JPS5720443A - Container for small thin piece - Google Patents

Container for small thin piece

Info

Publication number
JPS5720443A
JPS5720443A JP9534480A JP9534480A JPS5720443A JP S5720443 A JPS5720443 A JP S5720443A JP 9534480 A JP9534480 A JP 9534480A JP 9534480 A JP9534480 A JP 9534480A JP S5720443 A JPS5720443 A JP S5720443A
Authority
JP
Japan
Prior art keywords
container
chip
chips
cover
thin piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9534480A
Other languages
Japanese (ja)
Inventor
Aiichiro Nara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9534480A priority Critical patent/JPS5720443A/en
Publication of JPS5720443A publication Critical patent/JPS5720443A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To prevent the damage of a chip to be conveyed or the like by covering the upper surface side of a container having a recess for containing a chip with soft resin, and coating a cover via a silk cloth or sponge member from the top of the container, thereby securing the container chip. CONSTITUTION:A covering layer 6 of 1-5mm. of thick made, for example, of silicone resin is formed on a container 1 having a plurality of recesses 1a of the width to which pincers 3 are inserted for containing chips 3, made, for example, of hard resin material. Extrafine woven silk cloth 7 and sponge member 8 for fixing the chips 2 are superposed as charge preventing cover on the top of the container 1 for containing the chips 2, and a cover 5 is further coated on the top for stock or transportation. Thus, the chip 2 can be prevented from being damaged or cracked, and the container adapted for GaAs high frequency element chips, etc. can be provided.
JP9534480A 1980-07-10 1980-07-10 Container for small thin piece Pending JPS5720443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9534480A JPS5720443A (en) 1980-07-10 1980-07-10 Container for small thin piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9534480A JPS5720443A (en) 1980-07-10 1980-07-10 Container for small thin piece

Publications (1)

Publication Number Publication Date
JPS5720443A true JPS5720443A (en) 1982-02-02

Family

ID=14135059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9534480A Pending JPS5720443A (en) 1980-07-10 1980-07-10 Container for small thin piece

Country Status (1)

Country Link
JP (1) JPS5720443A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5622806A (en) * 1979-08-03 1981-03-04 Harumoto Iron Works Protection of bridge cable
JPS5984010U (en) * 1983-02-18 1984-06-06 山田　邦光 Sheath assembly material for tension material
JPS5998974A (en) * 1982-11-29 1984-06-07 山田　邦光 Construction of tension material
JPS59173405A (en) * 1983-03-19 1984-10-01 オリエンタル建設株式会社 Protection of cable for bridge
US4569708A (en) * 1984-07-16 1986-02-11 Shinko Kosen Kogyo Kabushiki Kaisha Method for covering cables with sheaths for corrosion protection and/or aesthetics
JPS62131441U (en) * 1986-02-13 1987-08-19
JPH01142107A (en) * 1987-11-26 1989-06-05 Kajima Corp Method of erecting diagonal brace cable in obliquely stretched bridge

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5622806A (en) * 1979-08-03 1981-03-04 Harumoto Iron Works Protection of bridge cable
JPS5998974A (en) * 1982-11-29 1984-06-07 山田　邦光 Construction of tension material
JPH048561B2 (en) * 1982-11-29 1992-02-17
JPS5984010U (en) * 1983-02-18 1984-06-06 山田　邦光 Sheath assembly material for tension material
JPH0333766Y2 (en) * 1983-02-18 1991-07-17
JPS59173405A (en) * 1983-03-19 1984-10-01 オリエンタル建設株式会社 Protection of cable for bridge
JPH0222804B2 (en) * 1983-03-19 1990-05-21 Oriental Concrete Co
US4569708A (en) * 1984-07-16 1986-02-11 Shinko Kosen Kogyo Kabushiki Kaisha Method for covering cables with sheaths for corrosion protection and/or aesthetics
JPS62131441U (en) * 1986-02-13 1987-08-19
JPH01142107A (en) * 1987-11-26 1989-06-05 Kajima Corp Method of erecting diagonal brace cable in obliquely stretched bridge

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