KR19980024359A - 막두께 측정장치 - Google Patents
막두께 측정장치 Download PDFInfo
- Publication number
- KR19980024359A KR19980024359A KR1019970045908A KR19970045908A KR19980024359A KR 19980024359 A KR19980024359 A KR 19980024359A KR 1019970045908 A KR1019970045908 A KR 1019970045908A KR 19970045908 A KR19970045908 A KR 19970045908A KR 19980024359 A KR19980024359 A KR 19980024359A
- Authority
- KR
- South Korea
- Prior art keywords
- space
- measurement
- carrier
- film thickness
- cover member
- Prior art date
Links
- 238000005259 measurement Methods 0.000 claims abstract description 59
- 238000012360 testing method Methods 0.000 claims abstract description 23
- 239000012535 impurity Substances 0.000 claims abstract description 14
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 claims description 75
- 238000007689 inspection Methods 0.000 claims description 16
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 230000003472 neutralizing effect Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 8
- 239000010408 film Substances 0.000 description 71
- 235000012431 wafers Nutrition 0.000 description 46
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 230000005611 electricity Effects 0.000 description 7
- 230000003068 static effect Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (12)
- 피검사체를 도입하는 도입스테이지와;측정공간을 형성하는 측정공간용 덮개부재;측정공간용 덮개부재내에 배치됨과 더불어 피검사체를 재치하는 검사대;검사대상의 피검사체에 대해서 측정광을 조사하는 측정광 조사부와, 피검사체로부터의 측정광을 수광하는 측정광 검출부;도입스테이지와 측정공간용 덮개부분의 사이에 배치되고, 반송공간을 형성하는 반송공간용 덮개부재 및;반송공간용 덮개부재내에 배치됨과 더불어 피검사체를 도입스테이지로부터 측정공간으로 반송하는 반송장치를 구비하여 구성되고,상기 측정공간용 덮개부재와 반송공간용 덮개부재에 각각 측정공간 및 반송공간내에 불순물이 적은 순수가스를 도입하는 순수가스도입부를 설치한 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 측정공간용 덮개부재와 반송공간용 덮개부재에 순수가스도입부에 인접해서 순수가스도입부로부터 도입되는 순수가스를 전기적으로 중화시키는 이오나이저를 설치한 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 순수가스도입부는 순수가스로서 불활성가스, 또는 불활성가스와 산소를 포함한 혼합가스를 도입하는 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 순수가스도입부는 순수가스로서 -50℃ 이하의 노점을 갖춘 가스를 도입하는 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 순수가스도입부는 측정공간 및 반송공간내에 순수가스를 도입하고, 이것에 의해 측정공간 및 반송공간은 외기에 대해서 양압으로 유지되는 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 피검사체는 도입스테이지에 있어서 밀폐캐리어박스내에 배치된 캐리어내에 수납되는 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 도입스테이지에는 밀폐캐리어박스내의 캐리어를 재치하는 승강대가 조입되고, 승강대는 도입스테이지와 이 도입스테이지 아랫쪽의 반송공간과의 사이를 승강하는 것을 특징으로 하는 막두께 측정장치.
- 제7항에 있어서, 상기 반송공간용 덮개부에 따라 형성된 반송공간은 캐리어 반송공간과 피검사체 반송공간으로 구획되고,상기 승강대는 캐리어 반송공간으로 하강해서 캐리어를 반송하는 것을 특징으로 하는 막두께 측정장치.
- 제8항에 있어서, 상기 캐리어반송공간에는 승강대의 캐리어를 반송하는 제1반송아암과, 이 제1반송아암에 따라 반송되는 캐리어를 피검사체 반송공간으로 보내는 엘리베이터가 설치되어 있는 것을 특징으로 하는 막두께 측정장치.
- 제9항에 있어서, 상기 피검사체 반송공간에는 캐리어내의 피검사체를 검사대로 반송하는 제2반송아암이 설치되어 있는 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 측정공간용 덮개부재와 반송공간용 덮개부재가 일체로 형성되고, 측정공간용 덮개부재 및 반송공간용 덮개부재 내부에 설치된 구획벽에 의해 측정공간과 반송공간이 형성되어 있는 것을 특징으로 하는 막두께 측정장치.
