CN115335990B - 半导体密封成形用临时保护膜及其制造方法、带有临时保护膜的引线框、被临时保护的密封成形体以及制造半导体封装件的方法 - Google Patents

半导体密封成形用临时保护膜及其制造方法、带有临时保护膜的引线框、被临时保护的密封成形体以及制造半导体封装件的方法 Download PDF

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Publication number
CN115335990B
CN115335990B CN202180024873.4A CN202180024873A CN115335990B CN 115335990 B CN115335990 B CN 115335990B CN 202180024873 A CN202180024873 A CN 202180024873A CN 115335990 B CN115335990 B CN 115335990B
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CN
China
Prior art keywords
protective film
temporary protective
lead frame
sealing
semiconductor
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CN202180024873.4A
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English (en)
Chinese (zh)
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CN115335990A (zh
Inventor
黑田孝博
友利直己
名児耶友宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Resonac Corp
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Showa Denko KK
Resonac Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
CN202180024873.4A 2020-04-06 2021-04-05 半导体密封成形用临时保护膜及其制造方法、带有临时保护膜的引线框、被临时保护的密封成形体以及制造半导体封装件的方法 Active CN115335990B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-068397 2020-04-06
JP2020068397 2020-04-06
PCT/JP2021/014555 WO2021206069A1 (ja) 2020-04-06 2021-04-05 半導体封止成形用仮保護フィルム及びその製造方法、仮保護フィルム付きリードフレーム、仮保護された封止成形体、並びに、半導体パッケージを製造する方法

Publications (2)

Publication Number Publication Date
CN115335990A CN115335990A (zh) 2022-11-11
CN115335990B true CN115335990B (zh) 2025-07-11

Family

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CN202180024873.4A Active CN115335990B (zh) 2020-04-06 2021-04-05 半导体密封成形用临时保护膜及其制造方法、带有临时保护膜的引线框、被临时保护的密封成形体以及制造半导体封装件的方法

Country Status (6)

Country Link
US (1) US20230178385A1 (https=)
JP (1) JP7687336B2 (https=)
KR (1) KR102897541B1 (https=)
CN (1) CN115335990B (https=)
TW (1) TWI870576B (https=)
WO (1) WO2021206069A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12031013B2 (en) * 2021-07-19 2024-07-09 Momentive Performance Materials Inc. Silane coupling agents to improve resin adhesion

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018207408A1 (ja) * 2017-05-10 2018-11-15 日立化成株式会社 半導体封止成形用仮保護フィルム
WO2019176597A1 (ja) * 2018-03-12 2019-09-19 日立化成株式会社 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体及び半導体装置を製造する方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129473A (ja) 1991-11-06 1993-05-25 Sony Corp 樹脂封止表面実装型半導体装置
JPH1012773A (ja) 1996-06-24 1998-01-16 Matsushita Electron Corp 樹脂封止型半導体装置およびその製造方法
US6700185B1 (en) * 1999-11-10 2004-03-02 Hitachi Chemical Co., Ltd. Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device
TWI332521B (en) * 2000-03-31 2010-11-01 Hitachi Chemical Co Ltd Adhesive films for semiconductor
WO2004075293A1 (ja) * 2003-02-19 2004-09-02 Hitachi Chemical Co., Ltd. 半導体用接着フィルム、これを用いた接着フィルム付金属板、接着フィルム付配線回路及び半導体装置並びに半導体装置の製造方法
JP2008103700A (ja) * 2006-09-19 2008-05-01 Hitachi Chem Co Ltd 多層ダイボンドシート、半導体用接着フィルム付き半導体装置、半導体装置および半導体装置の製造方法
JP2008277802A (ja) * 2007-04-04 2008-11-13 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム及びこれらを用いた半導体装置
JP6045773B2 (ja) * 2009-11-26 2016-12-14 日立化成株式会社 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
CN108603028B (zh) * 2016-02-08 2021-05-07 东丽株式会社 树脂组合物、树脂层、临时粘贴粘接剂、层叠膜、晶片加工体及其应用
CN117334646A (zh) * 2018-03-13 2024-01-02 株式会社力森诺科 半导体密封成形用临时保护膜、带有临时保护膜的引线框、带有临时保护膜的密封成形体及制造半导体装置的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018207408A1 (ja) * 2017-05-10 2018-11-15 日立化成株式会社 半導体封止成形用仮保護フィルム
WO2019176597A1 (ja) * 2018-03-12 2019-09-19 日立化成株式会社 半導体封止成形用仮保護フィルム、仮保護フィルム付きリードフレーム、仮保護フィルム付き封止成形体及び半導体装置を製造する方法

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Publication number Publication date
US20230178385A1 (en) 2023-06-08
TWI870576B (zh) 2025-01-21
KR20220160008A (ko) 2022-12-05
WO2021206069A1 (ja) 2021-10-14
TW202146608A (zh) 2021-12-16
CN115335990A (zh) 2022-11-11
KR102897541B1 (ko) 2025-12-08
JPWO2021206069A1 (https=) 2021-10-14
JP7687336B2 (ja) 2025-06-03

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