KR102870073B1 - 화학적-기계적-연마 후 세척용 조성물 - Google Patents

화학적-기계적-연마 후 세척용 조성물

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Publication number
KR102870073B1
KR102870073B1 KR1020187021141A KR20187021141A KR102870073B1 KR 102870073 B1 KR102870073 B1 KR 102870073B1 KR 1020187021141 A KR1020187021141 A KR 1020187021141A KR 20187021141 A KR20187021141 A KR 20187021141A KR 102870073 B1 KR102870073 B1 KR 102870073B1
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KR
South Korea
Prior art keywords
acid
composition
range
cleaning composition
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
KR1020187021141A
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English (en)
Korean (ko)
Other versions
KR20180091928A (ko
Inventor
크리슈티안 데슐라인
막스 지베르트
미하엘 라우터
페터 프시빌스키
율리안 프뢸쓰
안드레아스 클리프
하지 오스만 귀벤즈
레오나르뒤스 뢰니선
뢸프-페터 바우만
터 위 웨이
Original Assignee
바스프 에스이
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Publication of KR20180091928A publication Critical patent/KR20180091928A/ko
Application granted granted Critical
Publication of KR102870073B1 publication Critical patent/KR102870073B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3707—Polyethers, e.g. polyalkyleneoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0026—Low foaming or foam regulating compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3719—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
    • C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/378—(Co)polymerised monomers containing sulfur, e.g. sulfonate
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3784—(Co)polymerised monomers containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H10P52/00—
    • H10P70/15—
    • H10P70/277—
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020187021141A 2015-12-22 2016-12-20 화학적-기계적-연마 후 세척용 조성물 Active KR102870073B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15201910.5 2015-12-22
EP15201910 2015-12-22
PCT/EP2016/081847 WO2017108743A1 (en) 2015-12-22 2016-12-20 Composition for post chemical-mechanical-polishing cleaning

Publications (2)

Publication Number Publication Date
KR20180091928A KR20180091928A (ko) 2018-08-16
KR102870073B1 true KR102870073B1 (ko) 2025-10-13

Family

ID=55023982

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187021141A Active KR102870073B1 (ko) 2015-12-22 2016-12-20 화학적-기계적-연마 후 세척용 조성물

Country Status (8)

Country Link
US (1) US10844325B2 (enExample)
EP (1) EP3394234B1 (enExample)
JP (1) JP6949846B2 (enExample)
KR (1) KR102870073B1 (enExample)
CN (1) CN108473918B (enExample)
SG (1) SG11201804637UA (enExample)
TW (1) TWI794152B (enExample)
WO (1) WO2017108743A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017108748A2 (en) * 2015-12-22 2017-06-29 Basf Se Composition for post chemical-mechanical-polishing cleaning
CN111386139A (zh) * 2017-11-29 2020-07-07 巴斯夫欧洲公司 定型人发的方法
CN109576090A (zh) * 2018-12-13 2019-04-05 中国科学院上海光学精密机械研究所 氧化物光学元件化学机械抛光后残留物清洗剂及其制备方法
WO2021188766A1 (en) * 2020-03-19 2021-09-23 Fujifilm Electronic Materials U.S.A., Inc. Cleaning compositions and methods of use thereof
JP2022144640A (ja) * 2021-03-19 2022-10-03 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 基板処理液、これを用いる基板の製造方法およびデバイスの製造方法
CA3213769A1 (en) 2021-04-01 2022-10-06 Sterilex, Llc Quat-free powdered disinfectant/sanitizer
US20250305152A1 (en) 2022-05-31 2025-10-02 Basf Se Composition, its use and a process for cleaning substrates comprising cobalt and copper
WO2024260813A1 (en) 2023-06-20 2024-12-26 Basf Se Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper
WO2024260812A1 (en) 2023-06-20 2024-12-26 Basf Se Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090239777A1 (en) * 2006-09-21 2009-09-24 Advanced Technology Materials, Inc. Antioxidants for post-cmp cleaning formulations

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US3907985A (en) * 1973-07-27 1975-09-23 Burton Parsons And Company Inc Polystyrene sulfonate containing opthalmic solutions
WO1995016767A1 (en) * 1993-12-14 1995-06-22 The Procter & Gamble Company Liquid laundry detergents containing polyamino acid and polyalkylene glycol
JP4832690B2 (ja) * 1999-08-24 2011-12-07 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 絶縁体及び金属のｃｍｐ用組成物及びそれに関する方法
WO2008023215A1 (en) 2006-08-23 2008-02-28 Freescale Semiconductor, Inc. Post chemical mechanical polishing rinse formulation
JP4777197B2 (ja) 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
CN101720352B (zh) * 2007-05-17 2015-11-25 安格斯公司 用于cpm后清除配方的新抗氧化剂
CA2692254C (en) 2007-08-28 2013-12-31 Ecolab Inc. Paste-like detergent formulation comprising branched alkoxylated fatty alcohols as non-ionic surfactants
US20090056744A1 (en) 2007-08-29 2009-03-05 Micron Technology, Inc. Wafer cleaning compositions and methods
JP2009069505A (ja) 2007-09-13 2009-04-02 Tosoh Corp レジスト除去用洗浄液及び洗浄方法
JP6014985B2 (ja) * 2010-10-01 2016-10-26 三菱化学株式会社 半導体デバイス用基板洗浄液及び洗浄方法
KR102105381B1 (ko) * 2012-02-15 2020-04-29 엔테그리스, 아이엔씨. 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
EP3022280B1 (en) * 2013-07-19 2019-01-02 Ecolab USA Inc. Mild alkaline solid instrument cleaner
KR102040050B1 (ko) * 2013-08-02 2019-11-05 동우 화인켐 주식회사 웨이퍼 다이싱용 세정제 조성물
JP2015181079A (ja) * 2014-03-05 2015-10-15 三洋化成工業株式会社 磁気ディスク基板用洗浄剤組成物

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US20090239777A1 (en) * 2006-09-21 2009-09-24 Advanced Technology Materials, Inc. Antioxidants for post-cmp cleaning formulations

Also Published As

Publication number Publication date
US10844325B2 (en) 2020-11-24
CN108473918A (zh) 2018-08-31
TWI794152B (zh) 2023-03-01
EP3394234B1 (en) 2019-10-09
JP6949846B2 (ja) 2021-10-13
TW201732026A (zh) 2017-09-16
SG11201804637UA (en) 2018-07-30
KR20180091928A (ko) 2018-08-16
CN108473918B (zh) 2021-11-30
JP2019502803A (ja) 2019-01-31
EP3394234A1 (en) 2018-10-31
WO2017108743A1 (en) 2017-06-29
US20180371371A1 (en) 2018-12-27

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