CN108473918B - 用于化学机械抛光后清洁的组合物 - Google Patents

用于化学机械抛光后清洁的组合物 Download PDF

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Publication number
CN108473918B
CN108473918B CN201680075224.6A CN201680075224A CN108473918B CN 108473918 B CN108473918 B CN 108473918B CN 201680075224 A CN201680075224 A CN 201680075224A CN 108473918 B CN108473918 B CN 108473918B
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China
Prior art keywords
composition
use according
range
acid
cleaning
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CN201680075224.6A
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Chinese (zh)
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CN108473918A (zh
Inventor
C·达施莱茵
M·西伯特
M·劳特尔
P·普日贝尔斯基
J·普罗尔斯
A·克里普
H·O·格文茨
L·勒尼森
R-P·鲍曼
魏得育
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BASF SE
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BASF SE
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3707—Polyethers, e.g. polyalkyleneoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0026—Low foaming or foam regulating compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3719—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
    • C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/378—(Co)polymerised monomers containing sulfur, e.g. sulfonate
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3784—(Co)polymerised monomers containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • H10P52/00—
    • H10P70/15—
    • H10P70/277—
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201680075224.6A 2015-12-22 2016-12-20 用于化学机械抛光后清洁的组合物 Active CN108473918B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15201910.5 2015-12-22
EP15201910 2015-12-22
PCT/EP2016/081847 WO2017108743A1 (en) 2015-12-22 2016-12-20 Composition for post chemical-mechanical-polishing cleaning

Publications (2)

Publication Number Publication Date
CN108473918A CN108473918A (zh) 2018-08-31
CN108473918B true CN108473918B (zh) 2021-11-30

Family

ID=55023982

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680075224.6A Active CN108473918B (zh) 2015-12-22 2016-12-20 用于化学机械抛光后清洁的组合物

Country Status (8)

Country Link
US (1) US10844325B2 (enExample)
EP (1) EP3394234B1 (enExample)
JP (1) JP6949846B2 (enExample)
KR (1) KR102870073B1 (enExample)
CN (1) CN108473918B (enExample)
SG (1) SG11201804637UA (enExample)
TW (1) TWI794152B (enExample)
WO (1) WO2017108743A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017108748A2 (en) * 2015-12-22 2017-06-29 Basf Se Composition for post chemical-mechanical-polishing cleaning
CN111386139A (zh) * 2017-11-29 2020-07-07 巴斯夫欧洲公司 定型人发的方法
CN109576090A (zh) * 2018-12-13 2019-04-05 中国科学院上海光学精密机械研究所 氧化物光学元件化学机械抛光后残留物清洗剂及其制备方法
WO2021188766A1 (en) * 2020-03-19 2021-09-23 Fujifilm Electronic Materials U.S.A., Inc. Cleaning compositions and methods of use thereof
JP2022144640A (ja) * 2021-03-19 2022-10-03 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 基板処理液、これを用いる基板の製造方法およびデバイスの製造方法
CA3213769A1 (en) 2021-04-01 2022-10-06 Sterilex, Llc Quat-free powdered disinfectant/sanitizer
US20250305152A1 (en) 2022-05-31 2025-10-02 Basf Se Composition, its use and a process for cleaning substrates comprising cobalt and copper
WO2024260813A1 (en) 2023-06-20 2024-12-26 Basf Se Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper
WO2024260812A1 (en) 2023-06-20 2024-12-26 Basf Se Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3907985A (en) * 1973-07-27 1975-09-23 Burton Parsons And Company Inc Polystyrene sulfonate containing opthalmic solutions
US5595681A (en) * 1993-12-14 1997-01-21 The Procter & Gamble Company Liquid laundry detergents containing polyamino acid and polyalkyleneglycol

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4832690B2 (ja) * 1999-08-24 2011-12-07 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 絶縁体及び金属のｃｍｐ用組成物及びそれに関する方法
WO2008023215A1 (en) 2006-08-23 2008-02-28 Freescale Semiconductor, Inc. Post chemical mechanical polishing rinse formulation
JP4777197B2 (ja) 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
US8685909B2 (en) * 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
CN101720352B (zh) * 2007-05-17 2015-11-25 安格斯公司 用于cpm后清除配方的新抗氧化剂
CA2692254C (en) 2007-08-28 2013-12-31 Ecolab Inc. Paste-like detergent formulation comprising branched alkoxylated fatty alcohols as non-ionic surfactants
US20090056744A1 (en) 2007-08-29 2009-03-05 Micron Technology, Inc. Wafer cleaning compositions and methods
JP2009069505A (ja) 2007-09-13 2009-04-02 Tosoh Corp レジスト除去用洗浄液及び洗浄方法
JP6014985B2 (ja) * 2010-10-01 2016-10-26 三菱化学株式会社 半導体デバイス用基板洗浄液及び洗浄方法
KR102105381B1 (ko) * 2012-02-15 2020-04-29 엔테그리스, 아이엔씨. 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
EP3022280B1 (en) * 2013-07-19 2019-01-02 Ecolab USA Inc. Mild alkaline solid instrument cleaner
KR102040050B1 (ko) * 2013-08-02 2019-11-05 동우 화인켐 주식회사 웨이퍼 다이싱용 세정제 조성물
JP2015181079A (ja) * 2014-03-05 2015-10-15 三洋化成工業株式会社 磁気ディスク基板用洗浄剤組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3907985A (en) * 1973-07-27 1975-09-23 Burton Parsons And Company Inc Polystyrene sulfonate containing opthalmic solutions
US5595681A (en) * 1993-12-14 1997-01-21 The Procter & Gamble Company Liquid laundry detergents containing polyamino acid and polyalkyleneglycol

Also Published As

Publication number Publication date
US10844325B2 (en) 2020-11-24
CN108473918A (zh) 2018-08-31
TWI794152B (zh) 2023-03-01
EP3394234B1 (en) 2019-10-09
JP6949846B2 (ja) 2021-10-13
KR102870073B1 (ko) 2025-10-13
TW201732026A (zh) 2017-09-16
SG11201804637UA (en) 2018-07-30
KR20180091928A (ko) 2018-08-16
JP2019502803A (ja) 2019-01-31
EP3394234A1 (en) 2018-10-31
WO2017108743A1 (en) 2017-06-29
US20180371371A1 (en) 2018-12-27

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