1 or 5, Coupling grooves 32a and 32b having predetermined depths and widths are formed on both inner surfaces of the frame 10 on which the guide grooves 14a and 14b are formed to allow the positioning bar 12 to be attached or detached. Carrier capable of mounting a substrate for a printed wiring circuit of various sizes, characterized in that. The method according to claim 1 or 5, And a stop groove (34a, 34b) is formed so as to be symmetrical to both outer surfaces of the frame (10) in which the guide groove (14a, 14b) is not formed. The method according to claim 1 or 7, Forming a screw groove on the left and right symmetrical edges of the frame 10 enables fastening the cell recognition plate 30 to distinguish the types of carriers. carrier. In the carrier having a frame 10 formed in a rectangular shape so as to mount substrates for printed wiring circuits of various sizes, Guide grooves (14a, 14b) formed in the front and rear directions on the frame facing the frame (10); Guides 16a and 16b fitted into the guide grooves 14a and 14b; Positioning bars 12 fitted with grooves formed at both ends of the inner surface of the frame 10 and the guides 16a and 16b and fastened to the guides 16a and 16b by screws; A set screw (18a, 18b) formed to support the top surface of the guide groove (14a, 14b) through a screw groove formed to penetrate the positioning bar 12 and the guide (16a, 16b); Engaging jaw (20a, 20b, 20c, 20d) is fastened to the bottom surface of the side of the positioning bar 12, the protrusion is formed in a direction perpendicular to the side of the positioning bar (12); Locking jaws (22a, 22b, 22c, 22d) which are fastened to face the engaging jaw (20a, 20b, 20c, 20d) on the bottom of the frame (10) to form protrusions in the direction of the positioning bar (12); Plate springs 24a, 24b, 24c, and 24d fastened to an upper surface of the positioning bar 12 so as to correspond to the locking jaws 20a, 20b, 20c, and 20d and formed from top to bottom along side surfaces thereof; Carrier capable of mounting a substrate for a printed wiring circuit of various sizes, characterized in that it is fastened to the bottom surface of the frame 10 in which the guide groove 14a is formed, and is formed of a solder preventing jaw 28 having a protrusion therein. . The method of claim 9, Coupling grooves 32a and 32b having predetermined depths and widths are formed on both inner surfaces of the frame 10 on which the guide grooves 14a and 14b are formed to allow the positioning bar 12 to be attached or detached. Carrier capable of mounting a substrate for a printed wiring circuit of various sizes, characterized in that. The method of claim 10, And a stop groove (34a, 34b) is formed so as to be symmetrical to both outer surfaces of the frame (10) in which the guide groove (14a, 14b) is not formed. The method of claim 11, Carrier capable of mounting a substrate for a printed wiring circuit of various sizes, characterized in that the screw groove for fastening the cell recognition plate 30 is formed on the symmetrical edge surface of the frame (10).