KR19980015055U - Reel Tape for Semiconductor Package Packaging - Google Patents
Reel Tape for Semiconductor Package Packaging Download PDFInfo
- Publication number
- KR19980015055U KR19980015055U KR2019960028260U KR19960028260U KR19980015055U KR 19980015055 U KR19980015055 U KR 19980015055U KR 2019960028260 U KR2019960028260 U KR 2019960028260U KR 19960028260 U KR19960028260 U KR 19960028260U KR 19980015055 U KR19980015055 U KR 19980015055U
- Authority
- KR
- South Korea
- Prior art keywords
- tape
- coupling
- packaging
- reel
- semiconductor package
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 230000008878 coupling Effects 0.000 claims abstract description 30
- 238000010168 coupling process Methods 0.000 claims abstract description 30
- 238000005859 coupling reaction Methods 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012050 conventional carrier Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Abstract
본 고안은 반도체 패키지 포장용 릴 테이프에 관한 것으로, 종래에는 캐리어테이프에 커버테이프를 올려놓고, 실링슈즈로 녹여서 봉인하는 것으로 작업이 까다로운 문제점이 있었다. 본 고안 반도체 패키지 포장용 릴 테이프는 캐리어테이프의 상면 양측 가장자리에 다수개의 결합홈을 등간격으로 형성하고, 커버테이프의 하면에 상기 결합홈에 결합시키기 위한 다수개의 결합돌기를 등간격으로 형성하여, 패키지 포장시 상기 결합홈에 결합돌기를 결합시켜서 포장함으로서, 작업이 용이하고, 결합강도가 일정하여 사용자가 커버테이프의 벗기는 작업을 자동으로 실시할 수 있게 되는 등의 전체적인 제조가 용이해지는 효과가 있다.The present invention relates to a reel tape for packaging a semiconductor package, and in the related art, a cover tape is placed on a carrier tape, melted with a sealing shoe, and sealed to seal a problem. The reel tape for packaging a semiconductor package of the present invention is formed by forming a plurality of coupling grooves at equal intervals on both side edges of the upper surface of the carrier tape, and forming a plurality of coupling protrusions on the bottom surface of the cover tape at equal intervals for the package tape. By packaging by coupling the coupling protrusion to the coupling groove during packaging, the work is easy, and the coupling strength is constant, so that the overall manufacturing, such as the user can automatically perform the peeling operation of the cover tape, there is an effect that becomes easy.
Description
제 1 도는 종래 릴 테이프가 릴에 감겨져 있는 상태를 보인 사시도.1 is a perspective view showing a state in which a conventional reel tape is wound on a reel.
제 2 도는 종래 캐리어테이프를 부분적으로 보인 평면도.2 is a plan view partially showing a conventional carrier tape.
제 3 도는 종래 캐리어테이프에 커버테이프를 부착하는 동작을 보인 종단면도.3 is a longitudinal sectional view showing an operation of attaching a cover tape to a conventional carrier tape.
제 4 도는 본 고안의 릴 테이프에 패키지가 수납된 상태를 보인 종단면도.4 is a longitudinal sectional view showing a state in which a package is accommodated in a reel tape of the present invention.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
12 : 캐리어테이프13 : 결합홈12: carrier tape 13: coupling groove
14 : 커버테이프15 : 결합돌기14: cover tape 15: engaging projection
본 고안은 본도체 패키지 포장용 릴 테이프(REEL TAPE)에 관한 것으로, 특히 작업성이 양호하여 생산성을 향상시키도록 하는데 적합한 반도체 패키지 포장용 릴 테이프에 관한 것이다.The present invention relates to a reel tape for packaging a main conductor package (REEL TAPE), and more particularly to a reel tape for packaging a semiconductor package suitable for improving productivity due to good workability.
패키지를 제조하여 사용자에게 공급하기 위해서는 릴 테이프에 다수개의 패키지를 수납한 상태로 릴에 감아서 사용자에게 공급하게 되는데, 이와 같은 일반적인 종래 반도체 패키지 포장용 릴 테이프가 제1도와 제2도에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.In order to manufacture and supply a package to a user, a plurality of packages are stored on a reel in a state in which a plurality of packages are stored in a reel tape, and a reel tape for packaging a conventional conventional semiconductor package is shown in FIGS. 1 and 2. Bar, briefly described as follows.
제 1 도는 종래 릴 테이프가 릴에 감겨져 있는 상태를 보인 사시도이고, 제 2 도는 종래 캐리어 테이프를 부분적으로 보인 평면도이다.1 is a perspective view showing a state in which a conventional reel tape is wound on a reel, and FIG. 2 is a plan view partially showing a conventional carrier tape.
