KR102938636B1 - 이미지 센서 - Google Patents
이미지 센서Info
- Publication number
- KR102938636B1 KR102938636B1 KR1020210103290A KR20210103290A KR102938636B1 KR 102938636 B1 KR102938636 B1 KR 102938636B1 KR 1020210103290 A KR1020210103290 A KR 1020210103290A KR 20210103290 A KR20210103290 A KR 20210103290A KR 102938636 B1 KR102938636 B1 KR 102938636B1
- Authority
- KR
- South Korea
- Prior art keywords
- photoelectric conversion
- pattern
- conversion region
- substrate
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
- H10F39/80373—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the gate of the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210103290A KR102938636B1 (ko) | 2021-08-05 | 2021-08-05 | 이미지 센서 |
| US17/735,605 US12148780B2 (en) | 2021-08-05 | 2022-05-03 | Image sensor |
| CN202210556606.8A CN115706121A (zh) | 2021-08-05 | 2022-05-19 | 图像传感器 |
| CN202411366097.8A CN119384054A (zh) | 2021-08-05 | 2022-05-19 | 图像传感器 |
| JP2022119107A JP2023024327A (ja) | 2021-08-05 | 2022-07-26 | イメージセンサー |
| US18/812,624 US20240413183A1 (en) | 2021-08-05 | 2024-08-22 | Image sensor |
| US18/817,453 US20240421170A1 (en) | 2021-08-05 | 2024-08-28 | Image sensor |
| JP2024199324A JP2025038903A (ja) | 2021-08-05 | 2024-11-14 | イメージセンサー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210103290A KR102938636B1 (ko) | 2021-08-05 | 2021-08-05 | 이미지 센서 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230021428A KR20230021428A (ko) | 2023-02-14 |
| KR102938636B1 true KR102938636B1 (ko) | 2026-03-12 |
Family
ID=85152176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210103290A Active KR102938636B1 (ko) | 2021-08-05 | 2021-08-05 | 이미지 센서 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US12148780B2 (https=) |
| JP (2) | JP2023024327A (https=) |
| KR (1) | KR102938636B1 (https=) |
| CN (2) | CN119384054A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7235016B2 (ja) * | 2020-07-23 | 2023-03-08 | 株式会社三洋物産 | 遊技機 |
| JP7235017B2 (ja) * | 2020-07-23 | 2023-03-08 | 株式会社三洋物産 | 遊技機 |
| US20240297193A1 (en) * | 2023-03-01 | 2024-09-05 | Visera Technologies Company Limited | Image sensor and method for forming the same |
| KR20240176285A (ko) * | 2023-06-15 | 2024-12-24 | 삼성전자주식회사 | 이미지 센서 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160056200A1 (en) * | 2014-08-19 | 2016-02-25 | Samsung Electronics Co., Ltd. | Unit Pixels for Image Sensors and Pixel Arrays Comprising the Same |
| US20200075644A1 (en) * | 2017-05-12 | 2020-03-05 | Olympus Corporation | Solid-state imaging device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101788124B1 (ko) | 2010-07-07 | 2017-10-20 | 삼성전자 주식회사 | 후면 조사형 이미지 센서 및 그 제조 방법 |
| JP6215246B2 (ja) * | 2014-05-16 | 2017-10-18 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および固体撮像素子の製造方法、並びに電子機器 |
| KR102286109B1 (ko) | 2014-08-05 | 2021-08-04 | 삼성전자주식회사 | 이미지 픽셀, 이를 포함하는 이미지 센서, 및 이를 포함하는 이미지 처리 시스템 |
| KR102435995B1 (ko) | 2015-08-07 | 2022-08-26 | 삼성전자주식회사 | 이미지 센서 및 이를 포함하는 이미지 처리 장치 |
| JP7316764B2 (ja) | 2017-05-29 | 2023-07-28 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
| US10429954B2 (en) | 2017-05-31 | 2019-10-01 | Microsoft Technology Licensing, Llc | Multi-stroke smart ink gesture language |
| WO2019093479A1 (ja) | 2017-11-09 | 2019-05-16 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、および電子機器 |
| JP2019145544A (ja) | 2018-02-16 | 2019-08-29 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子 |
| JP2020013817A (ja) * | 2018-07-13 | 2020-01-23 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および電子機器 |
| KR102636358B1 (ko) * | 2019-01-07 | 2024-02-13 | 삼성전자주식회사 | 이미지 센서 |
| KR102651605B1 (ko) * | 2019-01-11 | 2024-03-27 | 삼성전자주식회사 | 이미지 센서 |
| US11195869B2 (en) | 2019-09-05 | 2021-12-07 | Sony Semiconductor Solutions Corporation | Solid-state imaging device and imaging device with shared circuit elements |
| KR102721028B1 (ko) * | 2019-11-08 | 2024-10-25 | 삼성전자주식회사 | 이미지 센서 |
-
2021
- 2021-08-05 KR KR1020210103290A patent/KR102938636B1/ko active Active
-
2022
- 2022-05-03 US US17/735,605 patent/US12148780B2/en active Active
- 2022-05-19 CN CN202411366097.8A patent/CN119384054A/zh active Pending
- 2022-05-19 CN CN202210556606.8A patent/CN115706121A/zh active Pending
- 2022-07-26 JP JP2022119107A patent/JP2023024327A/ja active Pending
-
2024
- 2024-08-22 US US18/812,624 patent/US20240413183A1/en active Pending
- 2024-08-28 US US18/817,453 patent/US20240421170A1/en active Pending
- 2024-11-14 JP JP2024199324A patent/JP2025038903A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160056200A1 (en) * | 2014-08-19 | 2016-02-25 | Samsung Electronics Co., Ltd. | Unit Pixels for Image Sensors and Pixel Arrays Comprising the Same |
| US20200075644A1 (en) * | 2017-05-12 | 2020-03-05 | Olympus Corporation | Solid-state imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023024327A (ja) | 2023-02-16 |
| US20230044820A1 (en) | 2023-02-09 |
| CN115706121A (zh) | 2023-02-17 |
| US20240421170A1 (en) | 2024-12-19 |
| KR20230021428A (ko) | 2023-02-14 |
| US12148780B2 (en) | 2024-11-19 |
| CN119384054A (zh) | 2025-01-28 |
| JP2025038903A (ja) | 2025-03-19 |
| US20240413183A1 (en) | 2024-12-12 |
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| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
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| D13-X000 | Search requested |
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