KR102897541B1 - 반도체 밀봉 성형용 임시 보호 필름 및 그 제조 방법, 임시 보호 필름 부착 리드 프레임, 임시 보호된 밀봉 성형체, 및 반도체 패키지를 제조하는 방법 - Google Patents

반도체 밀봉 성형용 임시 보호 필름 및 그 제조 방법, 임시 보호 필름 부착 리드 프레임, 임시 보호된 밀봉 성형체, 및 반도체 패키지를 제조하는 방법

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Publication number
KR102897541B1
KR102897541B1 KR1020227034878A KR20227034878A KR102897541B1 KR 102897541 B1 KR102897541 B1 KR 102897541B1 KR 1020227034878 A KR1020227034878 A KR 1020227034878A KR 20227034878 A KR20227034878 A KR 20227034878A KR 102897541 B1 KR102897541 B1 KR 102897541B1
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KR
South Korea
Prior art keywords
protective film
temporary protective
adhesive layer
lead frame
aromatic
Prior art date
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Active
Application number
KR1020227034878A
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English (en)
Korean (ko)
Other versions
KR20220160008A (ko
Inventor
다카히로 구로다
나오키 도모리
도모히로 나고야
Original Assignee
가부시끼가이샤 레조낙
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Publication of KR20220160008A publication Critical patent/KR20220160008A/ko
Application granted granted Critical
Publication of KR102897541B1 publication Critical patent/KR102897541B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H01L21/56—
    • H01L23/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
KR1020227034878A 2020-04-06 2021-04-05 반도체 밀봉 성형용 임시 보호 필름 및 그 제조 방법, 임시 보호 필름 부착 리드 프레임, 임시 보호된 밀봉 성형체, 및 반도체 패키지를 제조하는 방법 Active KR102897541B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-068397 2020-04-06
JP2020068397 2020-04-06
PCT/JP2021/014555 WO2021206069A1 (ja) 2020-04-06 2021-04-05 半導体封止成形用仮保護フィルム及びその製造方法、仮保護フィルム付きリードフレーム、仮保護された封止成形体、並びに、半導体パッケージを製造する方法

Publications (2)

Publication Number Publication Date
KR20220160008A KR20220160008A (ko) 2022-12-05
KR102897541B1 true KR102897541B1 (ko) 2025-12-08

Family

ID=78023257

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227034878A Active KR102897541B1 (ko) 2020-04-06 2021-04-05 반도체 밀봉 성형용 임시 보호 필름 및 그 제조 방법, 임시 보호 필름 부착 리드 프레임, 임시 보호된 밀봉 성형체, 및 반도체 패키지를 제조하는 방법

Country Status (6)

Country Link
US (1) US20230178385A1 (https=)
JP (1) JP7687336B2 (https=)
KR (1) KR102897541B1 (https=)
CN (1) CN115335990B (https=)
TW (1) TWI870576B (https=)
WO (1) WO2021206069A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12031013B2 (en) * 2021-07-19 2024-07-09 Momentive Performance Materials Inc. Silane coupling agents to improve resin adhesion

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103700A (ja) 2006-09-19 2008-05-01 Hitachi Chem Co Ltd 多層ダイボンドシート、半導体用接着フィルム付き半導体装置、半導体装置および半導体装置の製造方法
JP2008277802A (ja) 2007-04-04 2008-11-13 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれらを用いた半導体装置
WO2018207408A1 (ja) * 2017-05-10 2018-11-15 日立化成株式会社 半導体封止成形用仮保護フィルム
WO2019176596A1 (ja) 2018-03-13 2019-09-19 日立化成株式会社 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体、及び半導体装置を製造する方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129473A (ja) 1991-11-06 1993-05-25 Sony Corp 樹脂封止表面実装型半導体装置
JPH1012773A (ja) 1996-06-24 1998-01-16 Matsushita Electron Corp 樹脂封止型半導体装置およびその製造方法
US6700185B1 (en) * 1999-11-10 2004-03-02 Hitachi Chemical Co., Ltd. Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device
TWI245791B (en) * 2000-03-31 2005-12-21 Hitachi Chemical Co Ltd Adhesive films, and semiconductor devices using the same
CN1698200A (zh) * 2003-02-19 2005-11-16 日立化成工业株式会社 半导体用粘着薄膜 ,使用该粘着薄膜的附有粘着薄膜金属板 ,附有该粘着薄膜的配线电路及半导体装置 ,以及半导体装置的制造方法
JP6045773B2 (ja) * 2009-11-26 2016-12-14 日立化成株式会社 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
SG11201805612PA (en) * 2016-02-08 2018-07-30 Toray Industries Resin Composition, Resin Layer, Permanent Adhesive, Adhesive For Temporary Bonding, Laminated Film, Processed Wafer, And Method For Manufacturing Electronic Component Or Semiconductor Device
WO2019176599A1 (ja) * 2018-03-12 2019-09-19 日立化成株式会社 リール体、包装体及び梱包物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008103700A (ja) 2006-09-19 2008-05-01 Hitachi Chem Co Ltd 多層ダイボンドシート、半導体用接着フィルム付き半導体装置、半導体装置および半導体装置の製造方法
JP2008277802A (ja) 2007-04-04 2008-11-13 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれらを用いた半導体装置
WO2018207408A1 (ja) * 2017-05-10 2018-11-15 日立化成株式会社 半導体封止成形用仮保護フィルム
WO2019176596A1 (ja) 2018-03-13 2019-09-19 日立化成株式会社 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体、及び半導体装置を製造する方法

Also Published As

Publication number Publication date
TWI870576B (zh) 2025-01-21
US20230178385A1 (en) 2023-06-08
JP7687336B2 (ja) 2025-06-03
CN115335990B (zh) 2025-07-11
KR20220160008A (ko) 2022-12-05
WO2021206069A1 (ja) 2021-10-14
JPWO2021206069A1 (https=) 2021-10-14
CN115335990A (zh) 2022-11-11
TW202146608A (zh) 2021-12-16

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