CN117981021A - 层叠陶瓷电容器以及凸块制造用膏剂 - Google Patents

层叠陶瓷电容器以及凸块制造用膏剂 Download PDF

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Publication number
CN117981021A
CN117981021A CN202280064389.9A CN202280064389A CN117981021A CN 117981021 A CN117981021 A CN 117981021A CN 202280064389 A CN202280064389 A CN 202280064389A CN 117981021 A CN117981021 A CN 117981021A
Authority
CN
China
Prior art keywords
bump
ceramic capacitor
region
laminated ceramic
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280064389.9A
Other languages
English (en)
Chinese (zh)
Inventor
善哉孝太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN117981021A publication Critical patent/CN117981021A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202280064389.9A 2021-11-10 2022-11-08 层叠陶瓷电容器以及凸块制造用膏剂 Pending CN117981021A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-183733 2021-11-10
JP2021183733 2021-11-10
PCT/JP2022/041549 WO2023085265A1 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Publications (1)

Publication Number Publication Date
CN117981021A true CN117981021A (zh) 2024-05-03

Family

ID=86335734

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280064389.9A Pending CN117981021A (zh) 2021-11-10 2022-11-08 层叠陶瓷电容器以及凸块制造用膏剂

Country Status (5)

Country Link
US (1) US20240258029A1 (https=)
JP (1) JP7690995B2 (https=)
KR (1) KR102914044B1 (https=)
CN (1) CN117981021A (https=)
WO (1) WO2023085265A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025163971A1 (ja) * 2024-01-29 2025-08-07 株式会社村田製作所 積層セラミック電子部品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003272957A (ja) * 2002-03-18 2003-09-26 Matsushita Electric Ind Co Ltd 固体電解コンデンサ
JP4947076B2 (ja) * 2009-03-25 2012-06-06 Ｔｄｋ株式会社 電子部品の製造方法
KR20120060868A (ko) * 2010-09-29 2012-06-12 쿄세라 코포레이션 콘덴서
JP6248644B2 (ja) * 2014-01-17 2017-12-20 Tdk株式会社 電子部品
KR101630037B1 (ko) * 2014-05-08 2016-06-13 삼성전기주식회사 적층 세라믹 커패시터, 어레이형 적층 세라믹 커패시터, 그 제조 방법 및 그 실장 기판
CN112908693B (zh) * 2016-12-01 2022-10-21 株式会社村田制作所 芯片型电子部件
JP7214950B2 (ja) * 2017-05-04 2023-01-31 サムソン エレクトロ－メカニックス カンパニーリミテッド． 積層型電子部品及びその実装基板
JP6946876B2 (ja) * 2017-09-08 2021-10-13 Tdk株式会社 電子部品及び電子部品装置
KR102473422B1 (ko) * 2017-10-02 2022-12-02 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
US10658118B2 (en) * 2018-02-13 2020-05-19 Samsung Electro-Mechanics Co., Ltd. Electronic component and board having the same
JP7292958B2 (ja) * 2019-04-26 2023-06-19 株式会社村田製作所 電子部品の実装構造体
JP7451103B2 (ja) * 2019-07-31 2024-03-18 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連
JP2022061638A (ja) * 2020-10-07 2022-04-19 株式会社村田製作所 積層セラミックコンデンサ

Also Published As

Publication number Publication date
JPWO2023085265A1 (https=) 2023-05-19
WO2023085265A1 (ja) 2023-05-19
JP7690995B2 (ja) 2025-06-11
KR102914044B1 (ko) 2026-01-16
KR20240065200A (ko) 2024-05-14
US20240258029A1 (en) 2024-08-01

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