도시된 바와 같이, 종래에는 릴 테이프(1)가 릴(2)에 감겨져 있는 상태로 사용자에게 공급되도록 되어 있다.As shown, conventionally, the reel tape 1 is supplied to the user while being wound on the reel 2.
그리고, 상기 릴 테이프(1)는 패키지(3)가 수납될 수 있도록 포켓(POCKET)(4a)이 다수개 형성된 캐리어테이프(CARRIER TAPE)(4)와, 그 캐리어 테이프(4)의 상면에 부착되는 커버테이프(COVER TAPE)(5)로 구성되어 있다.The reel tape 1 is attached to a carrier tape 4 in which a plurality of pockets 4a are formed so that the package 3 can be accommodated, and the upper surface of the carrier tape 4. It consists of a cover tape (5).
상기와 같이 구성된 릴 테이프(1)의 캐리어테이프(4)에 형성된 포켓(4a)에 패키지(3)가 수납되면 커버테이프(5)로 봉인하게 된다.When the package 3 is accommodated in the pocket 4a formed on the carrier tape 4 of the reel tape 1 configured as described above, the package 3 is sealed with the cover tape 5.
이때, 봉인은 제3도에 도시된 바와 같이 실링슈즈(SEALING SHOES)(6)로 커버테이프(5)의 상면을 살짝 녹여서 캐리어테이프(4)의 상면에 커버테이프(5)를 접착시키는 것이다.At this time, the seal is to melt the upper surface of the cover tape 5 with a sealing shoe (6) as shown in Figure 3 to adhere the cover tape (5) to the upper surface of the carrier tape (4).
그러나, 상기와 같이 캐리어테이프(4)와 커버테이프(5)의 상호 재질특성, 실링슈즈(6)의 크기, 접착방법, 접착온도, 접착압력, 장비상태 등의 여러 조건에 따라 접착강도가 달라질 수 있으며, 만약에 접착강도가 약하면 커버테이프(5)가 벗겨지면서 패키지(3)의 이탈이 발생하고, 접착강도가 강하면 사용자측에서 자동으로 커버테이프(5)를 벗기는 것이 힘들게 되어 자동작업이 불가능해지는 등의 제조가 까다로운 문제점이 있었다.However, as described above, the adhesive strength varies depending on various conditions such as the material properties of the carrier tape 4 and the cover tape 5, the size of the sealing shoe 6, the bonding method, the bonding temperature, the bonding pressure, and the state of the equipment. If the adhesive strength is weak, the cover tape 5 is peeled off and the package 3 is detached. If the adhesive strength is strong, it is difficult to automatically peel off the cover tape 5 from the user side. There was a problem in that the manufacture of the back.
상기와 같은 문제점을 감안하여 안출한 본 고안의 목적은 제조가 용이한 반도체 패키지 포장용 릴 테이프를 제공함에 있다.The object of the present invention devised in view of the above problems is to provide a reel tape for packaging a semiconductor package easy to manufacture.
상기와 같은 본 고안의 목적을 달성하기 위하여 캐리어테이프의 상면 양측 가장자리에 다수개의 결합홈을 형성하고, 커버테이프의 하면에 상기 결합홈에 결합시키기 위한 다수개의 결합돌기를 형성하여서 구성된 것을 특징으로 하는 반도체 패키지 포장용 릴 테이프가 제공된다.In order to achieve the above object of the present invention, a plurality of coupling grooves are formed on both side edges of the upper surface of the carrier tape, and a plurality of coupling protrusions are formed on the lower surface of the cover tape to couple the coupling grooves. A reel tape for packaging a semiconductor package is provided.
이하, 상기와 같이 구성되는 본 고안 반도체 패키지 포장용 릴 테이프를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to an embodiment of the accompanying drawings, the inventive reel tape for packaging a semiconductor package is configured as follows.
제4도는 본 고안의 릴 테이프에 패키지가 수납된 상태를 보인 종단면도로서, 도시된 바와 같이, 본 고안은 반도체 패키지 포장용 릴 테이프는 패키지(11)를 수납하기 위한 다수개의 포켓(12a)이 형성된 캐리어테이프(12)의 상면 양측 가장자리에 다수개의 결합홈(13)이 등간격으로 형성되고, 상기 캐리어테이프(12)의 상면에 설치되는 커버테이프(14)의 하면에 상기 결합홈(13)에 결합될 수 있도록 다수개의 결합돌기(15)가 등간격으로 형성된다.4 is a longitudinal sectional view showing a state in which a package is accommodated in a reel tape of the present invention. As shown in the present invention, a reel tape for packaging a semiconductor package includes a plurality of pockets 12a for receiving the package 11. A plurality of coupling grooves 13 are formed on both sides of the upper surface of the carrier tape 12 at equal intervals, and the coupling grooves 13 are formed on the lower surface of the cover tape 14 installed on the upper surface of the carrier tape 12. A plurality of coupling protrusions 15 are formed at equal intervals so as to be coupled.
