KR19980037815A - Semiconductor package with high breakdown voltage insulation structure - Google Patents
Semiconductor package with high breakdown voltage insulation structure Download PDFInfo
- Publication number
- KR19980037815A KR19980037815A KR1019960056625A KR19960056625A KR19980037815A KR 19980037815 A KR19980037815 A KR 19980037815A KR 1019960056625 A KR1019960056625 A KR 1019960056625A KR 19960056625 A KR19960056625 A KR 19960056625A KR 19980037815 A KR19980037815 A KR 19980037815A
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- semiconductor package
- semiconductor
- lead frame
- film
- semiconductor chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
본 발명은 반도체 패키지에 있어서, 특히 하나의 리드 프레임에 복수의 반도체 칩을 부착하여 형성되는 반도체 패키지에 있어서, 더욱 상세히 말하자면, 상기 반도체 칩 중 하나 이상의 반도체 칩을 상기 리드 프레임에 절연 물질을 이용하여 부착하여 형성되는 반도체 패키지에 있어서, 상기 하나 이상의 반도체 칩의 밑면에는 절연막이 형성되어 있으며, 상기 절연막이 형성된 반도체 칩은 상기 절연 물질을 이용하여 상기 리드프레임에 부착되어 있으며, 또한 상기 리드 프레임상의 절연 물질 부착 부분을 둘러싸는 부분에는 소정 폭 및 소정 깊이의 홈이 형성되어 있는 것을 특징으로 한다.The present invention relates to a semiconductor package, in particular, a semiconductor package formed by attaching a plurality of semiconductor chips to one lead frame. More specifically, at least one semiconductor chip of the semiconductor chips may be formed by using an insulating material on the lead frame. A semiconductor package formed by attaching an insulating film, wherein an insulating film is formed on a bottom surface of the at least one semiconductor chip, and the semiconductor chip on which the insulating film is formed is attached to the lead frame using the insulating material. The portion surrounding the material attachment portion is formed with a groove having a predetermined width and a predetermined depth.
Description
본 발명은 반도체 패키지에 관한 것으로서, 특히 하나의 리드 프레임에 복수의 반도체 칩을 접착하여 형성되는 반도체 패키지, 더욱 상세히 말하자면 상기 반도체 칩 중 하나 이상의 반도체 칩을 상기 리드 프레임에 절연 물질을 이용하여 접착하여 형성되는 반도체 패키지에 관한 것이다,BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly to a semiconductor package formed by adhering a plurality of semiconductor chips to a single lead frame, and more particularly, by bonding one or more semiconductor chips of the semiconductor chips to the lead frame by using an insulating material. It relates to a semiconductor package formed,
하나 이상의 반도체 칩을 절연 물질을 이용하여 리드 프레임에 접착하여 형성되는 반도체 패키지의 공지예로서, 도 1 과 같이 반도체 스위칭 소자(10)와 상기 스위칭 소자(10)를 제어하는 제어용 집적 회로(20)가 하나의 리드 프레임(30)에 탑재된 반도체 패키지를 들 수 있다.As a known example of a semiconductor package formed by adhering at least one semiconductor chip to a lead frame using an insulating material, a control integrated circuit 20 for controlling the semiconductor switching element 10 and the switching element 10 as shown in FIG. 1. And a semiconductor package mounted on one lead frame 30.
