KR102825651B1 - 반도체 나노입자 복합체 분산액, 반도체 나노입자 복합체, 반도체 나노입자 복합체 조성물 및 반도체 나노입자 복합체 경화막 - Google Patents

반도체 나노입자 복합체 분산액, 반도체 나노입자 복합체, 반도체 나노입자 복합체 조성물 및 반도체 나노입자 복합체 경화막 Download PDF

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KR102825651B1
KR102825651B1 KR1020217039052A KR20217039052A KR102825651B1 KR 102825651 B1 KR102825651 B1 KR 102825651B1 KR 1020217039052 A KR1020217039052 A KR 1020217039052A KR 20217039052 A KR20217039052 A KR 20217039052A KR 102825651 B1 KR102825651 B1 KR 102825651B1
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semiconductor nanoparticle
nanoparticle complex
dispersion
ligand
group
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KR20220015399A (ko
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마코토 키도
히로카즈 사사키
타카후미 모리야마
유코 미쯔카
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소에이 가가쿠 고교 가부시키가이샤
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KR1020217039052A 2019-05-31 2020-05-29 반도체 나노입자 복합체 분산액, 반도체 나노입자 복합체, 반도체 나노입자 복합체 조성물 및 반도체 나노입자 복합체 경화막 Active KR102825651B1 (ko)

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KR1020257020640A KR20250096886A (ko) 2019-05-31 2020-05-29 반도체 나노입자 복합체 분산액, 반도체 나노입자 복합체, 반도체 나노입자 복합체 조성물 및 반도체 나노입자 복합체 경화막

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JPJP-P-2019-103240 2019-05-31
JPJP-P-2019-103239 2019-05-31
JP2019103239 2019-05-31
JP2019103240 2019-05-31
PCT/JP2020/021464 WO2020241872A1 (ja) 2019-05-31 2020-05-29 半導体ナノ粒子複合体分散液、半導体ナノ粒子複合体、半導体ナノ粒子複合体組成物および半導体ナノ粒子複合体硬化膜

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KR102825651B1 true KR102825651B1 (ko) 2025-06-26

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KR1020217039052A Active KR102825651B1 (ko) 2019-05-31 2020-05-29 반도체 나노입자 복합체 분산액, 반도체 나노입자 복합체, 반도체 나노입자 복합체 조성물 및 반도체 나노입자 복합체 경화막
KR1020257020640A Pending KR20250096886A (ko) 2019-05-31 2020-05-29 반도체 나노입자 복합체 분산액, 반도체 나노입자 복합체, 반도체 나노입자 복합체 조성물 및 반도체 나노입자 복합체 경화막

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US (1) US12415948B2 (https=)
JP (2) JP7602206B2 (https=)
KR (2) KR102825651B1 (https=)
CN (1) CN113906116A (https=)
TW (2) TWI865536B (https=)
WO (1) WO2020241872A1 (https=)

Citations (1)

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Publication number Priority date Publication date Assignee Title
WO2019008374A1 (en) * 2017-07-05 2019-01-10 Nanoco Technologies Ltd QUANTUM POINT ARCHITECTURES FOR COLOR FILTER APPLICATIONS

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7361516B2 (en) * 2004-09-24 2008-04-22 The United States Of America As Represented By The Secretary Of The Navy Field of modular multifunctional ligands
JP5881045B2 (ja) 2011-10-11 2016-03-09 国立研究開発法人産業技術総合研究所 量子ドット含有チタン化合物及びその製造方法、並びに該量子ドット含有チタン化合物を用いた光電変換素子
JP2015086284A (ja) 2013-10-30 2015-05-07 シャープ株式会社 蛍光体、波長変換部材及び発光装置
CN107849440A (zh) * 2015-07-17 2018-03-27 默克专利股份有限公司 发光粒子、墨水制剂、聚合物组合物、光学器件、其制造及发光粒子的用途
WO2017038487A1 (ja) * 2015-08-31 2017-03-09 富士フイルム株式会社 半導体ナノ粒子、分散液、フィルムおよび半導体ナノ粒子の製造方法
KR20190009763A (ko) * 2016-05-20 2019-01-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 혼합 아민 및 티올 리간드를 갖는 양자점
KR102028969B1 (ko) * 2016-11-15 2019-10-07 동우 화인켐 주식회사 양자점 분산액, 자발광 감광성 수지 조성물, 이를 이용하여 제조된 컬러필터 및 화상표시장치
CN108110144B (zh) * 2016-11-25 2021-11-26 三星电子株式会社 包括量子点的发光器件和显示器件
KR102664513B1 (ko) * 2017-06-05 2024-05-13 소에이 가가쿠 고교 가부시키가이샤 양자 점-수지 농축물 및 프리믹스의 산 안정화
KR102662811B1 (ko) * 2017-06-07 2024-05-02 소에이 가가쿠 고교 가부시키가이샤 수지 필름에서의 향상된 양자 점 신뢰성을 위한 티올화된 친수성 리간드
CN110691836B (zh) * 2017-06-08 2024-02-23 默克专利股份有限公司 包含具有硫醇官能表面配体的半导体发光纳米粒子的组合物
KR102712599B1 (ko) * 2017-10-17 2024-10-02 엘지디스플레이 주식회사 발광체, 이를 포함하는 발광 필름, 발광다이오드 및 발광장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019008374A1 (en) * 2017-07-05 2019-01-10 Nanoco Technologies Ltd QUANTUM POINT ARCHITECTURES FOR COLOR FILTER APPLICATIONS

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US12415948B2 (en) 2025-09-16
KR20220015399A (ko) 2022-02-08
CN113906116A (zh) 2022-01-07
TWI897744B (zh) 2025-09-11
JPWO2020241872A1 (https=) 2020-12-03
KR20250096886A (ko) 2025-06-27
WO2020241872A1 (ja) 2020-12-03
JP2025032144A (ja) 2025-03-11
TW202513462A (zh) 2025-04-01
US20220315834A1 (en) 2022-10-06
JP7602206B2 (ja) 2024-12-18
JP7824584B2 (ja) 2026-03-05
TWI865536B (zh) 2024-12-11
TW202112651A (zh) 2021-04-01

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