상기와 같이 구성되는 본 고안 반도체 패키지 포장용 릴 테이프는 캐리어테이프(12)에 형성된 포켓(12a)에 패키지(11)를 각각 수납하고, 캐리어테이프(12)의 상면 양측 가장자리에 형성된 결합홈(13)에 커버테이프(14)의 하면에 형성된 결합돌기(15)를 결합하여 포장하고, 이와 같이 포장된 릴 테이프(16)를 릴 (미도시)에 감아서 사용자에게 공급하게 된다.The reel tape for packaging a semiconductor package of the present invention configured as described above includes the packages 11 in the pockets 12a formed on the carrier tape 12, respectively, and the coupling grooves 13 formed on both side edges of the upper surface of the carrier tape 12. Coupling and packaging the engaging projection 15 formed on the lower surface of the cover tape 14, the reel tape 16 is wrapped in a reel (not shown) and supplied to the user.
상기 실시예에서는 일정간격으로 두고 형성된 결합홈(13)에 결합돌기(15)가 결합할 수 있도록 되어 있으나, 꼭 그에 한정하는 것은 아니며 결합홈(13)을 길이방향으로 형성하고, 결합돌기(15)를 길이방향으로 형성하여 결합하도록 구성하여도 무방하다.In the above embodiment, the coupling protrusion 15 may be coupled to the coupling groove 13 formed at a predetermined interval, but the present invention is not limited thereto, and the coupling protrusion 13 is formed in the longitudinal direction, and the coupling protrusion 15 is formed. ) May be formed in the longitudinal direction to be combined.
이상에서 상세히 설명한 바와 같이 본 고안 반도체 패키지 포장용 릴 테이프는 캐리어테이프의 상면 양측 가장자리에 다수개의 결합홈을 등간격으로 형성하고, 커버테이프의 하면에 상기 결합홈에 결합시키기 위한 다수개의 결합돌기를 등간격으로 형성하여, 패키지 포장시 상기 결합홈에 결합돌기를 결합시켜서 포장함으로서, 작업이 용이하고, 결합강도가 일정하여 사용자가 커버테이프의 벗기는 작업을 자동으로 실시할 수 있게 되는 등의 전체적인 제조가 용이해지는 효과가 있다.As described in detail above, the inventive reel tape for packaging a package includes a plurality of coupling grooves formed at equal intervals on both side edges of the upper surface of the carrier tape, and a plurality of coupling protrusions for coupling the coupling grooves to the lower surface of the cover tape. Formed at intervals, by packaging by coupling the coupling projections to the coupling groove when packaging the package, the overall manufacturing is easy, such that the coupling strength is constant so that the user can automatically peel off the cover tape. There is an effect of facilitating.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960028260U KR200148637Y1 (en) | 1996-09-05 | 1996-09-05 | Reel tape for packing semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960028260U KR200148637Y1 (en) | 1996-09-05 | 1996-09-05 | Reel tape for packing semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980015055U true KR19980015055U (en) | 1998-06-25 |
| KR200148637Y1 KR200148637Y1 (en) | 1999-06-15 |
Family
ID=19466216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960028260U KR200148637Y1 (en) | 1996-09-05 | 1996-09-05 | Reel tape for packing semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200148637Y1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980078228A (en) * | 1997-04-25 | 1998-11-16 | 윤종용 | Carrier and carrier tape for packaging semiconductor chip package using same |
| KR101257904B1 (en) * | 2010-12-22 | 2013-04-24 | 주식회사 루셈 | Carrier Tape for LED Package |
-
1996
- 1996-09-05 KR KR2019960028260U patent/KR200148637Y1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980078228A (en) * | 1997-04-25 | 1998-11-16 | 윤종용 | Carrier and carrier tape for packaging semiconductor chip package using same |
| KR101257904B1 (en) * | 2010-12-22 | 2013-04-24 | 주식회사 루셈 | Carrier Tape for LED Package |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200148637Y1 (en) | 1999-06-15 |
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