이 경우에 반도체 스위칭 소자(10)를 리드 프레임(30)에 납땜하고, 제어용 집적 회로(20)를 리드 프레임(30)에 절연 물질을 이용하여 접착시킨다. 여기서 반도체 스위칭 소자(10)가 모스펫인 경우 드레인 단자가 납땜되며, 제어용 집적 회로(20)와 리드프레임(30) 상호간에는 고내압 절연이 요구되므로 절연 물질로서 절연 에폭시를 사용하게 된다. 이 때, 형성된 에폭시막(50)의 내부에 기포(51) 등이 형성될 수 있으며, 이에 의해서 절연이 파괴될 수 있다. 이런 불량은 전체 전원 장치의 동작을 멈추게 한다. 또한 제어용 집적 회로(10)의 전면에 걸쳐 일정한 내압이 나올 수 있도록, 에폭시막(50)의 두께를 일정하게 조절하는 것이 용이하지 않다. 이러한 문제들을 해결하기 위하여 에폭시막(50)과 제어용 집적 회로(20) 사이에 절연지(isolation sheet)를 삽입하는 방법이 있다. 그러나 이 방법은 기존의 반도체 공정 외에 별도의 공정을 요하는 단점이 있다.In this case, the semiconductor switching element 10 is soldered to the lead frame 30, and the control integrated circuit 20 is bonded to the lead frame 30 using an insulating material. In this case, when the semiconductor switching device 10 is a MOSFET, the drain terminal is soldered, and since the high breakdown voltage is required between the control integrated circuit 20 and the lead frame 30, an insulating epoxy is used as the insulating material. At this time, bubbles 51 and the like may be formed in the formed epoxy film 50, whereby insulation may be destroyed. This failure causes the entire power supply to stop working. In addition, it is not easy to constantly adjust the thickness of the epoxy film 50 so that a constant breakdown voltage is provided over the entire surface of the control integrated circuit 10. In order to solve these problems, there is a method of inserting an isolation sheet between the epoxy film 50 and the control integrated circuit 20. However, this method has a disadvantage of requiring a separate process in addition to the conventional semiconductor process.
반도체 공정 기술의 발전에 따라 반도체 스위칭 소자(10)와 제어용 집적 회로(20)를 하나의 웨이퍼에서 하나의 칩으로 구현하는 스마트 전력 소자 제조 공정이 개발되어 이를 이용한 집적 회로가 출시되고 있다. 그러나, 아직 보편화되지 않은 기술이어서 널리 사용되지는 않고 있고, 집적 회로의 가격이 비싼 편이다.With the development of semiconductor process technology, a smart power device manufacturing process for implementing the semiconductor switching device 10 and the control integrated circuit 20 in one chip has been developed and an integrated circuit using the same has been released. However, because it is not yet widely used, it is not widely used, and integrated circuits are expensive.
본 발명의 목적은 이와 같은 종래 기술의 문제점을 해결하기 위하여, 기존의 반도체 공정을 이용하여 반도체 칩과 리드 프레임을 효과적으로 절연함으로써, 고내압 절연 구조를 가지는 반도체 패키지를 제공하는 데 있다.An object of the present invention is to provide a semiconductor package having a high breakdown voltage insulating structure by effectively insulating the semiconductor chip and the lead frame using a conventional semiconductor process in order to solve such problems of the prior art.
상기 목적을 달성하기 위하여, 본 발명은 하나의 리드 프레임에 복수의 반도체 칩을 부착하여 형성되는 반도체 패키지에 있어서, 특히 상기 반도체 칩 중 하나 이상의 반도체 칩을 상기 리드 프레임에 절연 물질을 이용하여 부착하여 형성되는 반도체 패키지에 있어서, 상기 하나 이상의 반도체 칩의 밑면에는 절연막이 형성되어 있으며, 상기 절연막이 형성된 반도체 칩은 상기 절연 물질을 이용하여 상기 리드프레임에 부착되어 있으며, 또한 상기 리드 프레임상의 절연 물질 부착 부분을 둘러싸는 부분에는 소정 폭 및 소정 깊이의 홈이 형성되어 있는 것을 특징으로 한다.In order to achieve the above object, the present invention is a semiconductor package formed by attaching a plurality of semiconductor chips to one lead frame, in particular by attaching at least one semiconductor chip of the semiconductor chip to the lead frame by using an insulating material In the semiconductor package to be formed, an insulating film is formed on the bottom surface of the at least one semiconductor chip, the semiconductor chip with the insulating film is attached to the lead frame using the insulating material, and the insulating material on the lead frame attached The part surrounding the part is characterized in that a groove having a predetermined width and a predetermined depth is formed.
도 1 은 종래 기술에 의한, 절연 구조를 가지는 반도체 패키지의 일 예.1 is an example of a semiconductor package having an insulating structure according to the prior art.
도 2 는 본 발명에 의한, 절연 구조를 가지는 반도체 패키지의 일 실시예.2 is an embodiment of a semiconductor package having an insulating structure according to the present invention.
