JP7690995B2 - 積層セラミックコンデンサ及びバンプ製造用ペースト - Google Patents

積層セラミックコンデンサ及びバンプ製造用ペースト Download PDF

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Publication number
JP7690995B2
JP7690995B2 JP2023559639A JP2023559639A JP7690995B2 JP 7690995 B2 JP7690995 B2 JP 7690995B2 JP 2023559639 A JP2023559639 A JP 2023559639A JP 2023559639 A JP2023559639 A JP 2023559639A JP 7690995 B2 JP7690995 B2 JP 7690995B2
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JP
Japan
Prior art keywords
bump
electrode layer
multilayer ceramic
tin
ceramic capacitor
Prior art date
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JP2023559639A
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English (en)
Japanese (ja)
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JPWO2023085265A1 (https=
JPWO2023085265A5 (https=
Inventor
孝太 善哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of JPWO2023085265A1 publication Critical patent/JPWO2023085265A1/ja
Publication of JPWO2023085265A5 publication Critical patent/JPWO2023085265A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2023559639A 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト Active JP7690995B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021183733 2021-11-10
JP2021183733 2021-11-10
PCT/JP2022/041549 WO2023085265A1 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Publications (3)

Publication Number Publication Date
JPWO2023085265A1 JPWO2023085265A1 (https=) 2023-05-19
JPWO2023085265A5 JPWO2023085265A5 (https=) 2024-07-01
JP7690995B2 true JP7690995B2 (ja) 2025-06-11

Family

ID=86335734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023559639A Active JP7690995B2 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Country Status (5)

Country Link
US (1) US20240258029A1 (https=)
JP (1) JP7690995B2 (https=)
KR (1) KR102914044B1 (https=)
CN (1) CN117981021A (https=)
WO (1) WO2023085265A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025163971A1 (ja) * 2024-01-29 2025-08-07 株式会社村田製作所 積層セラミック電子部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226017A (ja) 2009-03-25 2010-10-07 Tdk Corp 電子部品の製造方法
WO2018101405A1 (ja) 2016-12-01 2018-06-07 株式会社村田製作所 チップ型電子部品
JP2019050278A (ja) 2017-09-08 2019-03-28 Tdk株式会社 電子部品及び電子部品装置
US10566137B2 (en) 2017-10-02 2020-02-18 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same
JP2020181962A (ja) 2019-04-26 2020-11-05 株式会社村田製作所 チップ型電子部品および電子部品の実装構造体
JP2021027054A (ja) 2019-07-31 2021-02-22 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003272957A (ja) * 2002-03-18 2003-09-26 Matsushita Electric Ind Co Ltd 固体電解コンデンサ
KR20120060868A (ko) * 2010-09-29 2012-06-12 쿄세라 코포레이션 콘덴서
JP6248644B2 (ja) * 2014-01-17 2017-12-20 Tdk株式会社 電子部品
KR101630037B1 (ko) * 2014-05-08 2016-06-13 삼성전기주식회사 적층 세라믹 커패시터, 어레이형 적층 세라믹 커패시터, 그 제조 방법 및 그 실장 기판
JP7214950B2 (ja) * 2017-05-04 2023-01-31 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板
US10658118B2 (en) * 2018-02-13 2020-05-19 Samsung Electro-Mechanics Co., Ltd. Electronic component and board having the same
JP2022061638A (ja) * 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226017A (ja) 2009-03-25 2010-10-07 Tdk Corp 電子部品の製造方法
WO2018101405A1 (ja) 2016-12-01 2018-06-07 株式会社村田製作所 チップ型電子部品
JP2019050278A (ja) 2017-09-08 2019-03-28 Tdk株式会社 電子部品及び電子部品装置
US10566137B2 (en) 2017-10-02 2020-02-18 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same
JP2020181962A (ja) 2019-04-26 2020-11-05 株式会社村田製作所 チップ型電子部品および電子部品の実装構造体
JP2021027054A (ja) 2019-07-31 2021-02-22 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連

Also Published As

Publication number Publication date
JPWO2023085265A1 (https=) 2023-05-19
WO2023085265A1 (ja) 2023-05-19
KR102914044B1 (ko) 2026-01-16
KR20240065200A (ko) 2024-05-14
US20240258029A1 (en) 2024-08-01
CN117981021A (zh) 2024-05-03

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