- 제1항에 있어서, 상기 측정공간용 덮개부재 및 반송공간용 덮개부재중 어느 하나에 내부의 가스를 배기하는 배기장치를 설치한 것을 특징으로 하는 막두께 측정장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25783496A JP3656337B2 (ja) | 1996-09-06 | 1996-09-06 | 膜厚測定装置 |
JP96-257834 | 1996-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19980024359A true KR19980024359A (ko) | 1998-07-06 |
KR100479986B1 KR100479986B1 (ko) | 2005-07-28 |
Family
ID=17311790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970045908A KR100479986B1 (ko) | 1996-09-06 | 1997-09-05 | 막두께측정장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5818596A (ko) |
JP (1) | JP3656337B2 (ko) |
KR (1) | KR100479986B1 (ko) |
TW (1) | TW430116U (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7245376B2 (en) * | 1995-09-20 | 2007-07-17 | J. A. Woollam Co., Inc. | Combined spatial filter and relay systems in rotating compensator ellipsometer/polarimeter |
US7633625B1 (en) | 1995-09-20 | 2009-12-15 | J.A. Woollam Co., Inc. | Spectroscopic ellipsometer and polarimeter systems |
US7304737B1 (en) | 1995-09-20 | 2007-12-04 | J.A. Woollam Co., Inc | Rotating or rotatable compensator system providing aberation corrected electromagnetic raadiation to a spot on a sample at multiple angles of a incidence |
US7616319B1 (en) | 1995-09-20 | 2009-11-10 | James D. Welch | Spectroscopic ellipsometer and polarimeter systems |
US7158231B1 (en) | 1995-09-20 | 2007-01-02 | J.A. Woollam Co., Inc. | Spectroscopic ellipsometer and polarimeter systems |
US7336361B1 (en) | 1995-09-20 | 2008-02-26 | J.A. Woollam Co., Inc. | Spectroscopic ellipsometer and polarimeter systems |
JP3422799B2 (ja) * | 1998-05-01 | 2003-06-30 | 東京エレクトロン株式会社 | 膜厚測定装置、基板処理方法並びに基板処理装置 |
US6519045B2 (en) * | 2001-01-31 | 2003-02-11 | Rudolph Technologies, Inc. | Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment |
JP2002267419A (ja) * | 2001-03-14 | 2002-09-18 | Horiba Ltd | 膜厚測定装置 |
US20020163632A1 (en) * | 2001-05-02 | 2002-11-07 | Ya-Chan Cheng | Measuring system of a gas stream environment |
US7253900B1 (en) | 2003-05-28 | 2007-08-07 | J.A. Woollam Co., Inc. | Ellipsometer or polarimeter and the like system with multiple detector element detector in environmental control chamber including secure sample access |
US7319530B1 (en) * | 2004-03-29 | 2008-01-15 | National Semiconductor Corporation | System and method for measuring germanium concentration for manufacturing control of BiCMOS films |
US7564552B2 (en) * | 2004-05-14 | 2009-07-21 | Kla-Tencor Technologies Corp. | Systems and methods for measurement of a specimen with vacuum ultraviolet light |
US7359052B2 (en) * | 2004-05-14 | 2008-04-15 | Kla-Tencor Technologies Corp. | Systems and methods for measurement of a specimen with vacuum ultraviolet light |
JP4677754B2 (ja) * | 2004-10-05 | 2011-04-27 | 東洋紡績株式会社 | 膜厚測定装置 |
US7408641B1 (en) | 2005-02-14 | 2008-08-05 | Kla-Tencor Technologies Corp. | Measurement systems configured to perform measurements of a specimen and illumination subsystems configured to provide illumination for a measurement system |
CN103424078B (zh) * | 2012-05-15 | 2016-03-23 | 无锡华润上华科技有限公司 | 膜厚仪 |
CN113776443B (zh) * | 2021-10-09 | 2024-08-20 | 深圳市国科光谱技术有限公司 | 一种柔性自动调节测试膜厚的专用治具 |
CN115014259B (zh) * | 2022-06-17 | 2023-01-31 | 青岛朗夫科技股份有限公司 | 一种食品级聚乙烯膜袋厚度测定装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825243A (ja) * | 1981-08-07 | 1983-02-15 | Hitachi Ltd | 半導体ウェーハ処理方法 |
JPH07111995B2 (ja) * | 1987-09-02 | 1995-11-29 | 東京エレクトロン株式会社 | プローブ装置 |
JPH01313704A (ja) * | 1988-06-14 | 1989-12-19 | Hamamatsu Photonics Kk | 膜厚測定装置 |
US5393624A (en) * | 1988-07-29 | 1995-02-28 | Tokyo Electron Limited | Method and apparatus for manufacturing a semiconductor device |
JPH04206547A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 装置間搬送方法 |
JPH04302420A (ja) * | 1991-03-29 | 1992-10-26 | Nec Corp | 半導体基板処理装置および半導体基板処理方法 |
-
1996
- 1996-09-06 JP JP25783496A patent/JP3656337B2/ja not_active Expired - Fee Related
-
1997
- 1997-09-03 US US08/922,756 patent/US5818596A/en not_active Expired - Fee Related
- 1997-09-05 KR KR1019970045908A patent/KR100479986B1/ko not_active IP Right Cessation
- 1997-09-05 TW TW088204235U patent/TW430116U/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW430116U (en) | 2001-04-11 |
JP3656337B2 (ja) | 2005-06-08 |
JPH1082631A (ja) | 1998-03-31 |
US5818596A (en) | 1998-10-06 |
KR100479986B1 (ko) | 2005-07-28 |
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