도 3 은 도 2 의 우측 부분의 확대도.3 is an enlarged view of the right part of FIG. 2;
도 4 는 도 3 의 평면도.4 is a plan view of FIG.
이하, 첨부 도면을 참조하여 본 발명을 보다 상세히 설명하고자 한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
본 발명의 일 실시예로서, 도 2 와 같이 하나의 리드 프레임(30)에 반도체 스위칭 소자(10)와 제어용 집적 회로(20)가 부착되어 있는 반도체 패키지를 살펴 보겠다.As an embodiment of the present invention, a semiconductor package in which the semiconductor switching element 10 and the control integrated circuit 20 are attached to one lead frame 30 will be described.
제어용 집적 회로(20)의 밑면에는 절연막(21)이 형성되어 있는 데, 이는 제어용 집적 회로(20)의 제조시 웨이퍼 밑면에 기존의 반도체 공정을 이용하여 형성된 것이다. 절연막(21)은 그 막질이 매우 균일하고 그 두께가 일정하며, 그 내부에 기포가 형성될 염려가 거의 없으므로, 절연막(21)이 형성되어 있지 않은 종래 기술에 비해 절연에 있어 효과적이다. 절연막(21)으로서, 실리콘 질화막, 실리콘 산화막, BCB(benzocyclobutane) 코팅막 등을 이용할 수 있다. 상기 절연막(21)들은 온도에 대한 절연 특성이 뛰어나고 견고하다. 실리콘 질화막을 이용하는 경우에는, 제어용 집적 회로(20)의 제조시 실리콘 질화물을 침적시켜서 실리콘 질화막을 형성할 수 있는 데, 이 방법에 의해서 2μm 의 두께를 얻어 내압을 측정한 결과, 800 내지 900 볼트의 고절연 내압을 얻을 수 있었다. 일반적으로 절연막(21)으로서, 실리콘 질화막이나 실리콘 산화막을 이용하는 경우에는 그 두께가 2μm 이상, BCB(benzocyclobutane) 코팅막을 이용하는 경우에는 그 두께가 10μm 이상인 것이 적당하다.An insulating film 21 is formed on the bottom surface of the control integrated circuit 20, which is formed by using a conventional semiconductor process on the bottom surface of the wafer in manufacturing the control integrated circuit 20. Since the insulating film 21 has a very uniform film quality and a constant thickness, and little bubbles are formed therein, the insulating film 21 is more effective in insulation than in the prior art in which the insulating film 21 is not formed. As the insulating film 21, a silicon nitride film, a silicon oxide film, a BCB (benzocyclobutane) coating film, or the like can be used. The insulating films 21 have excellent insulation properties with respect to temperature and are robust. In the case of using a silicon nitride film, silicon nitride film can be formed by depositing silicon nitride during manufacture of the control integrated circuit 20. A thickness of 2 μm was obtained by this method, and the breakdown voltage was measured. High insulation breakdown voltage was obtained. In general, when the silicon nitride film or the silicon oxide film is used as the insulating film 21, the thickness is preferably 2 μm or more, and when the BCB (benzocyclobutane) coating film is used, the thickness is 10 μm or more.
절연막(21)이 형성된 제어용 집적 회로(20)는, 절연 에폭시 등의 절연성 접착 물질을 이용하여 홈(31)이 파진 리드 프레임(30)에 부착된다. 이 후 제어용 집적 회로(20)는 리드프레임(30)에 납땜되어 있는 반도체 스위칭 소자(10)와 전기적으로 연결되고, 또한 각 소자는 리드프레임(30)의 리드부와 전기적으로 연결된다. 이 결과물을 몰드 컴파운드(60)를 이용하여 덮는다. 이 때 제어용 집적 회로(20)의 측면은 몰드 컴파운드(60)로, 제어용 집적 회로(20)의 밑면은 절연막(21)으로 절연이 확보된다.In the control integrated circuit 20 in which the insulating film 21 is formed, the groove 31 is attached to the broken lead frame 30 using an insulating adhesive material such as an insulating epoxy. Thereafter, the control integrated circuit 20 is electrically connected to the semiconductor switching element 10 soldered to the lead frame 30, and each element is electrically connected to the lead portion of the lead frame 30. This resultant is covered using the mold compound 60. At this time, the side surface of the control integrated circuit 20 is a mold compound 60, the bottom surface of the control integrated circuit 20 is secured by the insulating film 21.
