KR102914044B1 - 적층 세라믹 콘덴서 및 범프 제조용 페이스트 - Google Patents

적층 세라믹 콘덴서 및 범프 제조용 페이스트

Info

Publication number
KR102914044B1
KR102914044B1 KR1020247014906A KR20247014906A KR102914044B1 KR 102914044 B1 KR102914044 B1 KR 102914044B1 KR 1020247014906 A KR1020247014906 A KR 1020247014906A KR 20247014906 A KR20247014906 A KR 20247014906A KR 102914044 B1 KR102914044 B1 KR 102914044B1
Authority
KR
South Korea
Prior art keywords
bump
electrode layer
ceramic capacitor
bumps
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247014906A
Other languages
English (en)
Korean (ko)
Other versions
KR20240065200A (ko
Inventor
코타 젠자이
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 가부시키가이샤 무라타 세이사쿠쇼
Publication of KR20240065200A publication Critical patent/KR20240065200A/ko
Application granted granted Critical
Publication of KR102914044B1 publication Critical patent/KR102914044B1/ko
Active legal-status Critical Current
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Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020247014906A 2021-11-10 2022-11-08 적층 세라믹 콘덴서 및 범프 제조용 페이스트 Active KR102914044B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021183733 2021-11-10
JPJP-P-2021-183733 2021-11-10
PCT/JP2022/041549 WO2023085265A1 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Publications (2)

Publication Number Publication Date
KR20240065200A KR20240065200A (ko) 2024-05-14
KR102914044B1 true KR102914044B1 (ko) 2026-01-16

Family

ID=86335734

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247014906A Active KR102914044B1 (ko) 2021-11-10 2022-11-08 적층 세라믹 콘덴서 및 범프 제조용 페이스트

Country Status (5)

Country Link
US (1) US20240258029A1 (https=)
JP (1) JP7690995B2 (https=)
KR (1) KR102914044B1 (https=)
CN (1) CN117981021A (https=)
WO (1) WO2023085265A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025163971A1 (ja) * 2024-01-29 2025-08-07 株式会社村田製作所 積層セラミック電子部品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003272957A (ja) * 2002-03-18 2003-09-26 Matsushita Electric Ind Co Ltd 固体電解コンデンサ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947076B2 (ja) * 2009-03-25 2012-06-06 Ｔｄｋ株式会社 電子部品の製造方法
KR20120060868A (ko) * 2010-09-29 2012-06-12 쿄세라 코포레이션 콘덴서
JP6248644B2 (ja) * 2014-01-17 2017-12-20 Tdk株式会社 電子部品
KR101630037B1 (ko) * 2014-05-08 2016-06-13 삼성전기주식회사 적층 세라믹 커패시터, 어레이형 적층 세라믹 커패시터, 그 제조 방법 및 그 실장 기판
CN112908693B (zh) * 2016-12-01 2022-10-21 株式会社村田制作所 芯片型电子部件
JP7214950B2 (ja) * 2017-05-04 2023-01-31 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板
JP6946876B2 (ja) * 2017-09-08 2021-10-13 Tdk株式会社 電子部品及び電子部品装置
KR102473422B1 (ko) * 2017-10-02 2022-12-02 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
US10658118B2 (en) * 2018-02-13 2020-05-19 Samsung Electro-Mechanics Co., Ltd. Electronic component and board having the same
JP7292958B2 (ja) * 2019-04-26 2023-06-19 株式会社村田製作所 電子部品の実装構造体
JP7451103B2 (ja) * 2019-07-31 2024-03-18 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連
JP2022061638A (ja) * 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003272957A (ja) * 2002-03-18 2003-09-26 Matsushita Electric Ind Co Ltd 固体電解コンデンサ

Also Published As

Publication number Publication date
JPWO2023085265A1 (https=) 2023-05-19
WO2023085265A1 (ja) 2023-05-19
JP7690995B2 (ja) 2025-06-11
KR20240065200A (ko) 2024-05-14
US20240258029A1 (en) 2024-08-01
CN117981021A (zh) 2024-05-03

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