또한 리드프레임상에 형성된 홈(31)에 있어서, 제어용 집적 회로(20)의 측면 경계 부위와 홈(31) 사이의 거리(A)는, 홈(31)이 형성되어 있지 않을 경우의 제어용 집적 회로(20)의 측면 경계 부위와 리드 프레임(30) 사이의 거리보다 크므로, 다른 조건이 같을 때, 홈(31)이 있는 경우가 없는 경우보다 측면 절연 내압 확보에 있어 유리하다. 몰드 컴파운드(60)의 종류에 따라, 원하는 절연 내압을 확보할 수 있도록 홈(31)의 폭 및 깊이가 조절되는 데, 보통 각각 100μm 이상이 된다.In the groove 31 formed on the lead frame, the distance A between the side boundary portion of the control integrated circuit 20 and the groove 31 is the control integrated circuit when the groove 31 is not formed. Since it is larger than the distance between the side boundary part of (20) and the lead frame 30, when other conditions are the same, it is advantageous in ensuring side insulation withstand voltage than when there is no groove | channel 31. Depending on the type of the mold compound 60, the width and depth of the groove 31 are adjusted to ensure a desired dielectric breakdown voltage, which is usually 100 μm or more.
본 발명은, 기존의 반도체 공정 외의 별도의 공정을 요하지 않으며, 절연 접착막의 기포 등에 의한 절연 불량 문제를 해결함과 동시에 절연 내압의 증가를 가져올 수 있다.The present invention does not require a separate process other than the conventional semiconductor process, and solves the problem of poor insulation caused by bubbles of the insulating adhesive film, and at the same time, may increase the insulation breakdown voltage.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960056625A KR100218259B1 (en) | 1996-11-22 | 1996-11-22 | Semiconductor package having a high pressure insulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960056625A KR100218259B1 (en) | 1996-11-22 | 1996-11-22 | Semiconductor package having a high pressure insulation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980037815A true KR19980037815A (en) | 1998-08-05 |
| KR100218259B1 KR100218259B1 (en) | 1999-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960056625A KR100218259B1 (en) | 1996-11-22 | 1996-11-22 | Semiconductor package having a high pressure insulation structure |
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| Country | Link |
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| KR (1) | KR100218259B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200009613A (en) * | 2018-07-19 | 2020-01-30 | 한국과학기술원 | Fabrication of flexible material for efficient heat dissipation of chip and cooling method thereof |
| KR20200065320A (en) | 2018-11-30 | 2020-06-09 | 주식회사 브이씨텍 | Semiconductor device package having high breakdown voltage insulation structure |
| KR20200065351A (en) | 2018-11-30 | 2020-06-09 | 주식회사 브이씨텍 | Insulation and cooling structure for semiconductor device packaging |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6041861B2 (en) * | 1980-03-25 | 1985-09-19 | 三菱電機株式会社 | semiconductor equipment |
| JPS5732662A (en) * | 1980-08-07 | 1982-02-22 | Nippon Telegr & Teleph Corp <Ntt> | Ceramic multilayer wiring board |
-
1996
- 1996-11-22 KR KR1019960056625A patent/KR100218259B1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200009613A (en) * | 2018-07-19 | 2020-01-30 | 한국과학기술원 | Fabrication of flexible material for efficient heat dissipation of chip and cooling method thereof |
| KR20200065320A (en) | 2018-11-30 | 2020-06-09 | 주식회사 브이씨텍 | Semiconductor device package having high breakdown voltage insulation structure |
| KR20200065351A (en) | 2018-11-30 | 2020-06-09 | 주식회사 브이씨텍 | Insulation and cooling structure for semiconductor device packaging |
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| Publication number | Publication date |
|---|---|
| KR100218259B1 (en) | 1999-09-01 |
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